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H05K2201/035

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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Industries

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, resin sheet, multilayer printed wiring board, an...
- Patent number 12,133,339
- Issue date Oct 29, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yune Kumazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel mechanism and winding device for flexible copper clad laminate
- Patent number 12,120,828
- Issue date Oct 15, 2024
- AAC Technologies (Nanjing) Co., Ltd.
- Rui Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic component, substrate and an optical s...
- Patent number 12,114,434
- Issue date Oct 8, 2024
- Canon Kabushiki Kaisha
- Shunsuke Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic-copper composite, ceramic circuit board, power module, and...
- Patent number 12,109,640
- Issue date Oct 8, 2024
- DENKA COMPANY LIMITED
- Akimasa Yuasa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Circuit board
- Patent number 12,114,417
- Issue date Oct 8, 2024
- Sumitomo Bakelite Co., Ltd.
- Nobuo Tagashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,082,349
- Issue date Sep 3, 2024
- HONOR DEVICE CO., LTD.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil, copper-clad laminate and printed wirin...
- Patent number 12,063,747
- Issue date Aug 13, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer body
- Patent number 12,058,819
- Issue date Aug 6, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ceramic carrier substrate and power module
- Patent number 12,028,974
- Issue date Jul 2, 2024
- Robert Bosch GmbH
- Peter Tauber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and method for manufacturing same
- Patent number 12,028,990
- Issue date Jul 2, 2024
- STEMCO CO., LTD.
- Sung Jin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded circuit board, electronic device, and fabrication method t...
- Patent number 12,016,115
- Issue date Jun 18, 2024
- SHENNAN CIRCUITS CO., LTD.
- Beilei Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer printed circuit board
- Patent number 12,016,119
- Issue date Jun 18, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Cheng-Jia Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 12,016,128
- Issue date Jun 18, 2024
- LG Innotek Co., Ltd
- Min Young Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number RE49929
- Issue date Apr 16, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Highly heat-dissipating flexible printed circuit board (GFPCB), man...
- Patent number 11,937,364
- Issue date Mar 19, 2024
- SOLUETA
- Seong Hwan Jung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-layer-multi-turn structure for high efficiency wireless commu...
- Patent number 11,916,400
- Issue date Feb 27, 2024
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier-foil-attached ultra-thin copper foil
- Patent number 11,917,755
- Issue date Feb 27, 2024
- Lotte Energy Materials Corporation
- Won Jin Beom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper-clad laminate, wiring board, and copper foil provided with r...
- Patent number 11,895,770
- Issue date Feb 6, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Inoue
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable resin composition, dry film, resin-clad copper foil, cured...
- Patent number 11,891,474
- Issue date Feb 6, 2024
- TAIYO HOLDINGS CO., LTD.
- Kazuhisa Yamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,877,397
- Issue date Jan 16, 2024
- Sumitomo Electric Industries, Ltd.
- Junichi Motomura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Application of electrical conductors of a solar cell
- Patent number 11,877,402
- Issue date Jan 16, 2024
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalyzed metal foil and uses thereof
- Patent number 11,877,404
- Issue date Jan 16, 2024
- AVERATEK CORPORATION
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate plate, resin-attached copper foil, and circuit...
- Patent number 11,866,536
- Issue date Jan 9, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yuki Kitai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Stretchable laminate, material for stretchable device, and stretcha...
- Patent number 11,864,310
- Issue date Jan 2, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takatoshi Abe
- A41 - WEARING APPAREL
Information Patent Grant
Application of electrical conductors to an electrically insulating...
- Patent number 11,832,395
- Issue date Nov 28, 2023
- Landa Labs (2012) LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric substrate and method of forming the same
- Patent number 11,805,600
- Issue date Oct 31, 2023
- Saint-Gobain Performance Plastics Corporation
- Jennifer Adamchuk
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electrolytic copper foil
- Patent number 11,773,501
- Issue date Oct 3, 2023
- TEX TECHNOLOGY INC.
- Ryoichi Oguro
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL INTERCONNECT BOARD FOR A BATTERY MODULE WITH INTEGRATED...
- Publication number 20240356168
- Publication date Oct 24, 2024
- Airbus SAS
- Alois FRIEDBERGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20240349422
- Publication date Oct 17, 2024
- SONY GROUP CORPORATION
- Kenji UEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Multi-Layer-Multi-Turn Structure For High Efficiency Wireless Commu...
- Publication number 20240348091
- Publication date Oct 17, 2024
- NUCURRENT, INC.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20240349423
- Publication date Oct 17, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
- Meijuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...
- Publication number 20240314942
- Publication date Sep 19, 2024
- Chia-Ming LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240298410
- Publication date Sep 5, 2024
- LG Innotek Co., Ltd.
- Min Young HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240292533
- Publication date Aug 29, 2024
- KYOCERA CORPORATION
- Hidetoshi YUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for preparing novel material layer structure of high-frequen...
- Publication number 20240244757
- Publication date Jul 18, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240237233
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Manufacturing Method Thereof, and Terminal Device
- Publication number 20240237194
- Publication date Jul 11, 2024
- Honor Device Co., Ltd.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...
- Publication number 20240215172
- Publication date Jun 27, 2024
- Fukuda Metal Foil & Powder Co., Ltd.
- Takeshi OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper Foil, Laminate, and Flexible Printed Wiring Board
- Publication number 20240215153
- Publication date Jun 27, 2024
- JX Metals Corporation
- Yuji Ishino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...
- Publication number 20240206062
- Publication date Jun 20, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED W...
- Publication number 20240172359
- Publication date May 23, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu TATEOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Printed Wiring Board and Method for Manufacturing Same
- Publication number 20240155763
- Publication date May 9, 2024
- Nippon Mektron, Ltd.
- Yoshihiko Narisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE
- Publication number 20240145323
- Publication date May 2, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe Waltrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240147612
- Publication date May 2, 2024
- Sumitomo Electric Industries, Ltd.
- Kenji TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240138077
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board and Manufacturing Method Thereof, and Terminal Device
- Publication number 20240138056
- Publication date Apr 25, 2024
- Honor Device Co., Ltd.
- Junjie Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device
- Publication number 20240130048
- Publication date Apr 18, 2024
- Honor Device Co., Ltd.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW-ROUGHNESS SURFACE-TREATED COPPER FOIL WITH LOW BENDING DEFORMAT...
- Publication number 20240121902
- Publication date Apr 11, 2024
- Lotte Energy Materials Corporation
- Chang Yol YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND PRINTED WIRING BOARD
- Publication number 20240101858
- Publication date Mar 28, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Kazuhiro OOSAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098880
- Publication date Mar 21, 2024
- KMW Inc.
- Bae Mook JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR
- Publication number 20240098908
- Publication date Mar 21, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING THROUGH-VIA METAL WIRING
- Publication number 20240080993
- Publication date Mar 7, 2024
- EXTOLCO.,LTD.
- Sung Woong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD
- Publication number 20240049395
- Publication date Feb 8, 2024
- Resonac Corporation
- Masaya TOBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240040697
- Publication date Feb 1, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jin Young Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME
- Publication number 20240023242
- Publication date Jan 18, 2024
- SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATION
- Jennifer ADAMCHUK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CI...
- Publication number 20240015885
- Publication date Jan 11, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT AND ANTENNA STRUCTURE
- Publication number 20230363089
- Publication date Nov 9, 2023
- WISTRON NEWEB CORPORATION
- Li-Kai KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Paste overlayer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Resin composition, resin sheet, multilayer printed wiring board, an...

Reel mechanism and winding device for flexible copper clad laminate

Method of mounting electronic component, substrate and an optical s...

Ceramic-copper composite, ceramic circuit board, power module, and...

Circuit board

Electronic device

Surface-treated copper foil, copper-clad laminate and printed wirin...

Multilayer body

Ceramic carrier substrate and power module

Multilayer board and method for manufacturing same

Embedded circuit board, electronic device, and fabrication method t...

Method for manufacturing multilayer printed circuit board

Circuit board and method of manufacturing the same

Substrate for high-frequency printed wiring board

Circuit board for transmitting high-frequency signal and method for...

Highly heat-dissipating flexible printed circuit board (GFPCB), man...

Multi-layer-multi-turn structure for high efficiency wireless commu...

Carrier-foil-attached ultra-thin copper foil

Single-layer circuit board, multi-layer circuit board, and manufact...

Copper-clad laminate, wiring board, and copper foil provided with r...

Curable resin composition, dry film, resin-clad copper foil, cured...

Printed circuit board

Application of electrical conductors of a solar cell

Catalyzed metal foil and uses thereof

Copper-clad laminate plate, resin-attached copper foil, and circuit...

Stretchable laminate, material for stretchable device, and stretcha...

Application of electrical conductors to an electrically insulating...

Dielectric substrate and method of forming the same

Circuit board structure and method for manufacturing a circuit boar...

Method for producing electrolytic copper foil

Patents Applicationslast 30 patents

ELECTRICAL INTERCONNECT BOARD FOR A BATTERY MODULE WITH INTEGRATED...

COPPER CLAD LAMINATE AND PRINTED WIRING BOARD

Multi-Layer-Multi-Turn Structure For High Efficiency Wireless Commu...

METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD

Method for preparing novel material layer structure of high-frequen...

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

Circuit Board and Manufacturing Method Thereof, and Terminal Device

SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRIN...

Copper Foil, Laminate, and Flexible Printed Wiring Board

ULTRA-THIN COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURI...

ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED W...

Flexible Printed Wiring Board and Method for Manufacturing Same

ELECTRICAL MODULE AND METHOD OF MANUFACTURING AN ELECTRICAL MODULE

PRINTED WIRING BOARD

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

Circuit Board and Manufacturing Method Thereof, and Terminal Device

Electronic Device

LOW-ROUGHNESS SURFACE-TREATED COPPER FOIL WITH LOW BENDING DEFORMAT...

RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND PRINTED WIRING BOARD

ELECTRONIC DEVICE

CIRCUIT BOARD CONNECTION STRUCTURE AND PREPARATION METHOD THEREFOR

METHOD FOR FORMING THROUGH-VIA METAL WIRING

LAYERED PLATE AND WIRING BASE BOARD PRODUCTION METHOD

PRINTED CIRCUIT BOARD

DIELECTRIC SUBSTRATE AND METHOD OF FORMING THE SAME

METAL FOIL, METAL FOIL WITH CARRIER COMPRISING SAME, AND PRINTED CI...

FLEXIBLE PRINTED CIRCUIT AND ANTENNA STRUCTURE