Palladium [Pd] as principal constituent

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H01L2224/29364

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29364Palladium [Pd] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,173,207
- Issue date Dec 24, 2024
- Celanese Mercury Holdings Inc.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin particles, electrically conductive particles, electrically co...
- Patent number 12,122,885
- Issue date Oct 22, 2024
- Sekisui Chemical Co., Ltd.
- Kouki Ookura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,923,335
- Issue date Mar 5, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solder material and method for die attachment
- Patent number 11,842,974
- Issue date Dec 12, 2023
- Alpha Assembly Solutions Inc.
- Angelo Gulino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,784,154
- Issue date Oct 10, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,710,716
- Issue date Jul 25, 2023
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for attachment and devices produced using the methods
- Patent number 11,699,632
- Issue date Jul 11, 2023
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative compositions for high temperature soldering applications
- Patent number 11,440,142
- Issue date Sep 13, 2022
- Ormet Circuits, Inc.
- Catherine A Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,404,391
- Issue date Aug 2, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- B32 - LAYERED PRODUCTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 11,348,891
- Issue date May 31, 2022
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire interfaces
- Patent number 11,239,195
- Issue date Feb 1, 2022
- Texas Instruments Incorporated
- Sreenivasan Kalyani Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 11,139,265
- Issue date Oct 5, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 10,985,128
- Issue date Apr 20, 2021
- Dexerials Corporation
- Koji Ejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film
- Patent number 10,964,440
- Issue date Mar 30, 2021
- Dexerials Corporation
- Shinichi Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for attachment and devices produced using the methods
- Patent number 10,905,041
- Issue date Jan 26, 2021
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,892,243
- Issue date Jan 12, 2021
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film with conductive particles forming repea...
- Patent number 10,854,571
- Issue date Dec 1, 2020
- Dexerials Corporation
- Yasushi Akutsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and production method of the same
- Patent number 10,849,236
- Issue date Nov 24, 2020
- Dexerials Corporation
- Reiji Tsukao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic electrically conductive film and connection structure
- Patent number 10,847,487
- Issue date Nov 24, 2020
- Dexerials Corporation
- Seiichiro Shinohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic electrically conductive film, method for producing same...
- Patent number 10,832,830
- Issue date Nov 10, 2020
- Dexerials Corporation
- Tomoyuki Ishimatsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 10,825,747
- Issue date Nov 3, 2020
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor device and method for manufacturing power semic...
- Patent number 10,727,167
- Issue date Jul 28, 2020
- Mitsubishi Electric Corporation
- Takayuki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Conductive paste for bonding
- Patent number 10,696,875
- Issue date Jun 30, 2020
- E. I. Du Pont de Nemours and Company
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic electrically conductive film, method for producing same...
- Patent number 10,566,108
- Issue date Feb 18, 2020
- Dexerials Corporation
- Tomoyuki Ishimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and connected structure
- Patent number 10,522,502
- Issue date Dec 31, 2019
- Dexerials Corporation
- Seiichiro Shinohara
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20230118485
- Publication date Apr 20, 2023
- DEXERIALS CORPORATION
- Reiji TSUKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN PARTICLES, ELECTRICALLY CONDUCTIVE PARTICLES, ELECTRICALLY CO...
- Publication number 20230106977
- Publication date Apr 6, 2023
- Sekisui Chemical Co., Ltd
- Kouki OOKURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20220230989
- Publication date Jul 21, 2022
- Nitto Denko Corporation
- Mayu Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS
- Publication number 20210289680
- Publication date Sep 16, 2021
- Alpha Assembly Solutions Inc.
- Monnir Boureghda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20210280548
- Publication date Sep 9, 2021
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE INTERFACES
- Publication number 20200321303
- Publication date Oct 8, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan Kalyani KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20200248040
- Publication date Aug 6, 2020
- DUPONT ELECTRONICS, INC.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT
- Publication number 20200203304
- Publication date Jun 25, 2020
- Alpha Assembly Solutions Inc.
- Angelo GULINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE
- Publication number 20200161268
- Publication date May 21, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE
- Publication number 20200020664
- Publication date Jan 16, 2020
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20190304943
- Publication date Oct 3, 2019
- DEXERIALS CORPORATION
- Koji EJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...
- Publication number 20190237214
- Publication date Aug 1, 2019
- DEXERIALS CORPORATION
- Tomoyuki ISHIMATSU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM
- Publication number 20190096843
- Publication date Mar 28, 2019
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20190096844
- Publication date Mar 28, 2019
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20190067234
- Publication date Feb 28, 2019
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS
- Publication number 20190027667
- Publication date Jan 24, 2019
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE
- Publication number 20180294246
- Publication date Oct 11, 2018
- DEXERIALS CORPORATION
- Seiichiro SHINOHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Conductive Paste For Bonding
- Publication number 20180072923
- Publication date Mar 15, 2018
- E I DU PONT DE NEMOURS AND COMPANY
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Packages and Methods of Fabrication Thereof
- Publication number 20170365539
- Publication date Dec 21, 2017
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170077056
- Publication date Mar 16, 2017
- DEXERIALS CORPORATION
- Reiji TSUKAO
- B32 - LAYERED PRODUCTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20170077055
- Publication date Mar 16, 2017
- DEXERIALS CORPORATION
- Yasushi AKUTSU
- B32 - LAYERED PRODUCTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME
- Publication number 20160345442
- Publication date Nov 24, 2016
- DEXERIALS CORPORATION
- Reiji TSUKAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...
- Publication number 20160148894
- Publication date May 26, 2016
- Henkel IP & Holding GmbH
- Pukun Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20140319684
- Publication date Oct 30, 2014
- Yukie SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...
- Publication number 20140291869
- Publication date Oct 2, 2014
- Kyoung Soo PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...
- Publication number 20140264426
- Publication date Sep 18, 2014
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20140248477
- Publication date Sep 4, 2014
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Modules and Methods of Formation Thereof
- Publication number 20140232015
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140183715
- Publication date Jul 3, 2014
- SUMITOMO BAKELITE CO., LTD.
- Naoya Kanamori
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM
- Publication number 20140159229
- Publication date Jun 12, 2014
- Kyoung Hun SHIN
- H01 - BASIC ELECTRIC ELEMENTS

Palladium [Pd] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing an electronic device

Resin particles, electrically conductive particles, electrically co...

Anisotropic conductive film and connected structure

Solder material and method for die attachment

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Methods for attachment and devices produced using the methods

Alternative compositions for high temperature soldering applications

Anisotropic conductive film and method of producing the same

Sintering materials and attachment methods using same

Anisotropic conductive film and method of producing the same

Nanowire interfaces

Anisotropic conductive film and connected structure

Anisotropic conductive film

Anisotropic conductive film

Methods for attachment and devices produced using the methods

Anisotropic electrically conductive film and connection structure

Anisotropic conductive film with conductive particles forming repea...

Anisotropic conductive film and production method of the same

Anisotropic electrically conductive film and connection structure

Anisotropic electrically conductive film, method for producing same...

Electronic element and electronic device comprising the same

Semiconductor device package and methods of manufacture thereof

Sintering pastes with high metal loading for semiconductor die atta...

Power semiconductor device and method for manufacturing power semic...

Curing a heat-curable material in an embedded curing zone

Conductive paste for bonding

Method for producing a connecting medium on an assembly partner, me...

Anisotropic electrically conductive film, method for producing same...

Anisotropic conductive film and connected structure

Patents Applicationslast 30 patents

ANISOTROPIC CONDUCTIVE FILM

RESIN PARTICLES, ELECTRICALLY CONDUCTIVE PARTICLES, ELECTRICALLY CO...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

METHODS FOR ATTACHMENT AND DEVICES PRODUCED USING THE METHODS

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

NANOWIRE INTERFACES

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

SOLDER MATERIAL AND METHOD FOR DIE ATTACHMENT

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM AND CONNECTION STRUCTURE

ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE

ANISOTROPIC CONDUCTIVE FILM

ANISOTROPIC ELECTRICALLY CONDUCTIVE FILM, METHOD FOR PRODUCING SAME...

ANISOTROPIC CONDUCTIVE FILM

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING APPARATUS

ANISOTROPIC CONDUCTIVE FILM AND CONNECTED STRUCTURE

Conductive Paste For Bonding

Semiconductor Packages and Methods of Fabrication Thereof

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

ANISOTROPIC CONDUCTIVE FILM AND PRODUCTION METHOD OF THE SAME

CONDUCTIVE DIE ATTACH FILM FOR LARGE DIE SEMICONDUCTOR PACKAGES AND...

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE HAVING THE SAME

ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND...

LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...

BUFFER FILM FOR MULTI-CHIP PACKAGING

Semiconductor Modules and Methods of Formation Thereof

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM