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H01L2224/41109
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/41109
outside the semiconductor or solid-state body
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor component and method of manufacture
Patent number
9,905,500
Issue date
Feb 27, 2018
Semiconductor Components Industries, LLC
Balaji Padmanabhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Connector and resin-sealed semiconductor device
Patent number
9,252,086
Issue date
Feb 2, 2016
Fuji Electric Co., Ltd.
Atsushi Maruyama
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
Publication number
20220320032
Publication date
Oct 6, 2022
STMicroelectronics S.r.l.
Agatino Minotti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Leadframe with Clip Bond...
Publication number
20220208686
Publication date
Jun 30, 2022
UTAC Headquarters Pte. Ltd.
Natawat Kasikornrungroj
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
Publication number
20170025336
Publication date
Jan 26, 2017
Semiconductor Components Industries, LLC
Balaji Padmanabhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTOR AND RESIN-SEALED SEMICONDUCTOR DEVICE
Publication number
20130181334
Publication date
Jul 18, 2013
FUJI ELECTRIC CO., LTD
Atsushi MARUYAMA
H01 - BASIC ELECTRIC ELEMENTS