Passive alignment, i.e. self alignment

Follow

Industry

CPC
H01L2224/84143

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/84143Passive alignment, i.e. self alignment

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having multiple contact clips
- Patent number 9,837,380
- Issue date Dec 5, 2017
- Infineon Technologies Austria AG
- Tian San Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,401,319
- Issue date Jul 26, 2016
- Mitsubishi Electric Corporation
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
- Publication number 20230326901
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130307130
- Publication date Nov 21, 2013
- MITSUBISHI ELECTRIC CORPORATION
- Takuya Oga
- H01 - BASIC ELECTRIC ELEMENTS