Palladium [Pd] as principal constituent

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CPC
H01L2224/13664

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13664Palladium [Pd] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 12,027,483
- Issue date Jul 2, 2024
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,967,577
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,887,952
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a heterogeneous solder joint and method f...
- Patent number 11,682,644
- Issue date Jun 20, 2023
- Infineon Technologies AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip integration module, chip package structure, and chip integrati...
- Patent number 11,462,520
- Issue date Oct 4, 2022
- Huawei Technologies Co., Ltd.
- HuiLi Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 11,424,194
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device encapsulated by molding material attached to r...
- Patent number 11,417,620
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 11,367,658
- Issue date Jun 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a pillar structure having a non-metal sidewall pro...
- Patent number 11,257,714
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,181,704
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,112,570
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device with electroplated pillars
- Patent number 11,094,656
- Issue date Aug 17, 2021
- Texas Instruments Incorporated
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with intermetallic palladium joints and ass...
- Patent number 10,861,825
- Issue date Dec 8, 2020
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,840,212
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of semiconductor devices encapsulated by a molding materi...
- Patent number 10,784,220
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 10,720,360
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 10,598,874
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- G02 - OPTICS
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 10,600,752
- Issue date Mar 24, 2020
- ABLIC Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation and structures formed thereby
- Patent number 10,510,605
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuit (3DIC) with support structures
- Patent number 10,510,684
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) structure including stud bulbs
- Patent number 10,510,731
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding package components through plating
- Patent number 10,483,230
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structures of integrated circuits
- Patent number 10,453,818
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-applying supporting materials between bonded package components
- Patent number 10,366,971
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device and method of manufacturing...
- Patent number 10,354,968
- Issue date Jul 16, 2019
- ABLIC Inc.
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 10,340,226
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with intermetallic palladium joints and ass...
- Patent number 10,256,216
- Issue date Apr 9, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with intermetallic palladium joints and ass...
- Patent number 10,224,313
- Issue date Mar 5, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE AND METHOD FOR POWER METAL LINES
- Publication number 20240379603
- Publication date Nov 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Eiji KUROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240332033
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240304582
- Publication date Sep 12, 2024
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...
- Publication number 20240105655
- Publication date Mar 28, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS
- Publication number 20230123307
- Publication date Apr 20, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384377
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- PEI-HAW TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220157758
- Publication date May 19, 2022
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115347
- Publication date Apr 14, 2022
- Yosui Futamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...
- Publication number 20220005778
- Publication date Jan 6, 2022
- INFINEON TECHNOLOGIES AG
- Swee Kah Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...
- Publication number 20210375816
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Manoj Kumar Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS
- Publication number 20210375808
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20210143131
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Singulation and Structures Formed Thereby
- Publication number 20200350209
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS
- Publication number 20200211990
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Arvin Cedric Quiambao Mallari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Package Components Through Plating
- Publication number 20200020662
- Publication date Jan 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for UBM/RDL Routing
- Publication number 20190393195
- Publication date Dec 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20190333888
- Publication date Oct 31, 2019
- ABLIC Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH INTERMETALLIC PALLADIUM JOINTS AND ASS...
- Publication number 20190237434
- Publication date Aug 1, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
- Publication number 20190131266
- Publication date May 2, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-On-Package (PoP) Structure Including Stud Bulbs
- Publication number 20190123027
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH INTERMETALLIC PALLADIUM JOINTS AND ASS...
- Publication number 20190013296
- Publication date Jan 10, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BUMP
- Publication number 20180366430
- Publication date Dec 20, 2018
- SK HYNIX INC.
- Jun-Hyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Singulation and Structures Formed Thereby
- Publication number 20180330991
- Publication date Nov 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20180286827
- Publication date Oct 4, 2018
- ABLIC Inc.
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180233468
- Publication date Aug 16, 2018
- Toshiba Memory Corporation
- Taku KAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...
- Publication number 20180204825
- Publication date Jul 19, 2018
- Huawei Technologies Co., Ltd
- Huili FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH INTERMETALLIC PALLADIUM JOINTS AND ASS...
- Publication number 20180190620
- Publication date Jul 5, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging Structures of Integrated Circuits
- Publication number 20180151528
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Palladium [Pd] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packaged semiconductor device with electroplated pillars

Semiconductor device and method for manufacturing the same

Semiconductor device encapsulated by molding material attached to r...

Industrial chip scale package for microelectronic device

Semiconductor device with a heterogeneous solder joint and method f...

Chip integration module, chip package structure, and chip integrati...

Three dimensional integrated circuit (3DIC) with support structures

Semiconductor device encapsulated by molding material attached to r...

Semiconductor die singulation and structures formed thereby

Method of making a pillar structure having a non-metal sidewall pro...

Interconnect crack arrestor structure and methods

Fabrication method of high aspect ratio solder bumping with stud bu...

Fabrication method of high aspect ratio solder bumping with stud bu...

Packaged semiconductor device with electroplated pillars

Interconnect structures with intermetallic palladium joints and ass...

Bonding package components through plating

Plurality of semiconductor devices encapsulated by a molding materi...

Semiconductor die singulation and structures formed thereby

Fabrication method of high aspect ratio solder bumping with stud bu...

Resin-encapsulated semiconductor device and method of manufacturing...

Semiconductor die singulation and structures formed thereby

Three dimensional integrated circuit (3DIC) with support structures

Package-on-package (PoP) structure including stud bulbs

Bonding package components through plating

Packaging structures of integrated circuits

Pre-applying supporting materials between bonded package components

Resin-encapsulated semiconductor device and method of manufacturing...

Interconnect crack arrestor structure and methods

Interconnect structures with intermetallic palladium joints and ass...

Interconnect structures with intermetallic palladium joints and ass...

Patents Applicationslast 30 patents

STRUCTURE AND METHOD FOR POWER METAL LINES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

MICROELECTRONIC ASSEMBLIES HAVING A BRIDGE DIE WITH A LINED-INTERCO...

ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH A HETEROGENEOUS SOLDER JOINT AND METHOD F...

IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER METAL IN...

PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS

Device and Method for UBM/RDL Routing

Semiconductor Die Singulation and Structures Formed Thereby

PACKAGED SEMICONDUCTOR DEVICE WITH ELECTROPLATED PILLARS

Bonding Package Components Through Plating

Device and Method for UBM/RDL Routing

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

Interconnect Crack Arrestor Structure and Methods

INTERCONNECT STRUCTURES WITH INTERMETALLIC PALLADIUM JOINTS AND ASS...

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

Package-On-Package (PoP) Structure Including Stud Bulbs

INTERCONNECT STRUCTURES WITH INTERMETALLIC PALLADIUM JOINTS AND ASS...

SEMICONDUCTOR PACKAGE INCLUDING BUMP

Semiconductor Die Singulation and Structures Formed Thereby

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

CHIP INTEGRATION MODULE, CHIP PACKAGE STRUCTURE, AND CHIP INTEGRATI...

INTERCONNECT STRUCTURES WITH INTERMETALLIC PALLADIUM JOINTS AND ASS...

Packaging Structures of Integrated Circuits