Oxygen [O]

Industry

CPC
H01L2924/01008

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01008Oxygen [O]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 10,825,804
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 10,354,986
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent bonding of wafers
- Patent number 10,083,933
- Issue date Sep 25, 2018
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a structure by assembling at least two elemen...
- Patent number 9,922,953
- Issue date Mar 20, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Paul Gondcharton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 9,812,434
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 9,679,883
- Issue date Jun 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding using boron and nitrogen based bonding stack
- Patent number 9,640,514
- Issue date May 2, 2017
- GLOBALFOUNDRIES Inc.
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive agent having a polyimide and acid modified rosin
- Patent number 9,591,768
- Issue date Mar 7, 2017
- Toray Industries, Inc.
- Koichi Fujimaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced expansion thermal compression bonding process bond head
- Patent number 9,548,284
- Issue date Jan 17, 2017
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
LIQUID METAL BASED FIRST LEVEL INTERCONNECTS
- Publication number 20240006400
- Publication date Jan 4, 2024
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME
- Publication number 20230058704
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Robert D. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTRUCTED WAFER TO WAFER BONDING USING A PERMANENT BOND WITH LA...
- Publication number 20210183803
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20190006313
- Publication date Jan 3, 2019
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hollow Metal Pillar Packaging Scheme
- Publication number 20180040599
- Publication date Feb 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMEN...
- Publication number 20170025377
- Publication date Jan 26, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Paul GONDCHARTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Configured for Connection to a Board
- Publication number 20160329292
- Publication date Nov 10, 2016
- INFINEON TECHNOLOGIES AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hollow Metal Pillar Packaging Scheme
- Publication number 20160225751
- Publication date Aug 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20160111394
- Publication date Apr 21, 2016
- EV GROUP E. THALLNER GMBH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE AGENT, ADHESIVE FILM, AND SEMICONDUCTOR DEVICE AND METHOD...
- Publication number 20150315436
- Publication date Nov 5, 2015
- TORAY INDUSTRIES, INC.
- Koichi FUJIMARU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD
- Publication number 20150171047
- Publication date Jun 18, 2015
- Intel Corporation
- Pramod Malatkar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD FOR PERMANENT BONDING OF WAFERS
- Publication number 20130299080
- Publication date Nov 14, 2013
- EV Group E. Thallner GmbH
- Thomas Plach
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Hollow metal pillar packaging scheme

Hollow metal pillar packaging scheme

Method for permanent bonding of wafers

Process for producing a structure by assembling at least two elemen...

Hollow metal pillar packaging scheme

Hollow metal pillar packaging scheme

Wafer bonding using boron and nitrogen based bonding stack

Adhesive agent having a polyimide and acid modified rosin

Reduced expansion thermal compression bonding process bond head

Patents Applicationslast 30 patents

LIQUID METAL BASED FIRST LEVEL INTERCONNECTS

PHASE CHANGE INTERCONNECTS AND METHODS FOR FORMING THE SAME

RECONSTRUCTED WAFER TO WAFER BONDING USING A PERMANENT BOND WITH LA...

METHOD FOR PERMANENT BONDING OF WAFERS

Hollow Metal Pillar Packaging Scheme

PROCESS FOR PRODUCING A STRUCTURE BY ASSEMBLING AT LEAST TWO ELEMEN...

Semiconductor Package Configured for Connection to a Board

Hollow Metal Pillar Packaging Scheme

METHOD FOR PERMANENT BONDING OF WAFERS

ADHESIVE AGENT, ADHESIVE FILM, AND SEMICONDUCTOR DEVICE AND METHOD...

REDUCED EXPANSION THERMAL COMPRESSION BONDING PROCESS BOND HEAD

METHOD FOR PERMANENT BONDING OF WAFERS