Palladium [Pd] as principal constituent

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H01L2224/29264

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29264Palladium [Pd] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor device and substrate with dimple region
- Patent number 11,842,968
- Issue date Dec 12, 2023
- Mitsubishi Electric Corporation
- Kohei Yabuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,776,927
- Issue date Oct 3, 2023
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive film, roll, connected structure, and process for...
- Patent number 11,667,817
- Issue date Jun 6, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Takashi Tatsuzawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Power semiconductor device and manufacturing method for power semic...
- Patent number 11,342,281
- Issue date May 24, 2022
- Mitsubishi Electric Corporation
- Kohei Yabuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a solder compound containing a compo...
- Patent number 11,069,644
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallic sintered bonding body and die bonding method
- Patent number 11,024,598
- Issue date Jun 1, 2021
- Senju Metal Industry Co., Ltd.
- Tetsu Takemasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Image display device
- Patent number 10,763,249
- Issue date Sep 1, 2020
- SHARP KABUSHIKI KAISHA
- Katsuji Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering pastes with high metal loading for semiconductor die atta...
- Patent number 10,727,193
- Issue date Jul 28, 2020
- Ormet Circuits, Inc.
- Catherine Shearer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly and semiconductor device
- Patent number 10,566,304
- Issue date Feb 18, 2020
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20230137299
- Publication date May 4, 2023
- Showa Denko Materials Co., Ltd.
- Takashi TATSUZAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
- Publication number 20220254738
- Publication date Aug 11, 2022
- Mitsubishi Electric Corporation
- Kohei YABUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20220216173
- Publication date Jul 7, 2022
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...
- Publication number 20200251423
- Publication date Aug 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Kohei YABUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE ADHESIVE
- Publication number 20200172767
- Publication date Jun 4, 2020
- Takamichi MORI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...
- Publication number 20200105704
- Publication date Apr 2, 2020
- INFINEON TECHNOLOGIES AG
- Thomas Behrens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METALLIC SINTERED BONDING BODY AND DIE BONDING METHOD
- Publication number 20190393188
- Publication date Dec 26, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Tetsu TAKEMASA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
IMAGE DISPLAY DEVICE
- Publication number 20190371777
- Publication date Dec 5, 2019
- Sharp Kabushiki Kaisha
- KATSUJI IGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...
- Publication number 20190241771
- Publication date Aug 8, 2019
- Hitachi Chemical Company, Ltd.
- Takashi TATSUZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY AND SEMICONDUCTOR DEVICE
- Publication number 20180342478
- Publication date Nov 29, 2018
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...
- Publication number 20170326640
- Publication date Nov 16, 2017
- Heraeus Deutschland GmbH & Co. KG
- Wolfgang SCHMITT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120211764
- Publication date Aug 23, 2012
- Fujitsu Limited,
- Keishiro OKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS

Palladium [Pd] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power semiconductor device and substrate with dimple region

Semiconductor device including a solder compound containing a compo...

Electroconductive film, roll, connected structure, and process for...

Metal paste for joints, assembly, production method for assembly, s...

Power semiconductor device and manufacturing method for power semic...

Semiconductor device including a solder compound containing a compo...

Metallic sintered bonding body and die bonding method

Image display device

Sintering pastes with high metal loading for semiconductor die atta...

Assembly and semiconductor device

Patents Applicationslast 30 patents

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR POWER SEMIC...

ELECTROCONDUCTIVE ADHESIVE

SEMICONDUCTOR DEVICE INCLUDING A SOLDER COMPOUND CONTAINING A COMPO...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

METALLIC SINTERED BONDING BODY AND DIE BONDING METHOD

IMAGE DISPLAY DEVICE

ELECTROCONDUCTIVE FILM, ROLL, CONNECTED STRUCTURE, AND PROCESS FOR...

ASSEMBLY AND SEMICONDUCTOR DEVICE

METAL SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE