Passive alignment, i.e. self alignment

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CPC
H01L2224/85143

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85143Passive alignment, i.e. self alignment

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Patents Grantslast 30 patents

Information Patent Grant
Automatic registration between circuit dies and interconnects
- Patent number 10,971,468
- Issue date Apr 6, 2021
- 3M Innovative Properties Company
- Ankit Mahajan
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents