Particular design considerations for integrated circuits

Industry

CPC
H01L27/0203

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0203Particular design considerations for integrated circuits

Industries

Patents Grantslast 30 patents

Information Patent Grant
Light emitting structure
- Patent number 12,094,864
- Issue date Sep 17, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-on-package integrated circuit device
- Patent number 12,015,191
- Issue date Jun 18, 2024
- Texas Instruments Incorporated
- Meysam Moallem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit
- Patent number RE49986
- Issue date May 28, 2024
- Sony Group Corporation
- Hiromi Ogata
Information Patent Grant
Semiconductor device
- Patent number 11,949,413
- Issue date Apr 2, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kazuyuki Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced semiconductor wafer bow and warpage
- Patent number 11,942,359
- Issue date Mar 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantations for forming source/drain regions of different transis...
- Patent number 11,895,819
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dian-Sheg Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits and methods for enabling redundancy in an electronic syste...
- Patent number 11,847,084
- Issue date Dec 19, 2023
- Apogee Semiconductor, Inc.
- Mark Hamlyn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fabricating field-effect transistors with interleaved source and dr...
- Patent number 11,842,947
- Issue date Dec 12, 2023
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system having combined high density, low bandwidth and low d...
- Patent number 11,830,534
- Issue date Nov 28, 2023
- Apple Inc.
- Sukalpa Biswas
- G11 - INFORMATION STORAGE
Information Patent Grant
Embedded substrate voltage converter module
- Patent number 11,817,786
- Issue date Nov 14, 2023
- Infineon Technologies AG
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated circuit device
- Patent number 11,728,347
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Weonhong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuits and methods for enabling redundancy in an electronic syste...
- Patent number 11,726,943
- Issue date Aug 15, 2023
- Apogee Semiconductor, Inc.
- Mark Hamlyn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Standard cell and semiconductor device including anchor nodes and m...
- Patent number 11,714,946
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nien-Yu Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for integrating a light emitting device
- Patent number 11,676,952
- Issue date Jun 13, 2023
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray photoemission system for 3-D laminography
- Patent number 11,619,596
- Issue date Apr 4, 2023
- David L. Adler
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Switched power stage with integrated passive components
- Patent number 11,605,580
- Issue date Mar 14, 2023
- CHAOYANG SEMICONDUCTOR (SHANGHAI) CO., LTD
- Taner Dosluoglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout modification method for exposure manufacturing process
- Patent number 11,594,528
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Voltage drop analysis using local circuit representation
- Patent number 11,531,794
- Issue date Dec 20, 2022
- Ansys, Inc.
- Altan Odabasi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Implantations for forming source/drain regions of different transis...
- Patent number 11,527,540
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dian-Sheg Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory system having combined high density, low bandwidth and low d...
- Patent number 11,468,935
- Issue date Oct 11, 2022
- Apple Inc.
- Sukalpa Biswas
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor module
- Patent number 11,410,970
- Issue date Aug 9, 2022
- ULTRAMEMORY INC.
- Ryuji Takishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package for warpage control
- Patent number 11,329,008
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray photoemission apparatus for inspection of integrated devices
- Patent number 11,307,152
- Issue date Apr 19, 2022
- David L. Adler
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
High voltage integration for HKMG technology
- Patent number 11,302,691
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect cladding
- Patent number 11,270,943
- Issue date Mar 8, 2022
- Intel Corporation
- Flavio Griggio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit
- Patent number RE48941
- Issue date Feb 22, 2022
- Sony Group Corporation
- Hiromi Ogata
Information Patent Grant
Semiconductor device
- Patent number 11,239,159
- Issue date Feb 1, 2022
- Murata Manufacturing Co., Ltd.
- Yasuhiro Murase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor and manufacturing method thereof, array substr...
- Patent number 11,233,070
- Issue date Jan 25, 2022
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Jilei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded substrate voltage regulators
- Patent number 11,183,934
- Issue date Nov 23, 2021
- Infineon Technologies Americas Corp.
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cascode transistor device
- Patent number 11,183,586
- Issue date Nov 23, 2021
- Xiamen Sanan Integrated Circuit Co., Ltd.
- Jian Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA-ON-PACKAGE INTEGRATED CIRCUIT DEVICE
- Publication number 20240297433
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Meysam Moallem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDARD CELL AND SEMICONDUCTOR DEVICE INCLUDING ANCHOR NODES
- Publication number 20240256751
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nien-Yu TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Implantations for Forming Source/Drain Regions of Different Transis...
- Publication number 20240251537
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Dian-Sheg Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS WITH INTERLEAVED FINGER CONFIGURATION
- Publication number 20240250003
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED SEMICONDUCTOR WAFER BOW AND WARPAGE
- Publication number 20240194519
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory System Having Combined High Density, Low Bandwidth and Low D...
- Publication number 20240161804
- Publication date May 16, 2024
- Apple Inc.
- Sukalpa Biswas
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE
- Publication number 20240014195
- Publication date Jan 11, 2024
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuits and methods for enabling redundancy in an electronic syste...
- Publication number 20230305984
- Publication date Sep 28, 2023
- Apogee Semiconductor, Inc.
- Mark Hamlyn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDUCED SEMICONDUCTOR WAFER BOW AND WARPAGE
- Publication number 20230170248
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Implantations for Forming Source/Drain Regions of Different Transis...
- Publication number 20230103306
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Dian-Sheg Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory System Having Combined High Density, Low Bandwidth and Low D...
- Publication number 20220415379
- Publication date Dec 29, 2022
- Apple Inc.
- Sukalpa Biswas
- G11 - INFORMATION STORAGE
Information Patent Application
X-RAY PHOTOEMISSION SYSTEM FOR 3-D LAMINOGRAPHY
- Publication number 20220236199
- Publication date Jul 28, 2022
- David L. Adler
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
COPPER INTERCONNECT CLADDING
- Publication number 20220157735
- Publication date May 19, 2022
- Intel Corporation
- Flavio Griggio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOLTAGE CONVERTER MODULE
- Publication number 20220045612
- Publication date Feb 10, 2022
- Danny Clavette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT DEVICE
- Publication number 20220028895
- Publication date Jan 27, 2022
- Samsung Electronics Co., Ltd.
- Weonhong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDARD CELL AND SEMICONDUCTOR DEVICE INCLUDING ANCHOR NODES AND M...
- Publication number 20210365623
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nien-Yu TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE
- Publication number 20210313305
- Publication date Oct 7, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT MODIFICATION METHOD FOR EXPOSURE MANUFACTURING PROCESS
- Publication number 20210296303
- Publication date Sep 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen CHO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Circuits and methods for enabling redundancy in an electronic syste...
- Publication number 20210279197
- Publication date Sep 9, 2021
- TallannQuest LLC DBA Apogee Semiconductor
- Mark Hamlyn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FABRICATING FIELD-EFFECT TRANSISTORS WITH INTERLEAVED SOURCE AND DR...
- Publication number 20210265242
- Publication date Aug 26, 2021
- Skyworks Solutions, Inc.
- Hailing Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Device Having Features to Prevent Reverse Engineering
- Publication number 20210242143
- Publication date Aug 5, 2021
- Verisiti, LLC
- William Eli Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory System Having Combined High Density, Low Bandwidth and Low D...
- Publication number 20210125657
- Publication date Apr 29, 2021
- Apple Inc.
- Sukalpa Biswas
- G11 - INFORMATION STORAGE
Information Patent Application
SWITCHED POWER STAGE WITH INTEGRATED PASSIVE COMPONENTS
- Publication number 20210111111
- Publication date Apr 15, 2021
- Chaoyang Semiconductor Jiangyin Technology Co., Ltd.
- Taner Dosluoglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20210013158
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHEN-SHIEN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE INTEGRATION FOR HKMG TECHNOLOGY
- Publication number 20200402978
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kong-Beng Thei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200373331
- Publication date Nov 26, 2020
- Samsung Electronics Co., Ltd.
- Weonhong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT MODIFICATION METHOD FOR EXPOSURE MANUFACTURING PROCESS
- Publication number 20200350306
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen CHO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CMOS COMPATIBLE DEVICE BASED ON FOUR-TERMINAL SWITCHING LATTICES
- Publication number 20200312728
- Publication date Oct 1, 2020
- ISTANBUL TEKNIK UNIVERSITESI
- Mustafa ALTUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDARD CELL AND SEMICONDUCTOR DEVICE INCLUDING ANCHOR NODES AND M...
- Publication number 20200311333
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nien-Yu TSAI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
POWER INTEGRATED MODULE
- Publication number 20200303326
- Publication date Sep 24, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS

Particular design considerations for integrated circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting structure

Antenna-on-package integrated circuit device

Semiconductor integrated circuit

Semiconductor device

Reduced semiconductor wafer bow and warpage

Implantations for forming source/drain regions of different transis...

Circuits and methods for enabling redundancy in an electronic syste...

Fabricating field-effect transistors with interleaved source and dr...

Memory system having combined high density, low bandwidth and low d...

Embedded substrate voltage converter module

Method of manufacturing an integrated circuit device

Circuits and methods for enabling redundancy in an electronic syste...

Standard cell and semiconductor device including anchor nodes and m...

Method for integrating a light emitting device

X-ray photoemission system for 3-D laminography

Switched power stage with integrated passive components

Layout modification method for exposure manufacturing process

Voltage drop analysis using local circuit representation

Implantations for forming source/drain regions of different transis...

Memory system having combined high density, low bandwidth and low d...

Semiconductor module

Method for manufacturing semiconductor package for warpage control

X-ray photoemission apparatus for inspection of integrated devices

High voltage integration for HKMG technology

Copper interconnect cladding

Semiconductor integrated circuit

Semiconductor device

Thin film transistor and manufacturing method thereof, array substr...

Embedded substrate voltage regulators

Cascode transistor device

Patents Applicationslast 30 patents

ANTENNA-ON-PACKAGE INTEGRATED CIRCUIT DEVICE

STANDARD CELL AND SEMICONDUCTOR DEVICE INCLUDING ANCHOR NODES

Implantations for Forming Source/Drain Regions of Different Transis...

FIELD-EFFECT TRANSISTORS WITH INTERLEAVED FINGER CONFIGURATION

REDUCED SEMICONDUCTOR WAFER BOW AND WARPAGE

Memory System Having Combined High Density, Low Bandwidth and Low D...

METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE

Circuits and methods for enabling redundancy in an electronic syste...

REDUCED SEMICONDUCTOR WAFER BOW AND WARPAGE

Implantations for Forming Source/Drain Regions of Different Transis...

Memory System Having Combined High Density, Low Bandwidth and Low D...

X-RAY PHOTOEMISSION SYSTEM FOR 3-D LAMINOGRAPHY

COPPER INTERCONNECT CLADDING

VOLTAGE CONVERTER MODULE

METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT DEVICE

STANDARD CELL AND SEMICONDUCTOR DEVICE INCLUDING ANCHOR NODES AND M...

METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE

LAYOUT MODIFICATION METHOD FOR EXPOSURE MANUFACTURING PROCESS

Circuits and methods for enabling redundancy in an electronic syste...

FABRICATING FIELD-EFFECT TRANSISTORS WITH INTERLEAVED SOURCE AND DR...

Semiconductor Device Having Features to Prevent Reverse Engineering

Memory System Having Combined High Density, Low Bandwidth and Low D...

SWITCHED POWER STAGE WITH INTEGRATED PASSIVE COMPONENTS

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

HIGH VOLTAGE INTEGRATION FOR HKMG TECHNOLOGY

INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

LAYOUT MODIFICATION METHOD FOR EXPOSURE MANUFACTURING PROCESS

CMOS COMPATIBLE DEVICE BASED ON FOUR-TERMINAL SWITCHING LATTICES

STANDARD CELL AND SEMICONDUCTOR DEVICE INCLUDING ANCHOR NODES AND M...

POWER INTEGRATED MODULE