outside the semiconductor or solid-state body

Follow

Industry

CPC
H01L2224/4048

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4048outside the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...
- Publication number 20140175628
- Publication date Jun 26, 2014
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS