Oxides composed of metals from groups of the periodic table

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H01L2924/053

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/053Oxides composed of metals from groups of the periodic table

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device using micro LED, and manufacturing method therefor
- Patent number 12,183,866
- Issue date Dec 31, 2024
- LG Electronics Inc.
- Hwanjoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,148,716
- Issue date Nov 19, 2024
- Kioxia Corporation
- Takuya Konno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 12,040,293
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical bonding method, package-type electronic component, and hyb...
- Patent number 11,916,038
- Issue date Feb 27, 2024
- Canon Anelva Corporation
- Takayuki Saitoh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Laminate and electronic device
- Patent number 11,798,863
- Issue date Oct 24, 2023
- Sekisui Chemical Co., Ltd.
- Kouji Ashiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for wavelength conversion using layers of different photo...
- Patent number 11,765,477
- Issue date Sep 19, 2023
- Sony Group Corporation
- Atsushi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
- Patent number 11,640,948
- Issue date May 2, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 11,502,050
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 11,495,579
- Issue date Nov 8, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including bonding pads and method of manufactu...
- Patent number 11,380,638
- Issue date Jul 5, 2022
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,164,839
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor, image capturing system, and production method of imag...
- Patent number 11,122,227
- Issue date Sep 14, 2021
- Sony Corporation
- Atsushi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,985,102
- Issue date Apr 20, 2021
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices having a patterned surfa...
- Patent number 10,950,564
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,916,517
- Issue date Feb 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and process
- Patent number 10,867,835
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 10,811,388
- Issue date Oct 20, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protrusion bump pads for bond-on-trace processing
- Patent number 10,804,192
- Issue date Oct 13, 2020
- Taiwan Semiconductor Manufacturing Company
- Yu-Min Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 10,804,153
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,804,237
- Issue date Oct 13, 2020
- Denso Corporation
- Kazuhiko Sugiura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wafer level package structure and wafer level packaging method
- Patent number 10,784,229
- Issue date Sep 22, 2020
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Hailong Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 10,777,522
- Issue date Sep 15, 2020
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 10,707,089
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Grant
Image sensor, image capturing system, and production method of imag...
- Patent number 10,681,292
- Issue date Jun 9, 2020
- Sony Corporation
- Atsushi Toda
- G01 - MEASURING TESTING
Information Patent Grant
Redistribution layer metallic structure and method
- Patent number 10,658,315
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih Wei Bih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH CAPACITANCE HYBRID BONDED CAPACITOR DEVICE
- Publication number 20250201775
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipating Structure and Methods of Forming The Same
- Publication number 20250046667
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Chieh Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20240321820
- Publication date Sep 26, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Mark SCANNELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321792
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...
- Publication number 20240274563
- Publication date Aug 15, 2024
- INFINEON TECHNOLOGIES AG
- Hock Heng CHONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...
- Publication number 20240266320
- Publication date Aug 8, 2024
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE COATING APPARATUS
- Publication number 20240194632
- Publication date Jun 13, 2024
- Woong Chul SHIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240162181
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Sun Jae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES
- Publication number 20240038723
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240021548
- Publication date Jan 18, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Wei-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240006359
- Publication date Jan 4, 2024
- KIOXIA Corporation
- Akira NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
- Publication number 20230412941
- Publication date Dec 21, 2023
- SONY GROUP CORPORATION
- Atsushi TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CON...
- Publication number 20230260956
- Publication date Aug 17, 2023
- SK HYNIX INC.
- Mir IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE
- Publication number 20230230892
- Publication date Jul 20, 2023
- NEXPERIA B.V.
- Regnerus Hermannus Poelma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT
- Publication number 20230075263
- Publication date Mar 9, 2023
- TOKYO ELECTRON LIMITED
- Soo Doo Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20230072507
- Publication date Mar 9, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230062835
- Publication date Mar 2, 2023
- KIOXIA Corporation
- Takuya KONNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...
- Publication number 20230051810
- Publication date Feb 16, 2023
- Canon ANELVA Corporation
- Takayuki SAITOH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20230040454
- Publication date Feb 9, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...
- Publication number 20220384371
- Publication date Dec 1, 2022
- STMicroelectronics S.r.l
- Samuele SCIARRILLO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR
- Publication number 20220367771
- Publication date Nov 17, 2022
- LG ELECTRONICS INC.
- Hwanjoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONT...
- Publication number 20220216244
- Publication date Jul 7, 2022
- ams AG
- Gerhard EILMSTEINER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKA...
- Publication number 20220084966
- Publication date Mar 17, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...
- Publication number 20210377471
- Publication date Dec 2, 2021
- SONY GROUP CORPORATION
- Atsushi TODA
- G01 - MEASURING TESTING
Information Patent Application
MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...
- Publication number 20210202417
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Layer Metallic Structure and Method
- Publication number 20210159196
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Shih Wei BIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20210035954
- Publication date Feb 4, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Oxides composed of metals from groups of the periodic table

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Capacitive coupling in a direct-bonded interface for microelectroni...

Display device using micro LED, and manufacturing method therefor

Semiconductor device

Semiconductor device and method to minimize stress on stack via

Redistribution layer metallic structure and method

Chemical bonding method, package-type electronic component, and hyb...

Laminate and electronic device

Apparatus for wavelength conversion using layers of different photo...

Microelectronic devices and apparatuses having a patterned surface...

Semiconductor device, fabrication method for a semiconductor device...

Redistribution layer metallic structure and method

Capacitive coupling in a direct-bonded interface for microelectroni...

Semiconductor device including bonding pads and method of manufactu...

Dry etch process landing on metal oxide etch stop layer over metal...

Package structure and method of manufacturing the same

Image sensor, image capturing system, and production method of imag...

Semiconductor device, fabrication method for a semiconductor device...

Methods of forming microelectronic devices having a patterned surfa...

Redistribution layer metallic structure and method

Semiconductor packaging structure and process

Capacitive coupling in a direct-bonded interface for microelectroni...

Protrusion bump pads for bond-on-trace processing

Semiconductor device and method to minimize stress on stack via

Semiconductor device

Wafer level package structure and wafer level packaging method

Semiconductor structure and method of manufacturing the same

Bond materials with enhanced plasma resistant characteristics and a...

Dry etch process landing on metal oxide etch stop layer over metal...

Image sensor, image capturing system, and production method of imag...

Redistribution layer metallic structure and method

Patents Applicationslast 30 patents

HIGH CAPACITANCE HYBRID BONDED CAPACITOR DEVICE

INTEGRATED CIRCUIT PACKAGES AND METHODS

Heat Dissipating Structure and Methods of Forming The Same

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

BONDING METHOD

SEMICONDUCTOR PACKAGE

SOLDER STRUCTURE WITH DISRUPTABLE COATING AS SOLDER SPREADING PROTE...

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...

WIRE COATING APPARATUS

SEMICONDUCTOR PACKAGES

CO-PACKAGE FOR QUBITS AND PARAMETRIC JOSEPHSON DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...

SEMICONDUCTOR DEVICE INCLUDING JOINT PORTION BETWEEN CONDUCTIVE CON...

CHIP-SCALE PACKAGE

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

WAFER BONDING METHOD USING SELECTIVE DEPOSITION AND SURFACE TREATMENT

Redistribution Layer Metallic Structure and Method

SEMICONDUCTOR DEVICE

CHEMICAL BONDING METHOD, PACKAGE-TYPE ELECTRONIC COMPONENT, AND HYB...

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYE...

DISPLAY DEVICE USING MICRO LED, AND MANUFACTURING METHOD THEREFOR

ON-CHIP INTEGRATION OF INDIUM TIN OXIDE (ITO) LAYERS FOR OHMIC CONT...

BONDING PAD STRUCTURE, SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR PACKA...

IMAGE SENSOR, IMAGE CAPTURING SYSTEM, AND PRODUCTION METHOD OF IMAG...

MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...

Redistribution Layer Metallic Structure and Method

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...