Patterning by phototackifying or by photopatterning adhesive

Industry

CPC
H05K2203/0525

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0525Patterning by phototackifying or by photopatterning adhesive

Industries

Patents Grantslast 30 patents

Information Patent Grant
Photosensitive resin composition for optical waveguide and photocur...
- Patent number 10,858,475
- Issue date Dec 8, 2020
- Nitto Denko Corporation
- Tomoyuki Hirayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method and installation for producing a multilayer element and mult...
- Patent number 10,237,984
- Issue date Mar 19, 2019
- 3D-Micromac AG
- Tino Petsch
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Composition for forming adhesive pattern, laminated structure obtai...
- Patent number 7,829,180
- Issue date Nov 9, 2010
- Taiyo Ink Mfg. Co., Ltd.
- Shigeru Ushiki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for thick film circuit patterning
- Patent number 7,741,013
- Issue date Jun 22, 2010
- E. I. Du Pont de Nemours and Company
- Roupen Leon Keusseyan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Binder diffusion transfer patterning of a thick film paste layer
- Patent number 7,358,037
- Issue date Apr 15, 2008
- E. I. Du Pont de Nemours and Company
- Lap-Tak Andrew Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a micro pattern, micro pattern, method for fabri...
- Patent number 7,229,748
- Issue date Jun 12, 2007
- National University Corporation Nagoya University
- Hiroyuki Sugimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic methods and apparatus for mounting and demounting par...
- Patent number 7,191,930
- Issue date Mar 20, 2007
- The Regents of the University of California
- Thomas Kenneth Bednarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for coating surfaces with metal and products made thereby
- Patent number 7,094,307
- Issue date Aug 22, 2006
- Joan Morris
- B44 - DECORATIVE ARTS
Information Patent Grant
Process for thick film circuit patterning
- Patent number 7,052,824
- Issue date May 30, 2006
- E. I. Du Pont de Nemours and Company
- Roupen Leon Keusseyan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for making devices
- Patent number 6,973,710
- Issue date Dec 13, 2005
- Seiko Epson Corporation
- Hiroshi Kiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrostatic methods and apparatus for mounting and demounting par...
- Patent number 6,871,777
- Issue date Mar 29, 2005
- The Regents of the University of California
- Thomas Kenneth Bednarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming image on support
- Patent number 6,750,894
- Issue date Jun 15, 2004
- Urho A. Pietilä
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for attaching solder members to a substrate
- Patent number 6,723,629
- Issue date Apr 20, 2004
- Texas Instruments Incorporated
- Gregory B. Hotchkiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metallizing method for dielectrics
- Patent number 6,635,410
- Issue date Oct 21, 2003
- Infineon Technologies AG
- Joerg Haussmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic methods and apparatus for mounting and demounting par...
- Patent number 6,540,127
- Issue date Apr 1, 2003
- The Regents of the University of California
- Thomas Kenneth Bednarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming bumps and template used for forming bumps
- Patent number 6,432,806
- Issue date Aug 13, 2002
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the transfer of flux coated particles to a substrate
- Patent number 6,303,407
- Issue date Oct 16, 2001
- Texas Instruments Incorporated
- Gregory B. Hotchkiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring particles from an adhesive sheet to a subst...
- Patent number 6,239,013
- Issue date May 29, 2001
- Texas Instruments Incorporated
- Gregory B. Hotchkiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps and template used for forming bumps
- Patent number 6,107,181
- Issue date Aug 22, 2000
- Fujitsu Limited
- Masayuki Kitajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for the attachment of particles to a substrate
- Patent number 6,071,801
- Issue date Jun 6, 2000
- Texas Instruments Incorporated
- Kurt P. Wachtler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of printed wiring board
- Patent number 5,994,034
- Issue date Nov 30, 1999
- NEC Corporation
- Eiji Maehata
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Printed circuit board, a method of its fabrication and a method of...
- Patent number 5,332,869
- Issue date Jul 26, 1994
- W. R. Grace & Co.-Conn.
- Youshichi Hagiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for making electrically conductive patterns
- Patent number 5,296,259
- Issue date Mar 22, 1994
- E. I. Du Pont de Nemours and Company
- Dietmar Dudek
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Layer transfer process for image production and apparatus to prefor...
- Patent number 5,227,826
- Issue date Jul 13, 1993
- E. I. Du Pont de Nemours and Company
- Helmut G. Sandner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Process for coating surfaces made tacky beforehand
- Patent number 5,167,989
- Issue date Dec 1, 1992
- E. I. Du Pont de Nemours and Company
- Dietmar Dudek
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Layer transfer process for image production and apparatus to perfor...
- Patent number 5,155,010
- Issue date Oct 13, 1992
- E. I. Du Pont de Nemours and Company
- Helmut G. Sandner
- B32 - LAYERED PRODUCTS
Information Patent Grant
Embedded catalyst receptors for metallization of dielectrics
- Patent number 5,112,726
- Issue date May 12, 1992
- E. I. Du Pont de Nemours and Company
- Abraham B. Cohen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for making electrically conductive patterns
- Patent number 5,110,384
- Issue date May 5, 1992
- E. I. Du Pont de Nemours and Company
- Dietmar Dudek
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for connecting circuit boards
- Patent number 5,065,505
- Issue date Nov 19, 1991
- Sharp Kabushiki Kaisha
- Hiroshi Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded catalyst receptors for metallization of dielectrics
- Patent number 4,859,571
- Issue date Aug 22, 1989
- E. I. Du Pont de Nemours and Company
- Abraham B. Cohen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING MULTILAYER WIRING SUBSTRATE AND MULTILAYER WIR...
- Publication number 20110247865
- Publication date Oct 13, 2011
- FUJIFILM CORPORATION
- Mitsuyuki TSURUMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DOUBLE-LAYERED PATTERNABLE ADHESIVE FILM, METHOD OF FORMING THE SAM...
- Publication number 20110091811
- Publication date Apr 21, 2011
- Samsung Electronics Co., Ltd.
- Sun Jin SONG
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR FORMING FINE ELECTRODE PATTERNS
- Publication number 20110091694
- Publication date Apr 21, 2011
- E.I. du Pont de Nemours and Company
- Isao Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR THICK FILM CIRCUIT PATTERNING
- Publication number 20100304308
- Publication date Dec 2, 2010
- E.I. du Pont de Nemours and Company
- ATSUHIKO SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR THICK FILM CIRCUIT PATTERNING
- Publication number 20100209843
- Publication date Aug 19, 2010
- E.I. du Pont de Nemours and Company
- ATSUHIKO SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR THICK FILM CIRCUIT PATTERNING
- Publication number 20100104829
- Publication date Apr 29, 2010
- E.I. du Pont de Nemours and Company
- ROUPEN LEON KEUSSEYAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for the production of a conductor track structure
- Publication number 20090120676
- Publication date May 14, 2009
- LEONHARD KURZ Stiftung & Co. KG.
- Michael Rohm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION FOR FORMING ADHESIVE PATTERN, LAMINATED STRUCTURE OBTAI...
- Publication number 20080124525
- Publication date May 29, 2008
- TAIYO INK MFG. CO., LTD.
- Shigeru Ushiki
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Material for Metallic-Pattern Formation, Crosslinking Monomer, and...
- Publication number 20080119581
- Publication date May 22, 2008
- Tokyo Ohka Kogyo Co., Ltd.
- Hiroshi Takanashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Electrostatic methods and apparatus for mounting and demounting par...
- Publication number 20070145103
- Publication date Jun 28, 2007
- The Regents of the University of California
- Thomas Kenneth Bednarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for thick film circuit patterning
- Publication number 20060199096
- Publication date Sep 7, 2006
- Roupen Leon Keusseyan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for coating surfaces with metal and products made thereby
- Publication number 20050196595
- Publication date Sep 8, 2005
- Joan Morris
- B44 - DECORATIVE ARTS
Information Patent Application
Method and apparatus for making devices
- Publication number 20050158456
- Publication date Jul 21, 2005
- SEIKO EPSON CORPORATION
- Hiroshi Kiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming a micro pattern, micro pattern, method for fabri...
- Publication number 20050058951
- Publication date Mar 17, 2005
- National University Corporation Nagoya University
- Hiroyuki Sugimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming an electrically conductive pattern on support
- Publication number 20040222183
- Publication date Nov 11, 2004
- Urho A. Pietila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining method using anisotropic conductive adhesive
- Publication number 20040177921
- Publication date Sep 16, 2004
- Akira Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Binder diffusion transfer patterning of a thick film paste layer
- Publication number 20040173818
- Publication date Sep 9, 2004
- Lap-Tak Andrew Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrostatic methods and apparatus for mounting and demounting par...
- Publication number 20040146659
- Publication date Jul 29, 2004
- E.I. Du Pont De Nemours and Company
- Thomas Kenneth Bednarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for thick film circuit patterning
- Publication number 20030211406
- Publication date Nov 13, 2003
- Roupen Leon Keusseyan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrostatic methods and apparatus for mounting and demounting par...
- Publication number 20030106925
- Publication date Jun 12, 2003
- E.I. Du Pont De Nemours and Company
- Thomas Kenneth Bednarz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for making devices
- Publication number 20030024103
- Publication date Feb 6, 2003
- SEIKO EPSON CORPORATION
- Hiroshi Kiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for attaching solder members to a substrate
- Publication number 20030013228
- Publication date Jan 16, 2003
- Gregory B. Hotchkiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming image on support
- Publication number 20020192603
- Publication date Dec 19, 2002
- Urho A Pietila
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Metallizing method for dielectrics
- Publication number 20020172892
- Publication date Nov 21, 2002
- Joerg Haussmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR ATTACHING SOLDER MEMBERS TO A SUBSTRATE
- Publication number 20020106832
- Publication date Aug 8, 2002
- GREGORY B. HOTCHKISS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrostatic methods and apparatus for mounting and demounting par...
- Publication number 20020018859
- Publication date Feb 14, 2002
- Thomas Kenneth Bednarz
- H01 - BASIC ELECTRIC ELEMENTS

Patterning by phototackifying or by photopatterning adhesive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photosensitive resin composition for optical waveguide and photocur...

Method and installation for producing a multilayer element and mult...

Composition for forming adhesive pattern, laminated structure obtai...

Process for thick film circuit patterning

Binder diffusion transfer patterning of a thick film paste layer

Method for forming a micro pattern, micro pattern, method for fabri...

Electrostatic methods and apparatus for mounting and demounting par...

Methods for coating surfaces with metal and products made thereby

Process for thick film circuit patterning

Method and apparatus for making devices

Electrostatic methods and apparatus for mounting and demounting par...

Method of forming image on support

Method and apparatus for attaching solder members to a substrate

Metallizing method for dielectrics

Electrostatic methods and apparatus for mounting and demounting par...

Method of forming bumps and template used for forming bumps

Method for the transfer of flux coated particles to a substrate

Method for transferring particles from an adhesive sheet to a subst...

Method of forming bumps and template used for forming bumps

Method and apparatus for the attachment of particles to a substrate

Fabrication method of printed wiring board

Printed circuit board, a method of its fabrication and a method of...

Process for making electrically conductive patterns

Layer transfer process for image production and apparatus to prefor...

Process for coating surfaces made tacky beforehand

Layer transfer process for image production and apparatus to perfor...

Embedded catalyst receptors for metallization of dielectrics

Process for making electrically conductive patterns

Method for connecting circuit boards

Embedded catalyst receptors for metallization of dielectrics

Patents Applicationslast 30 patents

METHOD FOR PRODUCING MULTILAYER WIRING SUBSTRATE AND MULTILAYER WIR...

DOUBLE-LAYERED PATTERNABLE ADHESIVE FILM, METHOD OF FORMING THE SAM...

METHOD FOR FORMING FINE ELECTRODE PATTERNS

PROCESS FOR THICK FILM CIRCUIT PATTERNING

PROCESS FOR THICK FILM CIRCUIT PATTERNING

PROCESS FOR THICK FILM CIRCUIT PATTERNING

Process for the production of a conductor track structure

COMPOSITION FOR FORMING ADHESIVE PATTERN, LAMINATED STRUCTURE OBTAI...

Material for Metallic-Pattern Formation, Crosslinking Monomer, and...

Electrostatic methods and apparatus for mounting and demounting par...

Process for thick film circuit patterning

Methods for coating surfaces with metal and products made thereby

Method and apparatus for making devices

Method for forming a micro pattern, micro pattern, method for fabri...

Method of forming an electrically conductive pattern on support

Joining method using anisotropic conductive adhesive

Binder diffusion transfer patterning of a thick film paste layer

Electrostatic methods and apparatus for mounting and demounting par...

Process for thick film circuit patterning

Electrostatic methods and apparatus for mounting and demounting par...

Method and apparatus for making devices

Method and apparatus for attaching solder members to a substrate

Method of forming image on support

Metallizing method for dielectrics

METHOD AND APPARATUS FOR ATTACHING SOLDER MEMBERS TO A SUBSTRATE

Electrostatic methods and apparatus for mounting and demounting par...