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Packaging aspects of high-frequency amplifiers
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Packaging aspects of high-frequency amplifiers
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Patents Grants
last 30 patents
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Patent Grant
Die to die high-speed communication without discrete amplifiers bet...
Patent number
12,205,908
Issue date
Jan 21, 2025
Intel Corporation
Telesphor Kamgaing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High performance semiconductor device
Patent number
12,159,817
Issue date
Dec 3, 2024
MACOM Technology Solutions Holdings, Inc.
Sung Chul Joo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
Patent number
12,143,077
Issue date
Nov 12, 2024
Skyworks Solutions, Inc.
Peter J. Zampardi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-frequency module and communication apparatus
Patent number
12,126,370
Issue date
Oct 22, 2024
Murata Manufacturing Co., Ltd.
Isao Takenaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and the method of manufacturing the same
Patent number
12,107,056
Issue date
Oct 1, 2024
Advanced Semiconductor Engineering, Inc.
Ya Fang Chan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package with different types of semiconductor dies attached to a fl...
Patent number
12,080,660
Issue date
Sep 3, 2024
MACOM Technology Solutions Holdings, Inc.
Xikun Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to compensated power detector
Patent number
12,072,358
Issue date
Aug 27, 2024
Skyworks Solutions, Inc.
Adrian John Bergsma
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Power amplification with reduced gain variation
Patent number
12,074,576
Issue date
Aug 27, 2024
Skyworks Solutions, Inc.
Philip John Lehtola
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of additively manufacturing an integrated circuit of an inte...
Patent number
12,027,477
Issue date
Jul 2, 2024
Board of Trustees of Michigan State University
Ioannis Papapolymerou
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Selectively shielded radio frequency modules
Patent number
12,003,025
Issue date
Jun 4, 2024
Skyworks Solutions, Inc.
Hoang Mong Nguyen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Amplifier modules with power transistor die and peripheral ground c...
Patent number
11,990,384
Issue date
May 21, 2024
Elie A. Maalouf
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
Patent number
11,973,033
Issue date
Apr 30, 2024
Skyworks Solutions, Inc.
Yang Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Symmetric layout for high-voltage amplifier
Patent number
11,942,468
Issue date
Mar 26, 2024
Cirrus Logic, Inc.
Aleksey Khenkin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
High ruggedness heterojunction bipolar transistor (HBT)
Patent number
11,929,427
Issue date
Mar 12, 2024
Visual Photonics Epitaxy Co., Ltd.
Chao-Hsing Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device
Patent number
11,869,867
Issue date
Jan 9, 2024
Sumitomo Electric Industries, Ltd.
Taizo Tatsumi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Packaging for RF transistor amplifiers
Patent number
11,837,457
Issue date
Dec 5, 2023
Wolfspeed, Inc.
Basim Noori
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Thermal management in integrated circuit packages
Patent number
11,830,787
Issue date
Nov 28, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor-on-insulator transistor layout for radio frequency po...
Patent number
11,804,435
Issue date
Oct 31, 2023
Skyworks Solutions, Inc.
Yang Liu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Radio frequency transistor amplifiers having widened and/or asymmet...
Patent number
11,791,389
Issue date
Oct 17, 2023
Wolfspeed, Inc.
Kyle Bothe
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Stack assembly for radio-frequency applications
Patent number
11,785,853
Issue date
Oct 10, 2023
Skyworks Solutions, Inc.
Hardik Bhupendra Modi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Thermal management in integrated circuit packages
Patent number
11,784,108
Issue date
Oct 10, 2023
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
11,776,865
Issue date
Oct 3, 2023
Murata Manufacturing Co., Ltd.
Teiji Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit, front-end module, and communication apparatus
Patent number
11,764,172
Issue date
Sep 19, 2023
Murata Manufacturing Co., Ltd.
Hiroshi Nishikawa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
11,728,235
Issue date
Aug 15, 2023
Murata Manufacturing Co., Ltd.
Teiji Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Chip package with antenna element
Patent number
11,705,411
Issue date
Jul 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Ping Chiang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Power amplifier module
Patent number
11,705,875
Issue date
Jul 18, 2023
Murata Manufacturing Co., Ltd.
Shigeki Koya
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
High-frequency module
Patent number
11,699,670
Issue date
Jul 11, 2023
Murata Manufacturing Co., Ltd.
Yoshihito Otsubo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated passive device (IPD) components and a package and proces...
Patent number
11,688,673
Issue date
Jun 27, 2023
Wolfspeed, Inc.
Marvin Marbell
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device
Patent number
11,557,554
Issue date
Jan 17, 2023
Mitsubishi Electric Corporation
Takao Moriwaki
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Compensated power detector
Patent number
11,454,657
Issue date
Sep 27, 2022
Skyworks Solutions, Inc.
Adrian John Bergsma
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND THE METHOD OF MANUFACTURING THE SAME
Publication number
20250029940
Publication date
Jan 23, 2025
Advanced Semiconductor Engineering, Inc.
Ya Fang CHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER AMPLIFIER SYSTEMS INCLUDING CONTROL INTERFACE AND WIRE BOND PAD
Publication number
20250030386
Publication date
Jan 23, 2025
Skyworks Solutions, Inc.
Weimin Sun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-FREQUENCY MODULE
Publication number
20250022817
Publication date
Jan 16, 2025
MURATA MANUFACTURING CO., LTD.
Tetsurou ASHIDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
IC CHIP, RADIO FREQUENCY MODULE, AND COMMUNICATION DEVICE
Publication number
20250015020
Publication date
Jan 9, 2025
MURATA MANUFACTURING CO., LTD.
Atsushi ONO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AMPLIFIER AND MIXER IN A III-V MATERIAL FOR WIDEBAND SUB-TERAHERTZ...
Publication number
20250006667
Publication date
Jan 2, 2025
Intel Corporation
Georgios PANAGOPOULOS
H03 - BASIC ELECTRONIC CIRCUITRY
Information
Patent Application
FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT
Publication number
20240404952
Publication date
Dec 5, 2024
Skyworks Solutions, Inc.
Yang Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...
Publication number
20240379591
Publication date
Nov 14, 2024
Canon Kabushiki Kaisha
TATSUYA MURAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROWAVE INTEGRATED CIRCUIT AND MANUFACTURING METHOD OF THE SAME
Publication number
20240347485
Publication date
Oct 17, 2024
XIAMEN SAN'AN INTEGRATED CIRCUIT CO., LTD.
Shenghou LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEGMENTED TRANSISTOR ACTIVE REGION FOR ENHANCED THERMAL CONDUCTIVITY
Publication number
20240332355
Publication date
Oct 3, 2024
Raytheon Company
Caroline Reilly
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR, RADIO FREQUENCY TRANSISTOR, POWE...
Publication number
20240322029
Publication date
Sep 26, 2024
Huawei Technologies Co., Ltd
Bin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AMPLIFIER MODULES WITH POWER TRANSISTOR DIE AND PERIPHERAL GROUND C...
Publication number
20240282654
Publication date
Aug 22, 2024
NXP USA, Inc.
Elie A. Maalouf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH RUGGEDNESS HETEROJUNCTION BIPOLAR TRANSISTOR (HBT)
Publication number
20240222477
Publication date
Jul 4, 2024
VISUAL PHOTONICS EPITAXY CO., LTD.
Chao-Hsing Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITIVE COUPLING PACKAGE STRUCTURE
Publication number
20240194573
Publication date
Jun 13, 2024
LITE-ON SINGAPORE PTE. LTD.
You-Fa WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS
Publication number
20240171137
Publication date
May 23, 2024
MACOM Technology Solutions Holdings, Inc.
Kwangmo Chris Lim
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
HYBRID CHIP CARRIER PACKAGE
Publication number
20240128170
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Yiqi Tang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
Publication number
20240120289
Publication date
Apr 11, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND METHODS RELATED TO STACK ASSEMBLY
Publication number
20240114794
Publication date
Apr 4, 2024
Skyworks Solutions, Inc.
Hardik Bhupendra MODI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH TH...
Publication number
20240096817
Publication date
Mar 21, 2024
QUALCOMM Incorporated
Ranadeep DUTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MAKING ELECTRONIC PACKAGE
Publication number
20240071991
Publication date
Feb 29, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240063126
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Lin-Chen Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
Publication number
20240030098
Publication date
Jan 25, 2024
Intel Corporation
Feras Eid
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-EFFICIENCY STRUCTURES FOR IMPROVED WIRELESS COMMUNICATIONS
Publication number
20230411314
Publication date
Dec 21, 2023
Akash Systems, Inc.
Paul SAUNIER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, MONOLITHIC MICROWAVE INTEGRATED CIRCUIT, SEMI...
Publication number
20230411315
Publication date
Dec 21, 2023
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
Keita MATSUDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RF PACKAGE AND METHOD OF MANUFACTURE OF AN RF PACKAGE
Publication number
20230402410
Publication date
Dec 14, 2023
NXP B.V.
Mustafa Acar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT, FRONT-END MODULE, AND COMMUNICATION APPARATUS
Publication number
20230387048
Publication date
Nov 30, 2023
Murata Manufacturing Co., Ltd.
Hiroshi NISHIKAWA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WIRING SUBSTRATE AND ELECTRONIC DEVICE
Publication number
20230369180
Publication date
Nov 16, 2023
KYOCERA CORPORATION
Akihiro MAEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER AMPLIFICATION DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230299021
Publication date
Sep 21, 2023
KMW Inc.
Bae Mook JEONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS
Publication number
20230253347
Publication date
Aug 10, 2023
Mitsubishi Electric Corporation
Ko KANAYA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DEVICES AND METHODS RELATED TO COMPENSATED POWER DETECTOR
Publication number
20230110327
Publication date
Apr 13, 2023
Skyworks Solutions, Inc.
Adrian John BERGSMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH-FREQUENCEY PACKAGE, HIGH-FREQUENCY MODULE, AND RADIO WAVE ABSO...
Publication number
20230103894
Publication date
Apr 6, 2023
NEC Corporation
Yuki YOSHIMURA
H01 - BASIC ELECTRIC ELEMENTS