Palladium [Pd] as principal constituent

Industry

CPC
H01L2224/13364

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13364Palladium [Pd] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic element and electronic device comprising the same
- Patent number 10,825,787
- Issue date Nov 3, 2020
- Innolux Corporation
- Wei-Cheng Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, film adhesive, adhesive sheet, ad...
- Patent number 10,428,253
- Issue date Oct 1, 2019
- Hitachi Chemical Company, Ltd.
- Tomonori Minegishi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming pillar bumps on semiconductor wafers
- Patent number 9,831,201
- Issue date Nov 28, 2017
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
Manufacturing method of mounting part of semiconductor light emitti...
- Patent number 8,609,444
- Issue date Dec 17, 2013
- Toyoda Gosei Co., Ltd.
- Satoshi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,563,397
- Issue date Oct 22, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Akihiro Chida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Terminal structure and manufacturing method thereof, and electronic...
- Patent number 8,345,435
- Issue date Jan 1, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Toshiji Hamatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal nanoink and process for producing the metal nanoink, and die...
- Patent number 8,328,928
- Issue date Dec 11, 2012
- Shinkawa Ltd.
- Toru Maeda
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 7,871,917
- Issue date Jan 18, 2011
- Fujitsu Semiconductor Limited
- Joji Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding
- Patent number 7,789,287
- Issue date Sep 7, 2010
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, mounting circuit board, method of producing t...
- Patent number 6,909,180
- Issue date Jun 21, 2005
- Matsushita Electric Industrial Co., Ltd.
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20130001280
- Publication date Jan 3, 2013
- SHINKAWA LTD.
- Toru MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME
- Publication number 20130001775
- Publication date Jan 3, 2013
- Hideo Nishikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20110114708
- Publication date May 19, 2011
- SHINKAWAL LTD
- Toru Maeda
- B22 - CASTING POWDER METALLURGY
Information Patent Application
TERMINAL STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20110032684
- Publication date Feb 10, 2011
- Semiconductor Energy Laboratory Co., Ltd.
- Toshiji HAMATANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing method of mounting part of semiconductor light emitti...
- Publication number 20100219444
- Publication date Sep 2, 2010
- Toyoda Gosei Co., Ltd.
- Satoshi Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100171221
- Publication date Jul 8, 2010
- Akihiro CHIDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BONDING
- Publication number 20090230172
- Publication date Sep 17, 2009
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method for the same
- Publication number 20070197016
- Publication date Aug 23, 2007
- FUJITSU LIMITED
- Joji Fujimori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate for packaging semiconductor device, method for pr...
- Publication number 20050163982
- Publication date Jul 28, 2005
- Masahiro Ono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device, mounting circuit board, method of producing t...
- Publication number 20030049425
- Publication date Mar 13, 2003
- Masahiro Ono
- H01 - BASIC ELECTRIC ELEMENTS

Palladium [Pd] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic element and electronic device comprising the same

Photosensitive resin composition, film adhesive, adhesive sheet, ad...

Conductive connecting member and manufacturing method of same

Method for producing metal ball, joining material, and metal ball

Methods for forming pillar bumps on semiconductor wafers

Electronic component-mounted structure, IC card and COF package

Manufacturing method of mounting part of semiconductor light emitti...

Semiconductor device and manufacturing method thereof

Terminal structure and manufacturing method thereof, and electronic...

Metal nanoink and process for producing the metal nanoink, and die...

Semiconductor device and manufacturing method for the same

Method of bonding

Semiconductor device, mounting circuit board, method of producing t...

Patents Applicationslast 30 patents

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

CONDUCTIVE CONNECTING MEMBER AND MANUFACTURING METHOD OF SAME

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

TERMINAL STRUCTURE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

Manufacturing method of mounting part of semiconductor light emitti...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF BONDING

Semiconductor device and manufacturing method for the same

Circuit substrate for packaging semiconductor device, method for pr...

Semiconductor device, mounting circuit board, method of producing t...