Partly drilling through substrate until a controlled depth

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CPC
H05K2203/0207

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0207Partly drilling through substrate until a controlled depth

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for detecting and adjusting poor back drills in printed circ...
- Patent number 12,135,347
- Issue date Nov 5, 2024
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser cutting system
- Patent number 11,999,014
- Issue date Jun 4, 2024
- Medtronic, Inc.
- Xiangnan He
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Machining station and method for machining workpieces
- Patent number 11,963,305
- Issue date Apr 16, 2024
- Skybrain Vermögensverwaltungs GmbH
- Markus Winterschladen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and manufacturing method for printed wiring board
- Patent number 11,849,546
- Issue date Dec 19, 2023
- Kyocera Corporation
- Atsuo Kawagoe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal sublayer sensing in multi-layer workpiece hole drilling
- Patent number 11,792,940
- Issue date Oct 17, 2023
- DRILLIANT LTD
- Guy Soffer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming high aspect ratio plated through holes and high...
- Patent number 11,399,439
- Issue date Jul 26, 2022
- Sanmina Corporation
- Douglas Ward Thomas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin substrate and electronic device
- Patent number 11,291,110
- Issue date Mar 29, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic board comprising SMDS soldered on buried solder pads
- Patent number 11,284,519
- Issue date Mar 22, 2022
- Safran Electronics & Defense
- Denis Lecordier
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additive manufacturing technology (AMT) low profile signal divider
- Patent number 11,089,687
- Issue date Aug 10, 2021
- Raytheon Company
- Jonathan E. Nufio-Molina
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Printed circuit board and communications device
- Patent number 11,019,724
- Issue date May 25, 2021
- Huawei Technologies Co., Ltd.
- Feng Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal sublayer sensing in multi-layer workpiece hole drilling
- Patent number 10,933,490
- Issue date Mar 2, 2021
- DRILLIANT LTD
- Guy Soffer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal sublayer sensing in multi-layer workpiece hole drilling
- Patent number 10,932,370
- Issue date Feb 23, 2021
- DRILLIANT LTD
- Guy Soffer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed signal fan-out method for BGA and printed circuit board...
- Patent number 10,897,810
- Issue date Jan 19, 2021
- CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LTD.
- Jiwei Wen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clearance size reduction for backdrilled differential vias
- Patent number 10,863,628
- Issue date Dec 8, 2020
- Juniper Networks, Inc.
- Matthew Twarog
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stepped vias for next generation speeds
- Patent number 10,667,393
- Issue date May 26, 2020
- Dell Products, L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device with the same
- Patent number 10,602,610
- Issue date Mar 24, 2020
- Samsung Electronics Co., Ltd.
- Man Ho Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Back-drilled through-hole printed circuit board (PCB) systems
- Patent number 10,426,042
- Issue date Sep 24, 2019
- DISH Technologies L.L.C.
- Andros X Thomson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier comprising a deformation counteracting structure
- Patent number 10,420,206
- Issue date Sep 17, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Disconnect cavity by plating resist process and structure
- Patent number 10,292,279
- Issue date May 14, 2019
- Multek Technologies Limited
- Jiawen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual-drill printed circuit board via
- Patent number 10,251,270
- Issue date Apr 2, 2019
- Innovium, Inc.
- Yongming Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming high aspect ratio plated through holes and high...
- Patent number 10,188,001
- Issue date Jan 22, 2019
- Sanmina Corporation
- Douglas Ward Thomas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for isolating high speed digital signals in a high densit...
- Patent number 10,079,202
- Issue date Sep 18, 2018
- R & D Circuits, Inc.
- Thomas P Warwick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Drilling method for PCBs with high hole position precision
- Patent number 10,064,284
- Issue date Aug 28, 2018
- YIXING SILICON VALLEY ELECTRONICS TECHNOLOGY CO., LTD.
- Xiaolang Ren
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a printed circuit board copper plane repair
- Patent number 9,980,382
- Issue date May 22, 2018
- International Business Machines Corporation
- Mahesh Bohra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for back-drilling a through-hole onto a printed circuit boar...
- Patent number 9,942,993
- Issue date Apr 10, 2018
- DISH Technologies L.L.C.
- Andros Thomson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board having a non-plated hole with limited drill d...
- Patent number 9,936,588
- Issue date Apr 3, 2018
- Lenovo Enterprise Solutions (Singapore) Ptd. Ltd.
- Mark E. Andresen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder void reduction between electronic packages and printed circu...
- Patent number 9,839,128
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for implementing high-precision backdrilling stub length con...
- Patent number 9,827,616
- Issue date Nov 28, 2017
- Huawei Technologies Co., Ltd.
- Yongxing Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, electronic device, and method of manufacturing circu...
- Patent number 9,788,415
- Issue date Oct 10, 2017
- Fujitsu Limited
- Megumi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for back drilling hole in PCB and PCB
- Patent number 9,756,734
- Issue date Sep 5, 2017
- Peking University Founder Group Co., Ltd.
- Xianren Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD
- Publication number 20240114625
- Publication date Apr 4, 2024
- SHENNAN CIRCUITS CO.,LTD.
- Dantian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240114632
- Publication date Apr 4, 2024
- Unimicron Technology Corp.
- Ming-Hao WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER VIA RESONANCE SUPPRESSION
- Publication number 20240098898
- Publication date Mar 21, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Melvin Kent Benedict
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD TO ELIMINATE VIA STRIPING
- Publication number 20240080978
- Publication date Mar 7, 2024
- Dell Products L.P.
- Sandor FARKAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Machining Station and Method for Machining Workpieces
- Publication number 20230119865
- Publication date Apr 20, 2023
- Skybrain Vermögensverwaltungs GmbH
- Markus Winterschladen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Drill for Removing Partial Metal Wall of Hole
- Publication number 20230097273
- Publication date Mar 30, 2023
- UNIMICRON TECHNOLOGY CORPORATION
- Cheng-Jui Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DETECTING AND ADJUSTING POOR BACK DRILLS IN PRINTED CIRC...
- Publication number 20230026067
- Publication date Jan 26, 2023
- R&D Circuits
- Michael Caprio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND TERMINAL
- Publication number 20220295634
- Publication date Sep 15, 2022
- Spreadtrum Communications (Shanghai) CO., Ltd.
- Yuanyuan CAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Machining Station and Method for Machining Workpieces
- Publication number 20210360793
- Publication date Nov 18, 2021
- SKYBRAIN VERMOGENSVERWALTUNGS GMBH
- Markus Winterschladen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Sublayer Sensing In Multi-Layer Workpiece Hole Drilling
- Publication number 20210161017
- Publication date May 27, 2021
- Drilliant Ltd.
- Guy SOFFER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20210014962
- Publication date Jan 14, 2021
- Murata Manufacturing Co., Ltd.
- Yusuke KAMITSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC BOARD COMPRISING SMDS SOLDERED ON BURIED SOLDER PADS
- Publication number 20200170121
- Publication date May 28, 2020
- SAFRAN ELECTRONICS & DEFENSE
- Denis LECORDIER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLEARANCE SIZE REDUCTION FOR BACKDRILLED DIFFERENTIAL VIAS
- Publication number 20200053880
- Publication date Feb 13, 2020
- Juniper Networks, Inc.
- Matthew TWAROG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Sublayer Sensing In Multi-Layer Workpiece Hole Drilling
- Publication number 20200008303
- Publication date Jan 2, 2020
- Drilliant Ltd.
- Guy SOFFER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED SIGNAL FAN-OUT METHOD FOR BGA AND PRINTED CIRCUIT BOARD...
- Publication number 20190208618
- Publication date Jul 4, 2019
- CELESTICA TECHNOLOGY CONSULTANCY (SHANGHAI) CO. LT D
- JIWEI WEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-DRILL PRINTED CIRCUIT BOARD VIA
- Publication number 20190208631
- Publication date Jul 4, 2019
- Innovium, Inc.
- Yongming Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING HIGH ASPECT RATIO PLATED THROUGH HOLES AND HIGH...
- Publication number 20190159346
- Publication date May 23, 2019
- Sanmina Corporation
- Douglas Ward THOMAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BACK-DRILLING A THROUGH-HOLE ONTO A PRINTED CIRCUIT BOAR...
- Publication number 20180192523
- Publication date Jul 5, 2018
- DISH Technologies L.L.C.
- Andros X THOMSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-DRILL PRINTED CIRCUIT BOARD VIA
- Publication number 20180077800
- Publication date Mar 15, 2018
- Innovium, Inc.
- Yongming Xiong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20160338191
- Publication date Nov 17, 2016
- Fujitsu Limited
- Megumi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...
- Publication number 20160338200
- Publication date Nov 17, 2016
- International Business Machines Corporation
- Phillip D. Isaacs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB BACK DRILL DETECTION METHOD AND PCB PLATING
- Publication number 20150264804
- Publication date Sep 17, 2015
- ZHUHAI FOUNDER TECH HI-DENSITY ELECTRONIC CO LTD.
- Shiqing Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB BACKDRILLING METHOD AND SYSTEM
- Publication number 20150047892
- Publication date Feb 19, 2015
- Huawei Technologies Co., Ltd
- Yongxing Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH PERFORMANCE PRINTED CIRCUIT BOARD
- Publication number 20140326495
- Publication date Nov 6, 2014
- Amphenol Corporation
- Jose Ricardo Paniagua
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Device and a Method for Machining Printed Circuit Boards
- Publication number 20140301797
- Publication date Oct 9, 2014
- SKYBRAIN VERMOGENSVERWALTUNGS GMBH
- Jochem Berkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR FORMING A MICROVIA IN A PRINTED CIRCUIT BOARD
- Publication number 20140268610
- Publication date Sep 18, 2014
- Gregory HALVORSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS
- Publication number 20140182891
- Publication date Jul 3, 2014
- Madhumitha Rengarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, AND METHOD AND APPARATUS FOR DRILLING PRINTE...
- Publication number 20140093321
- Publication date Apr 3, 2014
- Huawei Technologies Co., Ltd
- Shandang Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140092563
- Publication date Apr 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Young Ki Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Partly drilling through substrate until a controlled depth

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for detecting and adjusting poor back drills in printed circ...

Laser cutting system

Machining station and method for machining workpieces

Printed wiring board and manufacturing method for printed wiring board

Metal sublayer sensing in multi-layer workpiece hole drilling

Methods of forming high aspect ratio plated through holes and high...

Resin substrate and electronic device

Electronic board comprising SMDS soldered on buried solder pads

Additive manufacturing technology (AMT) low profile signal divider

Printed circuit board and communications device

Metal sublayer sensing in multi-layer workpiece hole drilling

Metal sublayer sensing in multi-layer workpiece hole drilling

High speed signal fan-out method for BGA and printed circuit board...

Clearance size reduction for backdrilled differential vias

Stepped vias for next generation speeds

Printed circuit board and electronic device with the same

Back-drilled through-hole printed circuit board (PCB) systems

Component carrier comprising a deformation counteracting structure

Disconnect cavity by plating resist process and structure

Dual-drill printed circuit board via

Methods of forming high aspect ratio plated through holes and high...

Structure for isolating high speed digital signals in a high densit...

Drilling method for PCBs with high hole position precision

Method of making a printed circuit board copper plane repair

Method for back-drilling a through-hole onto a printed circuit boar...

Printed circuit board having a non-plated hole with limited drill d...

Solder void reduction between electronic packages and printed circu...

Method for implementing high-precision backdrilling stub length con...

Circuit board, electronic device, and method of manufacturing circu...

Manufacturing method for back drilling hole in PCB and PCB

Patents Applicationslast 30 patents

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

POWER VIA RESONANCE SUPPRESSION

SYSTEM AND METHOD TO ELIMINATE VIA STRIPING

Machining Station and Method for Machining Workpieces

Method and Drill for Removing Partial Metal Wall of Hole

METHOD FOR DETECTING AND ADJUSTING POOR BACK DRILLS IN PRINTED CIRC...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND TERMINAL

Machining Station and Method for Machining Workpieces

Metal Sublayer Sensing In Multi-Layer Workpiece Hole Drilling

RESIN SUBSTRATE AND ELECTRONIC DEVICE

ELECTRONIC BOARD COMPRISING SMDS SOLDERED ON BURIED SOLDER PADS

CLEARANCE SIZE REDUCTION FOR BACKDRILLED DIFFERENTIAL VIAS

Metal Sublayer Sensing In Multi-Layer Workpiece Hole Drilling

HIGH SPEED SIGNAL FAN-OUT METHOD FOR BGA AND PRINTED CIRCUIT BOARD...

DUAL-DRILL PRINTED CIRCUIT BOARD VIA

METHODS OF FORMING HIGH ASPECT RATIO PLATED THROUGH HOLES AND HIGH...

METHOD FOR BACK-DRILLING A THROUGH-HOLE ONTO A PRINTED CIRCUIT BOAR...

DUAL-DRILL PRINTED CIRCUIT BOARD VIA

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

SOLDER VOID REDUCTION BETWEEN ELECTRONIC PACKAGES AND PRINTED CIRCU...

PCB BACK DRILL DETECTION METHOD AND PCB PLATING

PCB BACKDRILLING METHOD AND SYSTEM

HIGH PERFORMANCE PRINTED CIRCUIT BOARD

Device and a Method for Machining Printed Circuit Boards

METHOD AND SYSTEM FOR FORMING A MICROVIA IN A PRINTED CIRCUIT BOARD

GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS

PRINTED CIRCUIT BOARD, AND METHOD AND APPARATUS FOR DRILLING PRINTE...

HEAT RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME