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Palladium (Pd) as principal constituent
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CPC
H01L2224/45364
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/45364
Palladium (Pd) as principal constituent
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last 30 patents
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Patent Application
BASE METAL-GOLD WIRE FOR WIRE BONDING IN SEMICONDUCTOR FABRICATION
Publication number
20020056915
Publication date
May 16, 2002
BERNARD A. GO
H01 - BASIC ELECTRIC ELEMENTS