Palladium (Pd) as principal constituent

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H01L2224/48664

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48664Palladium (Pd) as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, electronic component and method
- Patent number 11,380,612
- Issue date Jul 5, 2022
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including transistor with grading and semic...
- Patent number 10,771,024
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,157,893
- Issue date Dec 18, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with bonding pads and related systems, devi...
- Patent number 10,090,812
- Issue date Oct 2, 2018
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
- Patent number 10,049,994
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adding cap to copper passivation flow for electroless plating
- Patent number 10,026,706
- Issue date Jul 17, 2018
- Texas Instruments Incorporated
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for high-speed signal line
- Patent number 9,972,595
- Issue date May 15, 2018
- Tanaka Denshi Kogyo K.K.
- Yuki Antoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with power amplifier and transmission line...
- Patent number 9,887,668
- Issue date Feb 6, 2018
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Radio frequency integrated circuit module
- Patent number 9,859,231
- Issue date Jan 2, 2018
- Skyworks Solutions, Inc.
- Weimin Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power amplifier modules with harmonic termination circuit and relat...
- Patent number 9,847,755
- Issue date Dec 19, 2017
- Skyworks Solutions, Inc.
- Weimin Sun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package on-package (PoP) structure including stud bulbs
- Patent number 9,812,427
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including tantalum nitride terminated throu...
- Patent number 9,755,592
- Issue date Sep 5, 2017
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and manufacturing method of same
- Patent number 9,704,805
- Issue date Jul 11, 2017
- Renesas Electronics Corporation
- Hisao Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,607,956
- Issue date Mar 28, 2017
- Renesas Electronics Corporation
- Masahiro Matsumoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Package on-Package (PoP) structure including stud bulbs and method
- Patent number 9,502,394
- Issue date Nov 22, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to fabricate a radio frequency integrated circuit
- Patent number 9,472,514
- Issue date Oct 18, 2016
- Skyworks Solutions, Inc.
- Weimin Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,449,937
- Issue date Sep 20, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,406,628
- Issue date Aug 2, 2016
- Renesas Electronics Corporation
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of same
- Patent number 9,343,395
- Issue date May 17, 2016
- Renesas Electronics Corporation
- Hisao Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Localized alloying for improved bond reliability
- Patent number 9,331,050
- Issue date May 3, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip and wires
- Patent number 9,305,876
- Issue date Apr 5, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240006354
- Publication date Jan 4, 2024
- RENESAS ELECTRONICS CORPORATION
- Shota OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
- Publication number 20180308816
- Publication date Oct 25, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Pragnesh R. Vaghela
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20180047709
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...
- Publication number 20170257070
- Publication date Sep 7, 2017
- SKYWORKS SOLUTIONS, INC.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH HARMONIC TERMINATION CIRCUIT AND RELA...
- Publication number 20160380594
- Publication date Dec 29, 2016
- SKYWORKS SOLUTIONS, INC.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...
- Publication number 20160380602
- Publication date Dec 29, 2016
- SKYWORKS SOLUTIONS, INC.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME
- Publication number 20160240484
- Publication date Aug 18, 2016
- RENESAS ELECTRONICS CORPORATION
- Hisao Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140319689
- Publication date Oct 30, 2014
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR HIGH-SPEED SIGNAL LINE
- Publication number 20140302317
- Publication date Oct 9, 2014
- TANAKA DENSHI KOGYO K.K.
- Yuki ANTOKU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140284790
- Publication date Sep 25, 2014
- RENESAS ELECTRONICS CORPORATION
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR REDUCING IMPACT OF HIGH RF LOSS PLATING
- Publication number 20140175629
- Publication date Jun 26, 2014
- SKYWORKS SOLUTIONS, INC.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION
- Publication number 20140179064
- Publication date Jun 26, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew D. Romig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140124911
- Publication date May 8, 2014
- PANASONIC CORPORATION
- TEPPEI IWASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140061669
- Publication date Mar 6, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE INTERCONNECT ASSEMBLIES FOR HIGH TEMPERATURE ELECT...
- Publication number 20140048936
- Publication date Feb 20, 2014
- Kulite Semiconductor Products, Inc.
- Alex Ned
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140048941
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers
- Publication number 20140048958
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME
- Publication number 20140021618
- Publication date Jan 23, 2014
- Hisao SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20140021595
- Publication date Jan 23, 2014
- Takeaki SHIRASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-in-Package for High Heat Dissipation Having Leadframes and...
- Publication number 20130320514
- Publication date Dec 5, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Matthew D. Romig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BON...
- Publication number 20130288475
- Publication date Oct 31, 2013
- Atotech Deutschland GmbH
- Mustafa Özkök
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...
- Publication number 20130242500
- Publication date Sep 19, 2013
- MEGICA Corporation
- Mou-Shiung Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Joint Structure for Substrates and Methods of Forming
- Publication number 20130241083
- Publication date Sep 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF
- Publication number 20130223018
- Publication date Aug 29, 2013
- Tianshui Huatian Technology Co., Ltd.
- Jianyou Xie
- H01 - BASIC ELECTRIC ELEMENTS

Palladium (Pd) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Power amplifier systems with control interface and bias circuit

Semiconductor device, electronic component and method

Semiconductor integrated circuit device

Power amplifier modules including transistor with grading and semic...

Package-on-package (PoP) structure including stud bulbs

Package-on-package (PoP) structure including stud bulbs

Power amplifier modules with bonding pads and related systems, devi...

Semiconductor component support and semiconductor device

Contact pads with sidewall spacers and method of making contact pad...

Adding cap to copper passivation flow for electroless plating

Bonding wire for high-speed signal line

Power amplifier modules with power amplifier and transmission line...

Radio frequency integrated circuit module

Power amplifier modules with harmonic termination circuit and relat...

Package on-package (PoP) structure including stud bulbs

Power amplifier modules including tantalum nitride terminated throu...

Semiconductor device and manufacturing method of same

Thin plastic leadless package with exposed metal die paddle

Integrated circuit chip using top post-passivation technology and b...

Semiconductor device and method of manufacturing the same

Package on-Package (PoP) structure including stud bulbs and method

Methods to fabricate a radio frequency integrated circuit

Semiconductor integrated circuit device

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method of same

Bonding structure of bonding wire

Localized alloying for improved bond reliability

Device including a semiconductor chip and wires

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Package-On-Package (PoP) Structure Including Stud Bulbs

ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING

Package-On-Package (PoP) Structure Including Stud Bulbs

POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...

POWER AMPLIFIER MODULES WITH HARMONIC TERMINATION CIRCUIT AND RELA...

POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

BONDING WIRE FOR HIGH-SPEED SIGNAL LINE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Device Including a Semiconductor Chip and Wires

APPARATUS AND METHODS FOR REDUCING IMPACT OF HIGH RF LOSS PLATING

METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION

SEMICONDUCTOR DEVICE

CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

HIGH TEMPERATURE INTERCONNECT ASSEMBLIES FOR HIGH TEMPERATURE ELECT...

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SAME

SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE

Package-In-Packages and Methods of Formation Thereof

Package-in-Package for High Heat Dissipation Having Leadframes and...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BON...

INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND B...

Joint Structure for Substrates and Methods of Forming

HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF