Parallel arrangements

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CPC
H01L2224/25175

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/25175Parallel arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Dipole alignment apparatus for use in manufacturing of display devi...
- Patent number 12,068,279
- Issue date Aug 20, 2024
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, endoscope, and method for manufacturing semic...
- Patent number 12,033,975
- Issue date Jul 9, 2024
- Olympus Corporation
- Keiichi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-lead semiconductor device, and corresponding method of manu...
- Patent number 11,887,959
- Issue date Jan 30, 2024
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,855,055
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Seung Lyong Bok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device
- Patent number 11,848,335
- Issue date Dec 19, 2023
- Samsung Display Co., Ltd.
- Won Sik Oh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,842,970
- Issue date Dec 12, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure using metal bridges to interconne...
- Patent number 11,810,895
- Issue date Nov 7, 2023
- Honeywell Federal Manufacturing & Technologies, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device along with multi-functional units and method f...
- Patent number 11,600,603
- Issue date Mar 7, 2023
- X-FAB Global Services GmbH
- Ralf Lerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,404,333
- Issue date Aug 2, 2022
- Advanced Semiconductor Engineering, Inc.
- Yuan-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,127,708
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack packages including vertically stacked sub-packages with inter...
- Patent number 11,127,722
- Issue date Sep 21, 2021
- SK hynix Inc.
- Bok Kyu Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,121,102
- Issue date Sep 14, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating semiconductor package
- Patent number 11,031,371
- Issue date Jun 8, 2021
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Chin Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,991,676
- Issue date Apr 27, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and placing a semiconductor device on a sub...
- Patent number 10,910,342
- Issue date Feb 2, 2021
- Imec VZW
- Maria Op de Beeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,770,418
- Issue date Sep 8, 2020
- Samsung Electronics Co., Ltd.
- Da Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,573,613
- Issue date Feb 25, 2020
- Samsung Electronics Co., Ltd.
- Da Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,535,620
- Issue date Jan 14, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,515,916
- Issue date Dec 24, 2019
- Samsung Electronics Co., Ltd.
- Dae Jung Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,504,865
- Issue date Dec 10, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable fabrication techniques and circuit packaging devices
- Patent number 10,506,715
- Issue date Dec 10, 2019
- The Regents of the University of California
- Todd Prentice Coleman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged chip and signal transmission method based on packaged chip
- Patent number 10,490,506
- Issue date Nov 26, 2019
- Huawei Technologies Co., Ltd.
- Chih Chiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,474,868
- Issue date Nov 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Ho Baek
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,347,600
- Issue date Jul 9, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate-vias with self-aligned solder bumps
- Patent number 10,325,870
- Issue date Jun 18, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package
- Patent number 10,229,865
- Issue date Mar 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Yong Jin Seol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and wafer level package including such semicon...
- Patent number 10,224,287
- Issue date Mar 5, 2019
- Mediatek Inc.
- Shih-Yi Syu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,929,113
- Issue date Mar 27, 2018
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mounting semiconductor chips, semiconductor device obtain...
- Patent number 9,795,033
- Issue date Oct 17, 2017
- Panasonic Corporation
- Shingo Yoshioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and wafer level package including such semicon...
- Patent number 9,704,808
- Issue date Jul 11, 2017
- Mediatek Inc.
- Shih-Yi Syu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP SCALE SEMICONDUCTOR DEVICE
- Publication number 20240243101
- Publication date Jul 18, 2024
- Western Digital Technologies, Inc.
- Chee Seng Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411230
- Publication date Dec 21, 2023
- InnoLux Corporation
- Cheng-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...
- Publication number 20230307405
- Publication date Sep 28, 2023
- ADVANCED MICRO DEVICES, INC.
- Lei Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230260980
- Publication date Aug 17, 2023
- SAMSUNG DISPLAY CO., LTD.
- Myeong Su SO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230230967
- Publication date Jul 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- In Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230207543
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- Jae Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230163138
- Publication date May 25, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hee SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230154906
- Publication date May 18, 2023
- SAMSUNG DISPLAY CO., LTD.
- Dong Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL MANUFACTURING APPARATUS AND DISPLAY PANEL MANUFACTURI...
- Publication number 20230125730
- Publication date Apr 27, 2023
- SAMSUNG DISPLAY CO., LTD.
- Byung Kyu SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230122457
- Publication date Apr 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- Eui Kang HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...
- Publication number 20230121991
- Publication date Apr 20, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Barbara Diane Young
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
- Publication number 20230066130
- Publication date Mar 2, 2023
- LG Display Co., Ltd.
- MinJae KANG
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME
- Publication number 20230029503
- Publication date Feb 2, 2023
- SAMSUNG DISPLAY CO., LTD.
- SEUNG-YEON CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230027391
- Publication date Jan 26, 2023
- SAMSUNG DISPLAY CO., LTD.
- Na Hyeon CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20220406763
- Publication date Dec 22, 2022
- SAMSUNG DISPLAY CO., LTD.
- Eun A YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220359478
- Publication date Nov 10, 2022
- SAMSUNG DISPLAY CO., LTD.
- Xinxing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPOLE ALIGNMENT DEVICE, DIPOLE ALIGNMENT METHOD AND DISPLAY DEVICE...
- Publication number 20220254753
- Publication date Aug 11, 2022
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-LEAD SEMICONDUCTOR DEVICE, AND CORRESPONDING METHOD OF MANU...
- Publication number 20220199564
- Publication date Jun 23, 2022
- STMicroelectronics S.r.l
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220148987
- Publication date May 12, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210335765
- Publication date Oct 28, 2021
- SAMSUNG DISPLAY CO., LTD.
- Jong Chan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ENDOSCOPE, AND METHOD FOR MANUFACTURING SEMIC...
- Publication number 20210288023
- Publication date Sep 16, 2021
- OLYMPUS CORPORATION
- Keiichi KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20210225811
- Publication date Jul 22, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing a semiconductor d...
- Publication number 20210175215
- Publication date Jun 10, 2021
- X-FAB Global Services GmbH
- Ralf Lerner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGES INCLUDING VERTICALLY STACKED SUB-PACKAGES WITH INTER...
- Publication number 20210175218
- Publication date Jun 10, 2021
- SK HYNIX INC.
- Bok Kyu CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200328170
- Publication date Oct 15, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200243406
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Yuan-Ting LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20200212013
- Publication date Jul 2, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200075526
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190096841
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS

Parallel arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Dipole alignment apparatus for use in manufacturing of display devi...

Semiconductor device, endoscope, and method for manufacturing semic...

Chip-on-lead semiconductor device, and corresponding method of manu...

Display device

Display device

Semiconductor package and manufacturing method thereof

Electrical interconnect structure using metal bridges to interconne...

Semiconductor device along with multi-functional units and method f...

Semiconductor device and method for manufacturing the same

Package structure and method of manufacturing the same

Stack packages including vertically stacked sub-packages with inter...

Semiconductor package and manufacturing method thereof

Semiconductor package and method of fabricating semiconductor package

Systems and methods for flash stacking

Method for transferring and placing a semiconductor device on a sub...

Fan-out semiconductor package

Fan-out semiconductor package

Semiconductor package and manufacturing method thereof

Fan-out semiconductor package

Package structure and method of manufacturing the same

Scalable fabrication techniques and circuit packaging devices

Packaged chip and signal transmission method based on packaged chip

Fan-out semiconductor package

Through-substrate-vias with self-aligned solder bumps

Through-substrate-vias with self-aligned solder bumps

Fan-out semiconductor package

Semiconductor device and wafer level package including such semicon...

Semiconductor package and manufacturing method thereof

Method of mounting semiconductor chips, semiconductor device obtain...

Semiconductor device and wafer level package including such semicon...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

STACKED CHIP SCALE SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE INCLUDING DIES AND AN INTERCONNECT COUPLED TO THE...

DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE

DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

DISPLAY PANEL MANUFACTURING APPARATUS AND DISPLAY PANEL MANUFACTURI...

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

ELECTRICAL INTERCONNECT STRUCTURE USING METAL BRIDGES TO INTERCONNE...

DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE

DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME

DISPLAY DEVICE

PIXEL AND DISPLAY DEVICE INCLUDING THE SAME

DISPLAY DEVICE AND METHOD FOR MANUFACTURING SAME

DIPOLE ALIGNMENT DEVICE, DIPOLE ALIGNMENT METHOD AND DISPLAY DEVICE...

CHIP-ON-LEAD SEMICONDUCTOR DEVICE, AND CORRESPONDING METHOD OF MANU...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE

SEMICONDUCTOR DEVICE, ENDOSCOPE, AND METHOD FOR MANUFACTURING SEMIC...

SYSTEMS AND METHODS FOR FLASH STACKING

Semiconductor device and method for manufacturing a semiconductor d...

STACK PACKAGES INCLUDING VERTICALLY STACKED SUB-PACKAGES WITH INTER...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SYSTEMS AND METHODS FOR FLASH STACKING

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME