outside the semiconductor or solid-state body

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H01L2224/48483

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48483outside the semiconductor or solid-state body

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Patents Grantslast 30 patents

Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,190,385
- Issue date Nov 17, 2015
- Carsem (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a stacked bump to reduce kirkendall voi...
- Patent number 7,847,398
- Issue date Dec 7, 2010
- Amkor Technology, Inc.
- Seok Ho Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method therefor
- Patent number 7,777,353
- Issue date Aug 17, 2010
- Yamaha Corporation
- Shinya Ohkawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,417,324
- Issue date Aug 26, 2008
- NEC Electronics Corporation
- Tomochika Obiya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHO...
- Publication number 20120224332
- Publication date Sep 6, 2012
- JaEun Yun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20090032947
- Publication date Feb 5, 2009
- Seok Ho Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Plastic Leadless Package with Exposed Metal Die Paddle
- Publication number 20090026594
- Publication date Jan 29, 2009
- Carsem (M) Sdn.Bhd.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD THEREFOR
- Publication number 20080088012
- Publication date Apr 17, 2008
- Yamaha Corporation
- SHINYA OHKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050200015
- Publication date Sep 15, 2005
- NEC Electronics Corporation
- Tomochika Obiya
- H01 - BASIC ELECTRIC ELEMENTS