Palladium (Pd) as principal constituent

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H01L2224/45464

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/45464Palladium (Pd) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,676,920
- Issue date Jun 13, 2023
- United Microelectronics Corp.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package with segmented external shield to provide internal...
- Patent number 10,134,682
- Issue date Nov 20, 2018
- Avago Technologies International Sales Pte. Limited
- Nitesh Kumbhat
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,368,480
- Issue date Jun 14, 2016
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230260937
- Publication date Aug 17, 2023
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20220238468
- Publication date Jul 28, 2022
- UNITED MICROELECTRONICS CORP.
- Da-Jun Lin
- H01 - BASIC ELECTRIC ELEMENTS