Oxide

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H01L2924/1067

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1067Oxide

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 11,996,354
- Issue date May 28, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with vertical field effect transist...
- Patent number 11,963,352
- Issue date Apr 16, 2024
- SanDisk Technologies LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,955,398
- Issue date Apr 9, 2024
- Fuji Electric Co., Ltd.
- Eri Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,652,033
- Issue date May 16, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 11,495,509
- Issue date Nov 8, 2022
- Denso Corporation
- Nobuyuki Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,450,623
- Issue date Sep 20, 2022
- Fuji Electric Co., Ltd.
- Hideyo Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,081,433
- Issue date Aug 3, 2021
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and manufacturing method thereof
- Patent number 10,950,588
- Issue date Mar 16, 2021
- Industrial Technology Research Institute
- Cheng-Hung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum compatible fluid sampler
- Patent number 10,639,634
- Issue date May 5, 2020
- GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY O...
- J. Alexander Liddle
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer composite bonding materials and power electronics assemb...
- Patent number 10,381,223
- Issue date Aug 13, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum compatible fluid sampler
- Patent number 10,265,699
- Issue date Apr 23, 2019
- The United States of America, as represented by the Secretary of Commerce
- J. Alexander Liddle
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Resin composition for encapsulation, and semiconductor device
- Patent number 10,262,914
- Issue date Apr 16, 2019
- Sumitomo Bakelite Co., Ltd.
- Katsushi Yamashita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Metallic particle paste, cured product using same, and semiconducto...
- Patent number 10,086,478
- Issue date Oct 2, 2018
- Kabushiki Kaisha Toshiba
- Daisuke Hiratsuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode for low-leakage devices
- Patent number 9,245,941
- Issue date Jan 26, 2016
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deposition of anisotropic dielectric layers orientationally matched...
- Patent number 9,178,011
- Issue date Nov 3, 2015
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method having a step of applying...
- Patent number 6,967,399
- Issue date Nov 22, 2005
- Fujitsu Limited
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method having a step of applying...
- Patent number 6,586,273
- Issue date Jul 1, 2003
- Fujitsu Limited
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER CHIP AND BRIDGE CIRCUIT
- Publication number 20250023452
- Publication date Jan 16, 2025
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Xiaoni XIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240274513
- Publication date Aug 15, 2024
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240243071
- Publication date Jul 18, 2024
- Mitsubishi Electric Corporation
- Shota YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145349
- Publication date May 2, 2024
- DENSO CORPORATION
- TAKAHIRO HIRANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE HAVING MORE EFFICIENT HEAT DISSIPATION A...
- Publication number 20240072030
- Publication date Feb 29, 2024
- ZF Friedrichshafen AG
- Yuji Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20230378038
- Publication date Nov 23, 2023
- Rohm Co., Ltd.
- Masashi HAYASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230245962
- Publication date Aug 3, 2023
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230207541
- Publication date Jun 29, 2023
- FLOSFIA INC.
- Hideaki YANAGIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220320054
- Publication date Oct 6, 2022
- Rohm Co., Ltd.
- Hiroyuki SAKAIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH VERTICAL FIELD EFFECT TRANSIST...
- Publication number 20220068966
- Publication date Mar 3, 2022
- SANDISK TECHNOLOGIES LLC
- Peter Rabkin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220051961
- Publication date Feb 17, 2022
- Fuji Electric Co., Ltd.
- Eri OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220020703
- Publication date Jan 20, 2022
- Fuji Electric Co., Ltd.
- Hideyo NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210343629
- Publication date Nov 4, 2021
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200365497
- Publication date Nov 19, 2020
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASSEMB...
- Publication number 20190164760
- Publication date May 30, 2019
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION
- Publication number 20180366417
- Publication date Dec 20, 2018
- WIN Semiconductors Corp.
- Chang-Hwang HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode for Low-Leakage Devices
- Publication number 20140273427
- Publication date Sep 18, 2014
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition of Anisotropic Dielectric Layers Orientationally Matched...
- Publication number 20140264747
- Publication date Sep 18, 2014
- Intermolecular, Inc.
- Sergey Barabash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method having a step of applying...
- Publication number 20030207574
- Publication date Nov 6, 2003
- FUJITSU LIMITED
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method having a step of applying...
- Publication number 20020070440
- Publication date Jun 13, 2002
- FUJITSU LIMITED
- Yoshitaka Aiba
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Three-dimensional memory device with vertical field effect transist...

Semiconductor device

Semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device

Semiconductor device

Chip package structure and manufacturing method thereof

Vacuum compatible fluid sampler

Multilayer composite bonding materials and power electronics assemb...

Vacuum compatible fluid sampler

Resin composition for encapsulation, and semiconductor device

Metallic particle paste, cured product using same, and semiconducto...

Method for manufacturing semiconductor device, heat insulating load...

Electrode for low-leakage devices

Deposition of anisotropic dielectric layers orientationally matched...

Semiconductor device manufacturing method having a step of applying...

Semiconductor device manufacturing method having a step of applying...

Patents Applicationslast 30 patents

POWER CHIP AND BRIDGE CIRCUIT

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER MODULE HAVING MORE EFFICIENT HEAT DISSIPATION A...

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL MEMORY DEVICE WITH VERTICAL FIELD EFFECT TRANSIST...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MULTILAYER COMPOSITE BONDING MATERIALS AND POWER ELECTRONICS ASSEMB...

STRUCTURE FOR REDUCING COMPOUND SEMICONDUCTOR WAFER DISTORTION

Electrode for Low-Leakage Devices

Deposition of Anisotropic Dielectric Layers Orientationally Matched...

Semiconductor device manufacturing method having a step of applying...

Semiconductor device manufacturing method having a step of applying...