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CPC
H05K2201/09463

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09463Partial lands

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multilayer LED substrate
- Patent number 10,818,642
- Issue date Oct 27, 2020
- 3M Innovative Properties Company
- Alejandro Aldrin Il A. Narag
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero-misalignment via-pad structures
- Patent number 10,645,813
- Issue date May 5, 2020
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate
- Patent number 10,559,534
- Issue date Feb 11, 2020
- Industrial Technology Research Institute
- Sheng-Che Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power signal transmission structure and design method thereof
- Patent number 10,470,299
- Issue date Nov 5, 2019
- Pegatron Corporation
- Ching Ou Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electric device
- Patent number 10,212,805
- Issue date Feb 19, 2019
- Fujitsu Limited
- Tetsuro Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zero-misalignment via-pad structures
- Patent number 10,187,998
- Issue date Jan 22, 2019
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero-misalignment via-pad structures
- Patent number 9,713,264
- Issue date Jul 18, 2017
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection board, optoelectronic component arrangement and illumina...
- Patent number 9,521,747
- Issue date Dec 13, 2016
- Osram Opto Semiconductors GmbH
- Michael Rasp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, semiconductor package, and printed circuit board
- Patent number 9,192,044
- Issue date Nov 17, 2015
- Canon Kabushiki Kaisha
- Seiji Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and printed wiring board
- Patent number 8,432,702
- Issue date Apr 30, 2013
- Kabushiki Kaisha Toshiba
- Kenji Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for suspension
- Patent number 8,399,774
- Issue date Mar 19, 2013
- Dai Nippon Printing Co., Ltd.
- Yoichi Hitomi
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board equipped with piezoelectric element
- Patent number 8,300,422
- Issue date Oct 30, 2012
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and printed wiring board
- Patent number 8,193,453
- Issue date Jun 5, 2012
- Kabushiki Kaisha Toshiba
- Kenji Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High impedance electrical connection via
- Patent number 8,143,976
- Issue date Mar 27, 2012
- Xilinx, Inc.
- Christopher P. Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for suspension
- Patent number 8,097,811
- Issue date Jan 17, 2012
- Dai Nippon Printing Co., Ltd.
- Yoichi Hitomi
- G11 - INFORMATION STORAGE
Information Patent Grant
Two-level mounting board and crystal oscillator using the same
- Patent number 7,791,425
- Issue date Sep 7, 2010
- Nihon Dempa Kogyo Co., Ltd.
- Takeshi Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 7,755,911
- Issue date Jul 13, 2010
- Yazaki Corporation
- Masaoki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB with improved soldering holes and a battery set with the same
- Patent number 7,632,150
- Issue date Dec 15, 2009
- Simplo Technology Co., Ltd.
- Ming-Ta Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Managed memory component
- Patent number 7,508,069
- Issue date Mar 24, 2009
- Entorian Technologies, LP
- James Douglas Wehrly, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Long range optical reader
- Patent number 7,389,929
- Issue date Jun 24, 2008
- Hand Held Products, Inc.
- William H. Havens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fixing structure of circuit board and display module comprising the...
- Patent number 7,364,442
- Issue date Apr 29, 2008
- Samsung SDI Co., Ltd.
- Won-Kyu Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical reader having a plurality of imaging modules
- Patent number 7,219,843
- Issue date May 22, 2007
- Hand Held Products, Inc.
- William H. Havens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board for avoiding producing cutting burrs
- Patent number 7,126,061
- Issue date Oct 24, 2006
- Lite-On Technology Corporation
- Yung-Jen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Long range optical reader
- Patent number 7,090,132
- Issue date Aug 15, 2006
- Hand Held Products, Inc.
- William H. Havens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Long range optical reader
- Patent number 7,055,747
- Issue date Jun 6, 2006
- Hand Held Products, Inc.
- William H. Havens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
PCB design and method for providing vented blind vias
- Patent number 6,787,443
- Issue date Sep 7, 2004
- Intel Corporation
- David W. Boggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for soldering and soldering land of a printed...
- Patent number 6,471,109
- Issue date Oct 29, 2002
- Fuji Photo Film Co., Ltd.
- Masayoshi Muramatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for soldering and soldering land of a printed...
- Patent number 6,290,118
- Issue date Sep 18, 2001
- Fuji Photo Film Co., Ltd.
- Masayoshi Muramatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for soldering and soldering land of a printed...
- Patent number 6,045,025
- Issue date Apr 4, 2000
- Fuji Photo Film Co., Ltd.
- Masayoshi Muramatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cavity grid array integrated circuit package
- Patent number 5,962,922
- Issue date Oct 5, 1999
- Bily Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER LED SUBSTRATE
- Publication number 20190269016
- Publication date Aug 29, 2019
- 3M Innovative Properties Company
- Alejandro Aldrin II A. Narag
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ZERO-MISALIGNMENT VIA-PAD STRUCTURES
- Publication number 20190150291
- Publication date May 16, 2019
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ZERO-MISALIGNMENT VIA-PAD STRUCTURES
- Publication number 20170280568
- Publication date Sep 28, 2017
- Intel Corporation
- Brandon M. Rawlings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BOARD, OPTOELECTRONIC COMPONENT ARRANGEMENT AND ILLUMINA...
- Publication number 20140345918
- Publication date Nov 27, 2014
- Michael Rasp
- F21 - LIGHTING
Information Patent Application
CONTACT SURFACE FOR A PIN HOLE
- Publication number 20140262467
- Publication date Sep 18, 2014
- Lantek Electronics Inc.
- Shan-Jui Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD
- Publication number 20130279134
- Publication date Oct 24, 2013
- Canon Kabushiki Kaisha
- Seiji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND PRINTED WIRING BOARD
- Publication number 20130220662
- Publication date Aug 29, 2013
- Kabushiki Kaisha Toshiba
- Kenji Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR SUSPENSION
- Publication number 20120090878
- Publication date Apr 19, 2012
- Dai Nippon Printing Co., Ltd.
- Yoichi Hitomi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC APPARATUS AND PRINTED WIRING BOARD
- Publication number 20110141707
- Publication date Jun 16, 2011
- Kabushiki Kaisha Toshiba
- Kenji Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH IMPEDANCE ELECTRICAL CONNECTION VIA
- Publication number 20110095851
- Publication date Apr 28, 2011
- Xilinx, Inc.
- Christopher P. Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD EQUIPPED WITH PIEZOELECTRIC ELEMENT
- Publication number 20100290203
- Publication date Nov 18, 2010
- Canon Kabushiki Kaisha
- Osamu Nagasaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND PRINTED WIRING BOARD
- Publication number 20100061067
- Publication date Mar 11, 2010
- Kabushiki Kaisha Toshiba
- Kenji Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS AND PRINTED WIRING BOARD
- Publication number 20100059264
- Publication date Mar 11, 2010
- Kabushiki Kaisha Toshiba
- Kenji HASEGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB with improved soldering holes and a battery set with the same
- Publication number 20090124099
- Publication date May 14, 2009
- SIMPLO TECHNOLOGY CO., LTD.
- Ming-Ta Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board
- Publication number 20080310133
- Publication date Dec 18, 2008
- YAZAKI CORPORATION
- Masaoki Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Two-level mounting board and crystal oscillator using the same
- Publication number 20080284535
- Publication date Nov 20, 2008
- Nihon Dempa Kogyo Co., Ltd.
- Takeshi Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLABLE SUBSTRATE FOR IN-LINE PACKAGE AND ASSEMBLY WITH SAME
- Publication number 20080266826
- Publication date Oct 30, 2008
- PREMIER IMAGE TECHNOLOGY(China) LTD.
- ZHEN HOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR SUSPENSION
- Publication number 20080247131
- Publication date Oct 9, 2008
- Dai Nippon Printing Co., Ltd.
- Yoichi Hitomi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Fixing structure of circuit board and display module comprising the...
- Publication number 20070249224
- Publication date Oct 25, 2007
- Won-Kyu Bang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Managed memory component
- Publication number 20070159545
- Publication date Jul 12, 2007
- James Douglas Wehrly
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Managed memory component
- Publication number 20070158821
- Publication date Jul 12, 2007
- Leland Szewerenko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding pad with high bonding strength to solder ball and bump
- Publication number 20070108619
- Publication date May 17, 2007
- Jun Chung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Long range optical reader
- Publication number 20060255147
- Publication date Nov 16, 2006
- William H. Havens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Printed circuit board for avoiding producing cutting burrs
- Publication number 20050072596
- Publication date Apr 7, 2005
- Yung-Jen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB design and method for providing vented blind vias
- Publication number 20040231886
- Publication date Nov 25, 2004
- David W. Boggs
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Long range optical reader
- Publication number 20040035933
- Publication date Feb 26, 2004
- William H. Havens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Optical reader having a plurality of imaging modules
- Publication number 20040020990
- Publication date Feb 5, 2004
- William H. Havens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Long range optical reader
- Publication number 20030226895
- Publication date Dec 11, 2003
- Hand Held Products, Inc.
- William H. Havens
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Optical reader having position responsive decode launch circuit
- Publication number 20030168512
- Publication date Sep 11, 2003
- Hand Held Products, Inc.
- Andrew Longacre
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for soldering and soldering land of a printed...
- Publication number 20010045444
- Publication date Nov 29, 2001
- FUJI PHOTO FILM., LTD.
- Masayoshi Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Partial lands

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer LED substrate

Zero-misalignment via-pad structures

Circuit substrate

Power signal transmission structure and design method thereof

Printed circuit board and electric device

Zero-misalignment via-pad structures

Zero-misalignment via-pad structures

Connection board, optoelectronic component arrangement and illumina...

Printed wiring board, semiconductor package, and printed circuit board

Electronic apparatus and printed wiring board

Substrate for suspension

Printed circuit board equipped with piezoelectric element

Electronic apparatus and printed wiring board

High impedance electrical connection via

Substrate for suspension

Two-level mounting board and crystal oscillator using the same

Printed wiring board

PCB with improved soldering holes and a battery set with the same

Managed memory component

Long range optical reader

Fixing structure of circuit board and display module comprising the...

Optical reader having a plurality of imaging modules

Printed circuit board for avoiding producing cutting burrs

Long range optical reader

Long range optical reader

PCB design and method for providing vented blind vias

Method and apparatus for soldering and soldering land of a printed...

Method and apparatus for soldering and soldering land of a printed...

Method and apparatus for soldering and soldering land of a printed...

Cavity grid array integrated circuit package

Patents Applicationslast 30 patents

MULTILAYER LED SUBSTRATE

ZERO-MISALIGNMENT VIA-PAD STRUCTURES

ZERO-MISALIGNMENT VIA-PAD STRUCTURES

CONNECTION BOARD, OPTOELECTRONIC COMPONENT ARRANGEMENT AND ILLUMINA...

CONTACT SURFACE FOR A PIN HOLE

PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND PRINTED CIRCUIT BOARD

ELECTRONIC APPARATUS AND PRINTED WIRING BOARD

SUBSTRATE FOR SUSPENSION

ELECTRONIC APPARATUS AND PRINTED WIRING BOARD

HIGH IMPEDANCE ELECTRICAL CONNECTION VIA

PRINTED CIRCUIT BOARD EQUIPPED WITH PIEZOELECTRIC ELEMENT

ELECTRONIC APPARATUS AND PRINTED WIRING BOARD

ELECTRONIC APPARATUS AND PRINTED WIRING BOARD

PCB with improved soldering holes and a battery set with the same

Printed wiring board

Two-level mounting board and crystal oscillator using the same

ASSEMBLABLE SUBSTRATE FOR IN-LINE PACKAGE AND ASSEMBLY WITH SAME

SUBSTRATE FOR SUSPENSION

Fixing structure of circuit board and display module comprising the...

Managed memory component

Managed memory component

Bonding pad with high bonding strength to solder ball and bump

Long range optical reader

Printed circuit board for avoiding producing cutting burrs

PCB design and method for providing vented blind vias

Long range optical reader

Optical reader having a plurality of imaging modules

Long range optical reader

Optical reader having position responsive decode launch circuit

Method and apparatus for soldering and soldering land of a printed...