Pads or lands on permanent coating which covers the other conductors

Industry

CPC
H05K2201/09436

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09436Pads or lands on permanent coating which covers the other conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ceramic electronic component
- Patent number 11,647,581
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Shielded electronic component package
- Patent number 11,646,290
- Issue date May 9, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,641,712
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Shielded electronic component package
- Patent number 11,031,366
- Issue date Jun 8, 2021
- Amkor Technology Singapore Pte. Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with ultra fine pitch flip chip bumps
- Patent number 10,779,417
- Issue date Sep 15, 2020
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component
- Patent number 10,729,009
- Issue date Jul 28, 2020
- MURATA MANUFACTURING CO., LTD.
- Yuki Takemori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,600,728
- Issue date Mar 24, 2020
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielded electronic component package
- Patent number 10,424,556
- Issue date Sep 24, 2019
- Amkor Technology, Inc.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Touch panel and junction structure of touch panel and flexible prin...
- Patent number 10,310,643
- Issue date Jun 4, 2019
- Dongwoo Fine-Chem Co., Ltd.
- Han Sub Ryu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Control circuit board and robot control device
- Patent number 10,251,275
- Issue date Apr 2, 2019
- Kawasaki Jukogyo Kabushiki Kaisha
- Yoshiki Santo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device module and manufacturing method thereof
- Patent number 10,219,380
- Issue date Feb 26, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Do Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having polyimide layer
- Patent number 10,211,143
- Issue date Feb 19, 2019
- Intel Corporation
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,014,244
- Issue date Jul 3, 2018
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device for vehicle
- Patent number 9,723,731
- Issue date Aug 1, 2017
- DENSO CORPORATION
- Hiroaki Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,661,750
- Issue date May 23, 2017
- LG Innotek Co., Ltd
- Yun Kyoung Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module and manufacturing method thereof
- Patent number 9,585,260
- Issue date Feb 28, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Hyun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate assembly and display device
- Patent number 9,560,756
- Issue date Jan 31, 2017
- Hefei BOE Optoelectronics Technology Co., Ltd.
- Juncai Ma
- G02 - OPTICS
Information Patent Grant
Display apparatus and method of manufacturing the same
- Patent number 9,491,870
- Issue date Nov 8, 2016
- Samsung Display Co., Ltd.
- Sun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Materials, structures and methods for microelectronic packaging
- Patent number 9,484,277
- Issue date Nov 1, 2016
- Intel Corporation
- Ravindra V. Tanikella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 9,443,788
- Issue date Sep 13, 2016
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and electronic device using the same
- Patent number 9,426,887
- Issue date Aug 23, 2016
- Kyocera Corporation
- Yoshihiro Hosoi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric component module
- Patent number 9,392,695
- Issue date Jul 12, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Min Gi Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit substrate, display device, and wiring substrate
- Patent number 9,148,957
- Issue date Sep 29, 2015
- Sharp Kabushiki Kaisha
- Takashi Matsui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module and method of manufacturing the same
- Patent number 9,137,904
- Issue date Sep 15, 2015
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mount board and electronic device
- Patent number 8,913,398
- Issue date Dec 16, 2014
- NEC Corporation
- Shinji Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a current distribution structure
- Patent number 8,819,933
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Timothy Harrison Daubenspeck
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Materials, structures and methods for microelectronic packaging
- Patent number 8,796,825
- Issue date Aug 5, 2014
- Intel Corporation
- Ravindra V. Tanikella
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 8,766,103
- Issue date Jul 1, 2014
- Taiyo Yuden Co., Ltd.
- Takeo Takahashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal structure, electronic device, and manufacturing method the...
- Patent number 8,642,899
- Issue date Feb 4, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Toshiji Hamatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mount board and electronic device
- Patent number 8,625,296
- Issue date Jan 7, 2014
- NEC Corporation
- Shinji Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20180277471
- Publication date Sep 27, 2018
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrates with Ultra Fine Pitch Flip Chip Bumps
- Publication number 20170374747
- Publication date Dec 28, 2017
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE ASSEMBLY AND DISPLAY DEVICE
- Publication number 20140362542
- Publication date Dec 11, 2014
- BOE TECHNOLOGY GROUP CO., LTD.
- Juncai Ma
- G02 - OPTICS
Information Patent Application
MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING
- Publication number 20140312101
- Publication date Oct 23, 2014
- RAVINDRA V. TANIKELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140262442
- Publication date Sep 18, 2014
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20140146507
- Publication date May 29, 2014
- Samsung Electronics Co., Ltd.
- Jong-Won LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140140019
- Publication date May 22, 2014
- SAMSUNG DISPLAY CO., LTD.
- Sun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNT BOARD AND ELECTRONIC DEVICE
- Publication number 20140003015
- Publication date Jan 2, 2014
- NEC CORPORATION
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND ELECTRONIC DEVICE USING THE SAME
- Publication number 20140000946
- Publication date Jan 2, 2014
- Yoshihiro HOSOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT SUBSTRATE, DISPLAY DEVICE, AND WIRING SUBSTRATE
- Publication number 20130335940
- Publication date Dec 19, 2013
- Sharp Kabushiki Kaisha
- Takashi Matsui
- G02 - OPTICS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20130328214
- Publication date Dec 12, 2013
- DAI NIPPON PRINTING CO., LTD.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130256023
- Publication date Oct 3, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Eung Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20130153282
- Publication date Jun 20, 2013
- MSI COMPUTER(SHENZHEN)CO., LTD.
- Yi-Yen CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20130025926
- Publication date Jan 31, 2013
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD...
- Publication number 20130029458
- Publication date Jan 31, 2013
- Hynix Semiconductor Inc.
- Woong Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE
- Publication number 20120267155
- Publication date Oct 25, 2012
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING
- Publication number 20120181687
- Publication date Jul 19, 2012
- RAVINDRA V. TANIKELLA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120175265
- Publication date Jul 12, 2012
- Unimicron Technology Corp.
- Sao-Hsia Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20120061347
- Publication date Mar 15, 2012
- IBIDEN CO., LTD.
- Satoru KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING CIRCUIT BOARD STRUCTURE
- Publication number 20120060368
- Publication date Mar 15, 2012
- Cheng-Po Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR USING FLEX CIRCUIT TECHNOLOGY TO CREATE AN...
- Publication number 20120037406
- Publication date Feb 16, 2012
- Edwards Lifesciences Corporation
- Kenneth M. Curry
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE
- Publication number 20120006584
- Publication date Jan 12, 2012
- Takashi Matsui
- G02 - OPTICS
Information Patent Application
MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSE...
- Publication number 20110303450
- Publication date Dec 15, 2011
- Fujitsu Limited
- Toru OKADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
MOUNT BOARD AND ELECTRONIC DEVICE
- Publication number 20110242780
- Publication date Oct 6, 2011
- NEC Corporation
- Shinji Watanabe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20110205716
- Publication date Aug 25, 2011
- Hiroyuki Moriwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED...
- Publication number 20110195543
- Publication date Aug 11, 2011
- International Business Machines Corporation
- Virendra R. Jadhav
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE,...
- Publication number 20110174527
- Publication date Jul 21, 2011
- Masayuki Nagamatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of fabricating printed circuit board assembly
- Publication number 20110154661
- Publication date Jun 30, 2011
- Samsung Electronics Co., Ltd.
- Min Young Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20110108982
- Publication date May 12, 2011
- Hynix Semiconductor Inc.
- Seong Cheol Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCUIT SUBSTRATE AND FABRICATING PROCESS THEREOF
- Publication number 20110108313
- Publication date May 12, 2011
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Pads or lands on permanent coating which covers the other conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic electronic component

Shielded electronic component package

Ceramic electronic component

Shielded electronic component package

Substrates with ultra fine pitch flip chip bumps

Ceramic electronic component

Through-hole electrode substrate

Shielded electronic component package

Touch panel and junction structure of touch panel and flexible prin...

Control circuit board and robot control device

Electronic device module and manufacturing method thereof

Semiconductor device having polyimide layer

Through-hole electrode substrate

Electronic device for vehicle

Printed circuit board and method of manufacturing the same

Electronic component module and manufacturing method thereof

Array substrate assembly and display device

Display apparatus and method of manufacturing the same

Materials, structures and methods for microelectronic packaging

Through-hole electrode substrate

Wiring board and electronic device using the same

Electric component module

Electronic circuit substrate, display device, and wiring substrate

Module and method of manufacturing the same

Mount board and electronic device

Method for forming a current distribution structure

Materials, structures and methods for microelectronic packaging

Electronic component

Terminal structure, electronic device, and manufacturing method the...

Mount board and electronic device

Patents Applicationslast 30 patents

THROUGH-HOLE ELECTRODE SUBSTRATE

Substrates with Ultra Fine Pitch Flip Chip Bumps

ARRAY SUBSTRATE ASSEMBLY AND DISPLAY DEVICE

MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING

MODULE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME

MOUNT BOARD AND ELECTRONIC DEVICE

WIRING BOARD AND ELECTRONIC DEVICE USING THE SAME

ELECTRONIC CIRCUIT SUBSTRATE, DISPLAY DEVICE, AND WIRING SUBSTRATE

THROUGH-HOLE ELECTRODE SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

CIRCUIT SUBSTRATE

SUBSTRATE FOR SEMICONDUCTOR PACKAGE HAVING COATING FILM AND METHOD...

CIRCUIT SUBSTRATE

MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING

CIRCUIT BOARD SURFACE STRUCTURE AND FABRICATION METHOD THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

METHOD OF FABRICATING CIRCUIT BOARD STRUCTURE

METHOD AND APPARATUS FOR USING FLEX CIRCUIT TECHNOLOGY TO CREATE AN...

WIRING BOARD AND LIQUID CRYSTAL DISPLAY DEVICE

MOUNTING STRUCTURE, ELECTRONIC COMPONENT, CIRCUIT BOARD, BOARD ASSE...

MOUNT BOARD AND ELECTRONIC DEVICE

CIRCUIT SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED...

ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE,...

Method of fabricating printed circuit board assembly

PRINTED CIRCUIT BOARD

CIRCUIT SUBSTRATE AND FABRICATING PROCESS THEREOF