outside the semiconductor or solid-state body

Industry

CPC
H01L2224/48487

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48487outside the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with interconnect and method of...
- Patent number 8,304,921
- Issue date Nov 6, 2012
- Stats Chippac Ltd.
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 8,134,240
- Issue date Mar 13, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,910,472
- Issue date Mar 22, 2011
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a stacked bump to reduce kirkendall voi...
- Patent number 7,847,398
- Issue date Dec 7, 2010
- Amkor Technology, Inc.
- Seok Ho Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wire bonding method
- Patent number 7,808,116
- Issue date Oct 5, 2010
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump formation method and wire bonding method
- Patent number 7,044,357
- Issue date May 16, 2006
- Kabushiki Kaisha Shinkawa
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF...
- Publication number 20110115065
- Publication date May 19, 2011
- Zigmund Ramirez Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20100248470
- Publication date Sep 30, 2010
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20090321927
- Publication date Dec 31, 2009
- Fujitsu Microelectronics Limited
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20090032947
- Publication date Feb 5, 2009
- Seok Ho Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and wire bonding method
- Publication number 20080197510
- Publication date Aug 21, 2008
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20080023831
- Publication date Jan 31, 2008
- FUJITSU LIMITED
- Takao Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump formation method and wire bonding method
- Publication number 20040164128
- Publication date Aug 26, 2004
- KABUSHIKI KAISHA SHINKAWA
- Tatsunari Mii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuit packaging system with interconnect and method of...

Semiconductor device and manufacturing method for the same

Method of manufacturing semiconductor device

Semiconductor device having a stacked bump to reduce kirkendall voi...

Semiconductor device and wire bonding method

Bump formation method and wire bonding method

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECT AND METHOD OF...

Method of manufacturing semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING

Semiconductor device and wire bonding method

Semiconductor device and manufacturing method for the same

Bump formation method and wire bonding method