Palladium (Pd) as principal constituent

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H01L2224/85464

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85464Palladium (Pd) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for tool mark free stitch bonding
- Patent number 12,142,595
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power amplifier systems with control interface and bias circuit
- Patent number 11,451,199
- Issue date Sep 20, 2022
- Skyworks Solutions, Inc.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 11,024,565
- Issue date Jun 1, 2021
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including transistor with grading and semic...
- Patent number 10,771,024
- Issue date Sep 8, 2020
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,468,370
- Issue date Nov 5, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Power amplifier modules with bonding pads and related systems, devi...
- Patent number 10,090,812
- Issue date Oct 2, 2018
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pads with sidewall spacers and method of making contact pad...
- Patent number 10,049,994
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with power amplifier and transmission line...
- Patent number 9,887,668
- Issue date Feb 6, 2018
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Radio frequency integrated circuit module
- Patent number 9,859,231
- Issue date Jan 2, 2018
- Skyworks Solutions, Inc.
- Weimin Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Power amplifier modules with harmonic termination circuit and relat...
- Patent number 9,847,755
- Issue date Dec 19, 2017
- Skyworks Solutions, Inc.
- Weimin Sun
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Leadframe
- Patent number 9,793,194
- Issue date Oct 17, 2017
- Shinko Electric Industries Co., Ltd.
- Shintaro Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including tantalum nitride terminated throu...
- Patent number 9,755,592
- Issue date Sep 5, 2017
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor lead frame, semiconductor package, and manufacturing...
- Patent number 9,735,106
- Issue date Aug 15, 2017
- SH MATERIALS CO., LTD.
- Kaoru Hishiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules with bifet and harmonic termination and rel...
- Patent number 9,692,357
- Issue date Jun 27, 2017
- Skyworks Solutions, Inc.
- Dinhphuoc Vu Hoang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including wire bond pad and related systems...
- Patent number 9,660,584
- Issue date May 23, 2017
- Skyworks Solutions, Inc.
- Hardik Bhupendra Modi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods of fabricating QFN semiconductor package and metal plate
- Patent number 9,659,842
- Issue date May 23, 2017
- APTOS TECHNOLOGY INC.
- En-min Jow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity package with pre-molded cavity leadframe
- Patent number 9,536,812
- Issue date Jan 3, 2017
- UBOTIC COMPANY LIMITED
- Chun Ho Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including bipolar transistor with grading a...
- Patent number 9,520,835
- Issue date Dec 13, 2016
- Skyworks Solutions, Inc.
- Tin Myint Ko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Power amplifier modules including bipolar transistor with grading a...
- Patent number 9,490,751
- Issue date Nov 8, 2016
- Skyworks Solutions, Inc.
- Tin Myint Ko
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Methods to fabricate a radio frequency integrated circuit
- Patent number 9,472,514
- Issue date Oct 18, 2016
- Skyworks Solutions, Inc.
- Weimin Sun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked synchronous buck converter having chip embedded in outside...
- Patent number 9,425,132
- Issue date Aug 23, 2016
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20240178125
- Publication date May 30, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING
- Publication number 20220199571
- Publication date Jun 23, 2022
- Skyworks Solutions, Inc.
- Aldrin Quinones GARING
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20190237396
- Publication date Aug 1, 2019
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...
- Publication number 20170257070
- Publication date Sep 7, 2017
- SKYWORKS SOLUTIONS, INC.
- Hardik Bhupendra Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
- Publication number 20140374467
- Publication date Dec 25, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140319689
- Publication date Oct 30, 2014
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS...
- Publication number 20140239475
- Publication date Aug 28, 2014
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20140225267
- Publication date Aug 14, 2014
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-SOLDERED LEADLESS PACKAGE
- Publication number 20140211442
- Publication date Jul 31, 2014
- NXP B.V.
- Jan van KEMPEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR REDUCING IMPACT OF HIGH RF LOSS PLATING
- Publication number 20140175629
- Publication date Jun 26, 2014
- SKYWORKS SOLUTIONS, INC.
- Weimin Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION
- Publication number 20140179064
- Publication date Jun 26, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Matthew D. Romig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20140070388
- Publication date Mar 13, 2014
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH TEMPERATURE INTERCONNECT ASSEMBLIES FOR HIGH TEMPERATURE ELECT...
- Publication number 20140048936
- Publication date Feb 20, 2014
- Kulite Semiconductor Products, Inc.
- Alex Ned
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pads with Sidewall Spacers and Method of Making Contact Pad...
- Publication number 20140048941
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE
- Publication number 20140015117
- Publication date Jan 16, 2014
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL LEADLESS ARRAY PACKAGE WITH DIE ATTACH PAD LOCKING FEATURE
- Publication number 20140008777
- Publication date Jan 9, 2014
- UTAC DONGGUAN LTD
- Albert LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-ASSIST MOLDED GEL-FILL CAVITY PACKAGE WITH OVERFLOW RESERVOIR
- Publication number 20140001582
- Publication date Jan 2, 2014
- Shun Meen Kuo
- B60 - VEHICLES IN GENERAL
Information Patent Application
POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...
- Publication number 20140002188
- Publication date Jan 2, 2014
- SKYWORKS SOLUTIONS, INC.
- Howard E. Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT
- Publication number 20130337609
- Publication date Dec 19, 2013
- UTAC Thai Limited
- Somchai Nondhasitthichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Die Attach to a Direct Bonded Aluminum Substrate
- Publication number 20130328204
- Publication date Dec 12, 2013
- IXYS Corporation
- Nathan Zommer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package-in-Package for High Heat Dissipation Having Leadframes and...
- Publication number 20130320514
- Publication date Dec 5, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Matthew D. Romig
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR
- Publication number 20130306352
- Publication date Nov 21, 2013
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Shinichi Terashima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BON...
- Publication number 20130288475
- Publication date Oct 31, 2013
- Atotech Deutschland GmbH
- Mustafa Özkök
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Support Device for a Semiconductor Chip and Optoelectronic Componen...
- Publication number 20130256862
- Publication date Oct 3, 2013
- Osram Opto Semiconductors GmbH
- Thomas Zeiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH LEAD EXTENSIONS AND RELATED METHODS
- Publication number 20130241041
- Publication date Sep 19, 2013
- Lin-Wang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME LAND GRID ARRAY
- Publication number 20130234307
- Publication date Sep 12, 2013
- UTAC Thai Limited
- Somchai Nondhasittichai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF
- Publication number 20130223018
- Publication date Aug 29, 2013
- Tianshui Huatian Technology Co., Ltd.
- Jianyou Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME
- Publication number 20130181335
- Publication date Jul 18, 2013
- Amkor Technology, Inc.
- Byung Hoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...
- Publication number 20130161802
- Publication date Jun 27, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Palladium (Pd) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier modules including semiconductor resistor and tantal...

Apparatus and methods for tool mark free stitch bonding

Power amplifier systems with control interface and bias circuit

Direct selective adhesion promotor plating

Semiconductor integrated circuit device

Power amplifier modules including transistor with grading and semic...

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Light emitting device and light emitting module

Bonding wire for semiconductor device

Power amplifier modules with bonding pads and related systems, devi...

Contact pads with sidewall spacers and method of making contact pad...

Power amplifier modules with power amplifier and transmission line...

Radio frequency integrated circuit module

Power amplifier modules with harmonic termination circuit and relat...

Leadframe

Power amplifier modules including tantalum nitride terminated throu...

Semiconductor lead frame, semiconductor package, and manufacturing...

Power amplifier modules with bifet and harmonic termination and rel...

Power amplifier modules including wire bond pad and related systems...

Methods of fabricating QFN semiconductor package and metal plate

Cavity package with pre-molded cavity leadframe

Power amplifier modules including bipolar transistor with grading a...

Power amplifier modules including bipolar transistor with grading a...

Methods to fabricate a radio frequency integrated circuit

Semiconductor integrated circuit device

Stacked synchronous buck converter having chip embedded in outside...

Patents Applicationslast 30 patents

WIRE BONDED SEMICONDUCTOR DEVICE PACKAGE

APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDING

Direct Selective Adhesion Promotor Plating

POWER AMPLIFIER MODULES WITH BONDING PADS AND RELATED SYSTEMS, DEVI...

CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHODS...

Solderless Die Attach to a Direct Bonded Aluminum Substrate

PRE-SOLDERED LEADLESS PACKAGE

APPARATUS AND METHODS FOR REDUCING IMPACT OF HIGH RF LOSS PLATING

METHOD FOR FABRICATING A PACKAGE-IN-PACKAGE FOR HIGH HEAT DISSIPATION

SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

HIGH TEMPERATURE INTERCONNECT ASSEMBLIES FOR HIGH TEMPERATURE ELECT...

Contact Pads with Sidewall Spacers and Method of Making Contact Pad...

VERY EXTREMELY THIN SEMICONDUCTOR PACKAGE

THERMAL LEADLESS ARRAY PACKAGE WITH DIE ATTACH PAD LOCKING FEATURE

FILM-ASSIST MOLDED GEL-FILL CAVITY PACKAGE WITH OVERFLOW RESERVOIR

POWER AMPLIFIER MODULES INCLUDING RELATED SYSTEMS, DEVICES, AND MET...

LEAD FRAME LAND GRID ARRAY WITH ROUTING CONNECTOR TRACE UNDER UNIT

Solderless Die Attach to a Direct Bonded Aluminum Substrate

Package-in-Package for High Heat Dissipation Having Leadframes and...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

BONDING WIRE FOR SEMICONDUCTOR

METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BON...

Support Device for a Semiconductor Chip and Optoelectronic Componen...

SEMICONDUCTOR PACKAGES WITH LEAD EXTENSIONS AND RELATED METHODS

LEAD FRAME LAND GRID ARRAY

HIGH-DENSITY SIM CARD PACKAGE AND PRODUCTION METHOD THEREOF

LEADFRAME AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME

SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...