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Palladium [Pd] as principal constituent
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CPC
H01L2224/05464
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Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Current Industry
H01L2224/05464
Palladium [Pd] as principal constituent
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Patents Grants
last 30 patents
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Patent Grant
Method for obtaining a palladium surface finish for copper wire bon...
Patent number
8,987,910
Issue date
Mar 24, 2015
Atotech Deutschland GmbH
Mustafa Özkök
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR OBTAINING A PALLADIUM SURFACE FINISH FOR COPPER WIRE BON...
Publication number
20130288475
Publication date
Oct 31, 2013
Atotech Deutschland GmbH
Mustafa Özkök
H01 - BASIC ELECTRIC ELEMENTS