Particle beam

Industry

CPC
H05K2203/092

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/092Particle beam

Industries

Patents Grantslast 30 patents

Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic trap mass spectrometer with improved ion injection
- Patent number 11,742,192
- Issue date Aug 29, 2023
- Leco Corporation
- Anatoly N. Verenchikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion beam lithography method based on ion beam lithography system
- Patent number 11,538,653
- Issue date Dec 27, 2022
- Beijing Normal University
- Bin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composition comprising directly written metal features and method o...
- Patent number 11,230,132
- Issue date Jan 25, 2022
- Case Western Reserve University
- Christopher J. Miller
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thin film transistor, display panel and fabricating method thereof
- Patent number 11,233,153
- Issue date Jan 25, 2022
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Huafei Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-production substrate modification with FIB deposition
- Patent number 11,139,217
- Issue date Oct 5, 2021
- BAE Systems Information and Electronic Systems Integration Inc.
- Jeffrey A. Zimmerman
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board and method of forming same
- Patent number 10,785,878
- Issue date Sep 22, 2020
- Honeywell Federal Manufacturing & Technologies, LLC
- Michael Girardi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for detecting ion migration
- Patent number 10,779,416
- Issue date Sep 15, 2020
- Hyundai Mobis Co., Ltd.
- Jae Hyun Park
- G01 - MEASURING TESTING
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,821
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,820
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Curable composition and cured product thereof, method for producing...
- Patent number 10,604,609
- Issue date Mar 31, 2020
- Canon Kabushiki Kaisha
- Jun Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of thin film adhesion pretreatment
- Patent number 10,426,043
- Issue date Sep 24, 2019
- Honeywell Federal Manufacturing & Technologies, LLC
- Michael Girardi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,321,581
- Issue date Jun 11, 2019
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical components and methods and systems of manufacturing elec...
- Patent number 10,154,595
- Issue date Dec 11, 2018
- TE Connectivity Corporation
- Soenke Sachs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate cover
- Patent number 10,129,985
- Issue date Nov 13, 2018
- NuFlare Technology, Inc.
- Michihiro Kawaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electroconductive nanowire network using el...
- Patent number 10,085,339
- Issue date Sep 25, 2018
- UNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
- Hyung Wook Park
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Embedded thin films
- Patent number 10,064,283
- Issue date Aug 28, 2018
- The Research Foundation for the State University of New York
- Junghyun Cho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Curable composition and cured product thereof, method for producing...
- Patent number 10,023,673
- Issue date Jul 17, 2018
- Canon Kabushiki Kaisha
- Jun Kato
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Removal of selected portions of protective coatings from substrates
- Patent number 9,656,350
- Issue date May 23, 2017
- HZO, INC.
- David J. Astle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for assembling electronic devices with adhesive
- Patent number 9,565,773
- Issue date Feb 7, 2017
- Apple Inc.
- John J. Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency circuit substrate
- Patent number 9,497,852
- Issue date Nov 15, 2016
- SUMITOMO ELECTRIC FINE FOLYMER, INC.
- Makoto Nakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removal of selected portions of protective coatings from substrates
- Patent number 9,403,236
- Issue date Aug 2, 2016
- HZO, INC.
- David James Astle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Line width protector printed circuit board and method of manufactur...
- Patent number 9,386,706
- Issue date Jul 5, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sung Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of etching metal layer
- Patent number 9,150,969
- Issue date Oct 6, 2015
- Tokyo Electron Limited
- Eiichi Nishimura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a magnetic write pole using a multi-layere...
- Patent number 8,889,018
- Issue date Nov 18, 2014
- HGST Netherlands B.V.
- Guomin Mao
- G11 - INFORMATION STORAGE
Information Patent Grant
Embedded thin films
- Patent number 8,882,983
- Issue date Nov 11, 2014
- The Research Foundation for the State University of New York
- Junghyun Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroconductive paste for electron beam curing and circuit board...
- Patent number 8,734,910
- Issue date May 27, 2014
- Fujikura Ltd.
- Kazutoshi Koshimizu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Substrate integrated waveguide
- Patent number 8,669,834
- Issue date Mar 11, 2014
- Shi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE...
- Publication number 20230383030
- Publication date Nov 30, 2023
- DAIKIN INDUSTRIES, LTD.
- Kyouhei SAWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND...
- Publication number 20220304163
- Publication date Sep 22, 2022
- AJINOMOTO CO., INC.
- Habib HICHRI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20220151081
- Publication date May 12, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POST-PRODUCTION LAND GRID ARRAY PACKAGE MODIFICATION WITH FIB DEPOS...
- Publication number 20210074595
- Publication date Mar 11, 2021
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jeffrey A. Zimmerman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BOTTOM-UP CURING OF DIELECTRIC FILMS IN INTEGRATED CIRCUITS
- Publication number 20200388488
- Publication date Dec 10, 2020
- International Business Machines Corporation
- Devika Sil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR DETECTING ION MIGRATION
- Publication number 20200128678
- Publication date Apr 23, 2020
- HYUNDAI MOBIS CO., LTD.
- Jae Hyun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FORMING SAME
- Publication number 20190274223
- Publication date Sep 5, 2019
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Michael Girardi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20190239363
- Publication date Aug 1, 2019
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20180324958
- Publication date Nov 8, 2018
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE COMPOSITION AND CURED PRODUCT THEREOF, METHOD FOR PRODUCING...
- Publication number 20180291130
- Publication date Oct 11, 2018
- Canon Kabushiki Kaisha
- Jun Kato
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Electronic Component and Process of Producing Electronic Component
- Publication number 20170326841
- Publication date Nov 16, 2017
- TE Connectivity Corporation
- Lavanya Bharadwaj
- B32 - LAYERED PRODUCTS
Information Patent Application
RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY
- Publication number 20170215286
- Publication date Jul 27, 2017
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CURABLE COMPOSITION AND CURED PRODUCT THEREOF, METHOD FOR PRODUCING...
- Publication number 20170183437
- Publication date Jun 29, 2017
- Canon Kabushiki Kaisha
- Jun Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN ELECTRICALLY CONDUCTING STRUCTURE ON A SYNTHE...
- Publication number 20160324010
- Publication date Nov 3, 2016
- Fraunhofer Gesellschaft zur Forderung der angewandten Forschung e.V.
- Matthias Fahland
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE COVER
- Publication number 20160105945
- Publication date Apr 14, 2016
- NuFlare Technology, Inc.
- Michihiro KAWAGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...
- Publication number 20150319865
- Publication date Nov 5, 2015
- Tyco Electronics Corporation
- Soenke Sachs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integration of current measurement in wiring structure of an electr...
- Publication number 20140327458
- Publication date Nov 6, 2014
- Martin GRUBER
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF ETCHING METAL LAYER
- Publication number 20140251945
- Publication date Sep 11, 2014
- TOKYO ELECTRON LIMITED
- Eiichi NISHIMURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES
- Publication number 20140190931
- Publication date Jul 10, 2014
- HZO, INC.
- David James Astle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...
- Publication number 20140097002
- Publication date Apr 10, 2014
- Tyco Electronics AMP GmbH
- Soenke Sachs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...
- Publication number 20140097003
- Publication date Apr 10, 2014
- Tyco Electronics AMP GmbH
- SOENKE SACHS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-FREQUENCY CIRCUIT SUBSTRATE
- Publication number 20130199828
- Publication date Aug 8, 2013
- SUMITOMO ELECTRIC FINE POLYMER, INC.
- Makoto Nakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROCONDUCTIVE PASTE FOR ELECTRON BEAM CURING AND CIRCUIT BOARD...
- Publication number 20120269984
- Publication date Oct 25, 2012
- Goo Chemical Co., Ltd.
- Kazutoshi Koshimizu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING A MAGNETIC WRITE POLE USING A MULTI-LAYERE...
- Publication number 20120125883
- Publication date May 24, 2012
- Hitachi Global Storage Technologies Netherlands B.V.
- Guomin Mao
- G11 - INFORMATION STORAGE
Information Patent Application
ADDITIVE MANUFACTURING PROCESSES
- Publication number 20110203937
- Publication date Aug 25, 2011
- BAE Systems plc
- Jagit Sidhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20110099807
- Publication date May 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Dong Sun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate Integrated Waveguide
- Publication number 20110018657
- Publication date Jan 27, 2011
- Shi Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and Method for Preparing Conductive Structures Using Radiati...
- Publication number 20100323102
- Publication date Dec 23, 2010
- Xerox Corporation
- Naveen Chopra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLANAR LAMINATE SUBSTRATE AND METHOD FOR FABRICATING ORGANIC LAMINA...
- Publication number 20100209682
- Publication date Aug 19, 2010
- William Kent Gregory
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONDUCTIVE INK COMPOSITION FOR PRINTED CIRCUIT BOARD AND METHOD OF...
- Publication number 20100178434
- Publication date Jul 15, 2010
- Samsung SDI Co., Ltd
- Jong-Hee Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Particle beam

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Single-layer circuit board, multi-layer circuit board, and manufact...

Electrostatic trap mass spectrometer with improved ion injection

Ion beam lithography method based on ion beam lithography system

Single-layer circuit board, multi-layer circuit board, and manufact...

Composition comprising directly written metal features and method o...

Thin film transistor, display panel and fabricating method thereof

Post-production substrate modification with FIB deposition

Single-layer circuit board, multi-layer circuit board, and manufact...

Circuit board and method of forming same

Apparatus and method for detecting ion migration

Single-layer circuit board, multi-layer circuit board, and manufact...

Single-layer circuit board, multi-layer circuit board, and manufact...

Curable composition and cured product thereof, method for producing...

Method of thin film adhesion pretreatment

Single-layer circuit board, multi-layer circuit board, and manufact...

Electrical components and methods and systems of manufacturing elec...

Substrate cover

Method of manufacturing electroconductive nanowire network using el...

Embedded thin films

Curable composition and cured product thereof, method for producing...

Removal of selected portions of protective coatings from substrates

Methods for assembling electronic devices with adhesive

High-frequency circuit substrate

Removal of selected portions of protective coatings from substrates

Line width protector printed circuit board and method of manufactur...

Method of etching metal layer

Method for manufacturing a magnetic write pole using a multi-layere...

Embedded thin films

Electroconductive paste for electron beam curing and circuit board...

Substrate integrated waveguide

Patents Applicationslast 30 patents

MODIFIED FLUORORESIN MATERIAL, MATERIAL FOR CIRCUIT BOARD, LAMINATE...

METHOD FOR MAKING PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND...

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

POST-PRODUCTION LAND GRID ARRAY PACKAGE MODIFICATION WITH FIB DEPOS...

BOTTOM-UP CURING OF DIELECTRIC FILMS IN INTEGRATED CIRCUITS

APPARATUS AND METHOD FOR DETECTING ION MIGRATION

CIRCUIT BOARD AND METHOD OF FORMING SAME

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

CURABLE COMPOSITION AND CURED PRODUCT THEREOF, METHOD FOR PRODUCING...

Electronic Component and Process of Producing Electronic Component

RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY

CURABLE COMPOSITION AND CURED PRODUCT THEREOF, METHOD FOR PRODUCING...

METHOD FOR FORMING AN ELECTRICALLY CONDUCTING STRUCTURE ON A SYNTHE...

SUBSTRATE COVER

ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...

Integration of current measurement in wiring structure of an electr...

METHOD OF ETCHING METAL LAYER

REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES

ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...

ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...

HIGH-FREQUENCY CIRCUIT SUBSTRATE

ELECTROCONDUCTIVE PASTE FOR ELECTRON BEAM CURING AND CIRCUIT BOARD...

METHOD FOR MANUFACTURING A MAGNETIC WRITE POLE USING A MULTI-LAYERE...

ADDITIVE MANUFACTURING PROCESSES

Method of manufacturing printed circuit board

Substrate Integrated Waveguide

System and Method for Preparing Conductive Structures Using Radiati...

PLANAR LAMINATE SUBSTRATE AND METHOD FOR FABRICATING ORGANIC LAMINA...

CONDUCTIVE INK COMPOSITION FOR PRINTED CIRCUIT BOARD AND METHOD OF...