Patterning and lithography

Industry

CPC
H05K2203/0502

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0502Patterning and lithography

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 12,052,831
- Issue date Jul 30, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer printing high-precision devices
- Patent number 12,016,131
- Issue date Jun 18, 2024
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic device housings with patterned electrolytic plating layers
- Patent number 11,910,538
- Issue date Feb 20, 2024
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing wiring board that includes dual-layered insulat...
- Patent number 11,751,340
- Issue date Sep 5, 2023
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof and electronic device
- Patent number 11,737,209
- Issue date Aug 22, 2023
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer coil and method for manufacturing the same
- Patent number 11,688,553
- Issue date Jun 27, 2023
- Murata Manufacturing Co., Ltd.
- Kanto Iida
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for fabricating printed circuit board and printed circuit bo...
- Patent number 11,252,824
- Issue date Feb 15, 2022
- AMOGREENTECH CO., LTD.
- Sung-Baek Dan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reducing thin films on low temperature substrates
- Patent number 11,172,579
- Issue date Nov 9, 2021
- NCC Nano, LLC
- Dave S. Pope
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Transparent PCB and method for manufacturing the same
- Patent number 11,134,564
- Issue date Sep 28, 2021
- Avary Holding (Shenzhen) Co., Limited.
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,999,935
- Issue date May 4, 2021
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Interlayer printing process
- Patent number 10,899,940
- Issue date Jan 26, 2021
- Xerox Corporation
- Naveen Chopra
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Display device and manufacturing method thereof
- Patent number 10,820,425
- Issue date Oct 27, 2020
- Innolux Corporation
- Wei-Cheng Chu
- G02 - OPTICS
Information Patent Grant
Piezochromic stamp
- Patent number 10,813,223
- Issue date Oct 20, 2020
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 10,667,406
- Issue date May 26, 2020
- Unimicron Technology Corp.
- Cheng-Chieh Chiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminate for printed wiring board, method of manufacturing printed...
- Patent number 10,602,620
- Issue date Mar 24, 2020
- JX Nippon Mining & Metals Corporation
- Atsushi Miki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for reducing thin films on low temperature substrates
- Patent number 10,537,029
- Issue date Jan 14, 2020
- NCC Nano, LLC
- Dave S. Pope
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Manufacturing method of circuit board and stamp
- Patent number 10,512,166
- Issue date Dec 17, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
High-current transmitting method utilizing printed circuit board
- Patent number 10,462,911
- Issue date Oct 29, 2019
- LG Chem, Ltd.
- Chang Hui Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,426,038
- Issue date Sep 24, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring body, wiring board, touch sensor and method for producing wi...
- Patent number 10,379,645
- Issue date Aug 13, 2019
- Fujikura Ltd.
- Takaharu Hondo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,362,682
- Issue date Jul 23, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board with a substrate made of silicon and the methods for...
- Patent number 10,334,726
- Issue date Jun 25, 2019
- Wen Yao Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a circuit board with a substrate made of silicon
- Patent number 10,278,283
- Issue date Apr 30, 2019
- Wen Yao Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing circuit board and circuit board
- Patent number 10,206,287
- Issue date Feb 12, 2019
- Toyo Aluminium Kabushiki Kaisha
- Kosuke Tsuji
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-transmitting conductor having nanostructure pattern and metho...
- Patent number 10,165,680
- Issue date Dec 25, 2018
- INTREE CO., LTD
- Kyung Ho Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring body, wiring board, and touch sensor
- Patent number 10,101,865
- Issue date Oct 16, 2018
- Fujikura Ltd.
- Makoto Murakami
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of circuit board
- Patent number 10,098,234
- Issue date Oct 9, 2018
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board and load beam combination including a positioning...
- Patent number 10,028,370
- Issue date Jul 17, 2018
- Nitto Denko Corporation
- Yasunari Ooyabu
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 10,021,785
- Issue date Jul 10, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung-Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing cured product and method of forming pattern
- Patent number 9,961,776
- Issue date May 1, 2018
- Canon Kabushiki Kaisha
- Tatsuya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20240306295
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER PRINTING HIGH-PRECISION DEVICES
- Publication number 20240292543
- Publication date Aug 29, 2024
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE
- Publication number 20240015891
- Publication date Jan 11, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Tong Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEV...
- Publication number 20230413453
- Publication date Dec 21, 2023
- STEMCO CO., LTD.
- Sung Jin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD OF WIRING BOARD AND WIRING BOARD
- Publication number 20230269885
- Publication date Aug 24, 2023
- Japan Aviation Electronics Industry, Limited
- Akitoshi SAKAUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSFER PRINTING HIGH-PRECISION DEVICES
- Publication number 20230217598
- Publication date Jul 6, 2023
- X Display Company Technology Limited
- Matthew Alexander Meitl
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR FORMING PATTERN ON SUBSTRATE STRUCTURE WITHOUT USING MAS...
- Publication number 20230199968
- Publication date Jun 22, 2023
- Amulaire thermal technology, INC.
- SHIH-HSI TAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...
- Publication number 20230147650
- Publication date May 11, 2023
- TSE CO., LTD.
- Byeong Yong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES
- Publication number 20230095608
- Publication date Mar 30, 2023
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System, Apparatus and Method for Utilizing Surface Mount Technology...
- Publication number 20220408565
- Publication date Dec 22, 2022
- Jabil Inc.
- Weiping (aka Jonathan) Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220240369
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20220232695
- Publication date Jul 21, 2022
- Unimicron Technology Corp.
- Jun-Rui Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD OF WIRING BOARD AND WIRING BOARD
- Publication number 20220217850
- Publication date Jul 7, 2022
- Japan Aviation Electronics Industry, Limited
- Akitoshi SAKAUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20220183158
- Publication date Jun 9, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori SHIMIZU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC DEVICE HOUSINGS WITH PATTERNED ELECTROLYTIC PLATING LAYERS
- Publication number 20220167505
- Publication date May 26, 2022
- Hewlett-Packard Development Company, L.P.
- Yi-Chen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD AND LAMINATE
- Publication number 20220046808
- Publication date Feb 10, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Takatoshi ABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT PCB AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210385944
- Publication date Dec 9, 2021
- Avary Holding (Shenzhen) Co., Limited.
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Deposition with Solid Feedstock
- Publication number 20210282270
- Publication date Sep 9, 2021
- Liquid Wire Inc.
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT INKJET PRINTING OF INFRASTRUCTURE FOR INTEGRATED CIRCUITS
- Publication number 20210243904
- Publication date Aug 5, 2021
- NANO-DIMENSION TECHNOLOGIES LTD.
- Avishai Ya'ary
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR FABRICATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BO...
- Publication number 20210195762
- Publication date Jun 24, 2021
- AMOGREENTECH CO., LTD.
- Sung-Baek DAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOCURABLE COMPOSITION HAVING LOW SHRINKAGE AFTER CURING
- Publication number 20200201178
- Publication date Jun 25, 2020
- Canon Kabushiki Kaisha
- Fen Wan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
System, Apparatus and Method for Utilizing Surface Mount Technology...
- Publication number 20200205295
- Publication date Jun 25, 2020
- Jabil Inc.
- Weiping (aka Jonathan) Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190306990
- Publication date Oct 3, 2019
- InnoLux Corporation
- Wei-Cheng Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT BOARD
- Publication number 20190281703
- Publication date Sep 12, 2019
- Unimicron Technology Corp.
- Shih-Lian Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON
- Publication number 20190191556
- Publication date Jun 20, 2019
- WEN YAO CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON AND THE METHODS FOR...
- Publication number 20190191554
- Publication date Jun 20, 2019
- WEN YAO CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON
- Publication number 20190191555
- Publication date Jun 20, 2019
- WEN YAO CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER COIL AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190157001
- Publication date May 23, 2019
- Murata Manufacturing Co., Ltd.
- Kanto IIDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR SOLVENT-FREE PRINTING CONDUCTORS ON SUBSTRATE
- Publication number 20190104618
- Publication date Apr 4, 2019
- Jun YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOUCH DISPLAY MODULE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE
- Publication number 20190018514
- Publication date Jan 17, 2019
- BOE TECHNOLOGY GROUP CO., LTD.
- Lingyan WU
- G06 - COMPUTING CALCULATING COUNTING

Patterning and lithography

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board

Transfer printing high-precision devices

Electronic device housings with patterned electrolytic plating layers

Method of producing wiring board that includes dual-layered insulat...

Circuit board and manufacturing method thereof and electronic device

Multilayer coil and method for manufacturing the same

Method for fabricating printed circuit board and printed circuit bo...

Method for reducing thin films on low temperature substrates

Transparent PCB and method for manufacturing the same

Manufacturing method of circuit board

Interlayer printing process

Display device and manufacturing method thereof

Piezochromic stamp

Circuit board and method for manufacturing the same

Laminate for printed wiring board, method of manufacturing printed...

Method for reducing thin films on low temperature substrates

Manufacturing method of circuit board and stamp

High-current transmitting method utilizing printed circuit board

Manufacturing method of circuit board

Wiring body, wiring board, touch sensor and method for producing wi...

Manufacturing method of circuit board

Circuit board with a substrate made of silicon and the methods for...

Method for forming a circuit board with a substrate made of silicon

Method for manufacturing circuit board and circuit board

Light-transmitting conductor having nanostructure pattern and metho...

Wiring body, wiring board, and touch sensor

Manufacturing method of circuit board

Suspension board and load beam combination including a positioning...

Printed circuit board and method of manufacturing the same

Method of producing cured product and method of forming pattern

Patents Applicationslast 30 patents

CIRCUIT STRUCTURE

TRANSFER PRINTING HIGH-PRECISION DEVICES

METHOD OF PRODUCING CIRCUITS OF SUBSTRATE OF DISPLAY DEVICE

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC DEV...

PRODUCTION METHOD OF WIRING BOARD AND WIRING BOARD

TRANSFER PRINTING HIGH-PRECISION DEVICES

METHOD FOR FORMING PATTERN ON SUBSTRATE STRUCTURE WITHOUT USING MAS...

METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...

CONFORMAL POWER DELIVERY STRUCTURES INCLUDING EMBEDDED PASSIVE DEVICES

System, Apparatus and Method for Utilizing Surface Mount Technology...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE

PRODUCTION METHOD OF WIRING BOARD AND WIRING BOARD

METHOD OF MANUFACTURING PRINTED WIRING BOARD

ELECTRONIC DEVICE HOUSINGS WITH PATTERNED ELECTROLYTIC PLATING LAYERS

METHOD OF MANUFACTURING CIRCUIT BOARD AND LAMINATE

TRANSPARENT PCB AND METHOD FOR MANUFACTURING THE SAME

Deposition with Solid Feedstock

DIRECT INKJET PRINTING OF INFRASTRUCTURE FOR INTEGRATED CIRCUITS

METHOD FOR FABRICATING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BO...

PHOTOCURABLE COMPOSITION HAVING LOW SHRINKAGE AFTER CURING

System, Apparatus and Method for Utilizing Surface Mount Technology...

DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF CIRCUIT BOARD

CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON

CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON AND THE METHODS FOR...

CIRCUIT BOARD WITH A SUBSTRATE MADE OF SILICON

MULTILAYER COIL AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR SOLVENT-FREE PRINTING CONDUCTORS ON SUBSTRATE

TOUCH DISPLAY MODULE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE