Palladium [Pd] as principal constituent

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H01L2224/13464

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13464Palladium [Pd] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Polymer layers embedded with metal pads for heat dissipation
- Patent number 11,398,440
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Polymer layers embedded with metal pads for heat dissipation
- Patent number 10,109,605
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic contacts
- Patent number 9,601,468
- Issue date Mar 21, 2017
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic contacts
- Patent number 9,343,389
- Issue date May 17, 2016
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structures for post-passivation interconnect
- Patent number 9,099,420
- Issue date Aug 4, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design for maintaining signal integrity
- Patent number 8,970,001
- Issue date Mar 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low stress conductive polymer bump
- Patent number 7,442,878
- Issue date Oct 28, 2008
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low stress conductive polymer bump
- Patent number 7,170,187
- Issue date Jan 30, 2007
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MISSING BUMP PREVENTION FROM GALVANIC CORROSION BY COPPER BUMP SIDE...
- Publication number 20190206822
- Publication date Jul 4, 2019
- Intel Corporation
- Ji Yong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Layers Embedded with Metal Pads for Heat Dissipation
- Publication number 20190057946
- Publication date Feb 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer Layers Embedded with Metal Pads for Heat Dissipation
- Publication number 20140353819
- Publication date Dec 4, 2014
- Hao-Hsiang Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Guard Ring Design for Maintaining Signal Integrity
- Publication number 20140183690
- Publication date Jul 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mirng-Ji Lii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test Structures for Post-Passivation Interconnect
- Publication number 20140151698
- Publication date Jun 5, 2014
- TAIWAN SEMICONDUCTOR MANUFACTUING COMPANY, LTD.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS CONDUCTIVE POLYMER BUMP
- Publication number 20070084629
- Publication date Apr 19, 2007
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW STRESS CONDUCTIVE POLYMER BUMP
- Publication number 20060043608
- Publication date Mar 2, 2006
- International Business Machines Corporation
- William E. Bernier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Palladium [Pd] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Polymer layers embedded with metal pads for heat dissipation

Sintering materials and attachment methods using same

Polymer layers embedded with metal pads for heat dissipation

Magnetic contacts

Magnetic contacts

Test structures for post-passivation interconnect

Guard ring design for maintaining signal integrity

Low stress conductive polymer bump

Low stress conductive polymer bump

Patents Applicationslast 30 patents

MISSING BUMP PREVENTION FROM GALVANIC CORROSION BY COPPER BUMP SIDE...

Polymer Layers Embedded with Metal Pads for Heat Dissipation

Polymer Layers Embedded with Metal Pads for Heat Dissipation

Guard Ring Design for Maintaining Signal Integrity

Test Structures for Post-Passivation Interconnect

LOW STRESS CONDUCTIVE POLYMER BUMP

LOW STRESS CONDUCTIVE POLYMER BUMP