Patterned shielding planes, ground planes or power planes

Industry

CPC
H05K1/0224

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0224Patterned shielding planes, ground planes or power planes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Radiation shield and groove in support structure
- Patent number 12,309,984
- Issue date May 20, 2025
- Intel Corporation
- Boon Ping Koh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal transmission structure, electronic device, and PCB
- Patent number 12,302,490
- Issue date May 13, 2025
- HONOR DEVICE CO., LTD.
- Puwei Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with plurality of condctor patterns and vias
- Patent number 12,279,364
- Issue date Apr 15, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module and method of manufacturing optical module
- Patent number 12,274,039
- Issue date Apr 8, 2025
- Furukawa Electric Co., Ltd.
- Kazuya Nagashima
- G02 - OPTICS
Information Patent Grant
Wiring board, electronic module, and electronic apparatus
- Patent number 12,267,947
- Issue date Apr 1, 2025
- Canon Kabushiki Kaisha
- Makoto Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and electronic device
- Patent number 12,245,364
- Issue date Mar 4, 2025
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 12,225,659
- Issue date Feb 11, 2025
- Hitachi Astemo, Ltd.
- Miki Hiraoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 12,213,248
- Issue date Jan 28, 2025
- Ibiden Co., Ltd.
- Shigeto Iyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and electronic device including circuit board includi...
- Patent number 12,200,864
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Bumhee Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic interference shielding enclosure with thermal condu...
- Patent number 12,167,530
- Issue date Dec 10, 2024
- Intel Corporation
- Jaejin Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication cable including a mosaic tape
- Patent number 12,142,390
- Issue date Nov 12, 2024
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,144,105
- Issue date Nov 12, 2024
- Kyocera Corporation
- Toshihiro Hiwatashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding film and circuit board
- Patent number 12,133,370
- Issue date Oct 29, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, semiconductor device, and electronic device
- Patent number 12,108,522
- Issue date Oct 1, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takashi Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Trans-vacuum printed flexible wiring apparatus
- Patent number 12,096,551
- Issue date Sep 17, 2024
- EQUAL 1 LABORATORIES IRELAND LIMITED
- Hans Haenlein
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board configuration blocks and edge projections
- Patent number 12,082,342
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Rathnait Long
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Storage device unit
- Patent number 12,069,796
- Issue date Aug 20, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigehito Morita
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit board and method for preparing same, and electronic device
- Patent number 12,028,965
- Issue date Jul 2, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Qing Gong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and manufacturing method therefor, and relat...
- Patent number 11,950,355
- Issue date Apr 2, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Hui Wen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding structure for system-in-package and electronic device
- Patent number 11,917,750
- Issue date Feb 27, 2024
- Huawei Technologies Co., Ltd.
- Huijuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board design for high speed application
- Patent number 11,903,121
- Issue date Feb 13, 2024
- Mediatek Inc.
- Nan-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method of manufacturing the same
- Patent number 11,889,625
- Issue date Jan 30, 2024
- Murata Manufacturing Co., Ltd.
- Akio Katsube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with embedded component covered by functional fil...
- Patent number 11,877,388
- Issue date Jan 16, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Imane Souli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical interconnection structure of a multi-layer substrate
- Patent number 11,864,315
- Issue date Jan 2, 2024
- Mediatek Inc.
- Yi-Chieh Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board for multiple signal transmission
- Patent number 11,844,173
- Issue date Dec 12, 2023
- Gigalane Co., Ltd.
- Byung-hoon Jo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including antenna and heat dissipation structure
- Patent number 11,832,381
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Seunghan Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,792,916
- Issue date Oct 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Han Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor device for measuring current in electrical circuit
- Patent number 11,785,708
- Issue date Oct 10, 2023
- Keysight Technologies, Inc.
- Ryo Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless power transmitter and wireless power receiver including mu...
- Patent number 11,777,341
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Chong-Min Lee
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
Card Edge Connector System
- Publication number 20250149813
- Publication date May 8, 2025
- Carlisle Interconnect Technologies, Inc.
- Shawn Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM
- Publication number 20250142725
- Publication date May 1, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Huali ZHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS
- Publication number 20250120020
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Fei Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD DEVICE AND ITS CIRCUIT MODULE
- Publication number 20250113432
- Publication date Apr 3, 2025
- Global Unichip Corporation
- Huan-Yi LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CONNECTOR ASSEMBLY WITH IMPROVED SHIELDING PERFOR...
- Publication number 20250113431
- Publication date Apr 3, 2025
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- Bin HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250048534
- Publication date Feb 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMMUNICATION CABLE INCLUDING A MOSAIC TAPE
- Publication number 20250037905
- Publication date Jan 30, 2025
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE STRUCTURES AND HOUSING STRUCTURES FOR TRANSMISSION ON DE...
- Publication number 20240389238
- Publication date Nov 21, 2024
- Charles Tyson Van de Zande
- D03 - WEAVING
Information Patent Application
PCB FABRICATION WITH EMI FILM ON MULTI-LAYER RIGID PCB
- Publication number 20240314923
- Publication date Sep 19, 2024
- Intel Corporation
- Arumanayagam RAJASEKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240268017
- Publication date Aug 8, 2024
- DONGWOO FINE-CHEM CO., LTD.
- KI HUN SUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240179830
- Publication date May 30, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Woong Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Signal Transmission Structure, Electronic Device, and PCB
- Publication number 20240130036
- Publication date Apr 18, 2024
- Honor Device Co., Ltd.
- Puwei Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...
- Publication number 20240121885
- Publication date Apr 11, 2024
- Canon Kabushiki Kaisha
- Yu Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATION STRUCTURE
- Publication number 20240064889
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Seunghan Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NETWORK COMMUNICATION DEVICE HAVING ELECTROMAGNETIC SHIELDING FUNCTION
- Publication number 20230413419
- Publication date Dec 21, 2023
- SERCOMM CORPORATION
- Yujian Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANS-VACUUM PRINTED FLEXIBLE WIRING APPARATUS
- Publication number 20230403784
- Publication date Dec 14, 2023
- Equal 1 Laboratories Ireland Limited
- Hans HAENLEIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Communication Cable Including a Mosaic Tape
- Publication number 20230377773
- Publication date Nov 23, 2023
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAMERA MODULE
- Publication number 20230371170
- Publication date Nov 16, 2023
- LG Innotek Co., Ltd.
- Won Seob SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD
- Publication number 20230354504
- Publication date Nov 2, 2023
- Samsung Electronics Co., LTD
- Bumhee BAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE CAPABLE OF SUPPRESSING HIGH GROUND IMPEDANCE, AND...
- Publication number 20230309214
- Publication date Sep 28, 2023
- Canon Kabushiki Kaisha
- SHUICHI NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Shielding Film and Circuit Board
- Publication number 20230276604
- Publication date Aug 31, 2023
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
- Zhi SU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PCB RF CABLE
- Publication number 20230232529
- Publication date Jul 20, 2023
- AMOSENSE CO.,LTD
- Jeonggeun HEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20230217581
- Publication date Jul 6, 2023
- KYOCERA CORPORATION
- Toshihiro HIWATASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED CAVITY
- Publication number 20230187820
- Publication date Jun 15, 2023
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND ELECTRONIC DEVICE
- Publication number 20230164908
- Publication date May 25, 2023
- Shinko Electric Industries Co., Ltd.
- Tatsuaki Denda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THICK AND THIN TRACES IN A BRIDGE WITH A GLASS CORE
- Publication number 20230100576
- Publication date Mar 30, 2023
- Intel Corporation
- Andrew COLLINS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230095087
- Publication date Mar 30, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Jae Han PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20230054252
- Publication date Feb 23, 2023
- Hitachi Astemo, Ltd.
- Miki HIRAOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATION STRUCTURE
- Publication number 20230049711
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Seunghan Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Communication Cable Including a Mosaic Tape
- Publication number 20230005643
- Publication date Jan 5, 2023
- Panduit Corp.
- Royal O. Jenner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patterned shielding planes, ground planes or power planes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Radiation shield and groove in support structure

Signal transmission structure, electronic device, and PCB

Printed circuit board with plurality of condctor patterns and vias

Optical module and method of manufacturing optical module

Wiring board, electronic module, and electronic apparatus

Wiring board and electronic device

Electronic control device

Printed wiring board

Circuit board and electronic device including circuit board includi...

Electromagnetic interference shielding enclosure with thermal condu...

Communication cable including a mosaic tape

Wiring board

Shielding film and circuit board

Circuit board, semiconductor device, and electronic device

Trans-vacuum printed flexible wiring apparatus

Printed circuit board configuration blocks and edge projections

Storage device unit

Circuit board and method for preparing same, and electronic device

Printed circuit board structure including a closed cavity

Flexible circuit board and manufacturing method therefor, and relat...

Shielding structure for system-in-package and electronic device

Printed circuit board design for high speed application

Module and method of manufacturing the same

Component carrier with embedded component covered by functional fil...

Vertical interconnection structure of a multi-layer substrate

Flexible circuit board for multiple signal transmission

Electronic device including antenna and heat dissipation structure

Printed circuit board

Sensor device for measuring current in electrical circuit

Wireless power transmitter and wireless power receiver including mu...

Patents Applicationslast 30 patents

Card Edge Connector System

FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM

SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS

CIRCUIT BOARD DEVICE AND ITS CIRCUIT MODULE

CIRCUIT BOARD AND CONNECTOR ASSEMBLY WITH IMPROVED SHIELDING PERFOR...

PRINTED CIRCUIT BOARD

COMMUNICATION CABLE INCLUDING A MOSAIC TAPE

CONDUCTIVE STRUCTURES AND HOUSING STRUCTURES FOR TRANSMISSION ON DE...

PCB FABRICATION WITH EMI FILM ON MULTI-LAYER RIGID PCB

CIRCUIT BOARD

PRINTED CIRCUIT BOARD

Signal Transmission Structure, Electronic Device, and PCB

WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...

ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATION STRUCTURE

NETWORK COMMUNICATION DEVICE HAVING ELECTROMAGNETIC SHIELDING FUNCTION

TRANS-VACUUM PRINTED FLEXIBLE WIRING APPARATUS

Communication Cable Including a Mosaic Tape

CAMERA MODULE

CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING CIRCUIT BOARD

ELECTRONIC DEVICE CAPABLE OF SUPPRESSING HIGH GROUND IMPEDANCE, AND...

Shielding Film and Circuit Board

FLEXIBLE PCB RF CABLE

WIRING BOARD

PRINTED CIRCUIT BOARD STRUCTURE INCLUDING A CLOSED CAVITY

WIRING BOARD AND ELECTRONIC DEVICE

THICK AND THIN TRACES IN A BRIDGE WITH A GLASS CORE

PRINTED CIRCUIT BOARD

ELECTRONIC CONTROL DEVICE

ELECTRONIC DEVICE INCLUDING ANTENNA AND HEAT DISSIPATION STRUCTURE

Communication Cable Including a Mosaic Tape