Pb- and Sn-base components: alternative to or next to each other

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CPC
Y10T428/12687

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T428/00Stock material or miscellaneous articles

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Y10T428/12687Pb- and Sn-base components: alternative to or next to each other

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Patents Grantslast 30 patents

Information Patent Grant
Copper-alloy capping layers for metallization in touch-panel displays
- Patent number 11,640,222
- Issue date May 2, 2023
- Materion Newton, Inc.
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Copper-alloy capping layers for metallization in touch-panel displays
- Patent number 11,392,257
- Issue date Jul 19, 2022
- MATERION NEWTON INC.
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin-film transistor and method of forming an electrode of a thin-f...
- Patent number 10,916,569
- Issue date Feb 9, 2021
- H.C. Starck Inc.
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal foil for electromagnetic shielding, electromagnetic shielding...
- Patent number 10,842,058
- Issue date Nov 17, 2020
- JX Nippon Mining & Metals Corporation
- Koichiro Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper-alloy capping layers for metallization in touch-panel displays
- Patent number 9,929,187
- Issue date Mar 27, 2018
- H.C. Starck Inc.
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Plated steel sheet for cans and production method thereof
- Patent number 8,679,643
- Issue date Mar 25, 2014
- Nippon Steel & Sumitomo Metal Corporation
- Hiromitsu Date
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Coated article and method of making the same
- Patent number 8,388,815
- Issue date Mar 5, 2013
- HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
- Hsin-Pei Chang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chlorine, fluorine and lithium co-doped transparent conductive film...
- Patent number 8,163,404
- Issue date Apr 24, 2012
- Industrial Technology Research Institute
- Syh-Yuh Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lead-based perovskite buffer for forming indium phosphide on silicon
- Patent number 6,872,252
- Issue date Mar 29, 2005
- Agilent Technologies, Inc.
- Jun Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper preservative treatment
- Patent number 6,815,088
- Issue date Nov 9, 2004
- International Business Machines Corporation
- Pietro Luigi Cavallotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bonding a conductive adhesive and an electrode, and a bon...
- Patent number 6,803,116
- Issue date Oct 12, 2004
- Murata Manufacturing Co., Ltd.
- Haruhiko Ikeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coated metal articles and method of making
- Patent number 6,760,396
- Issue date Jul 6, 2004
- The United States of America as represented by the United States Department o...
- Ernest R. Boller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...
- Patent number 6,740,427
- Issue date May 25, 2004
- Intel Corporation
- Madhav Datta
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Coated metal articles
- Patent number 6,687,324
- Issue date Feb 3, 2004
- Ernest R. Boller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper preservative treatment
- Patent number 6,635,123
- Issue date Oct 21, 2003
- International Business Machines Corporation
- Pletro Luigi Cavallotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball with chemically and mechanically enhanced surface prope...
- Patent number 6,607,613
- Issue date Aug 19, 2003
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin-clad substrates for use as current collectors, batteries compri...
- Patent number 6,582,482
- Issue date Jun 24, 2003
- GP Batteries International, Ltd.
- Leland M. Gillman
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Tin-clad substrates for use as current collectors, batteries compri...
- Patent number 6,579,647
- Issue date Jun 17, 2003
- GP Batteries International, Ltd.
- Leland M. Gillman
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Swash plate of swash plate type compressor
- Patent number 6,541,127
- Issue date Apr 1, 2003
- Taiho Kogyo Co., Ltd.
- Takashi Tomikawa
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Sliding bearing and its production method
- Patent number 6,309,759
- Issue date Oct 30, 2001
- Takashi Tomikawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,283,359
- Issue date Sep 4, 2001
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode modification using an unzippable polymer paste
- Patent number 6,281,105
- Issue date Aug 28, 2001
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bump
- Patent number 6,265,085
- Issue date Jul 24, 2001
- International Business Machines Coporation
- Tomofumi Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode modification using an unzippable polymer paste
- Patent number 6,221,503
- Issue date Apr 24, 2001
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced solder surface and process for chemically and mechanically...
- Patent number 6,210,547
- Issue date Apr 3, 2001
- International Business Machines Corporation
- Frank D. Egitto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gold plated solder material and method of fluxless soldering using...
- Patent number 6,203,929
- Issue date Mar 20, 2001
- TRW Inc.
- Heinrich G. Muller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate
- Patent number 6,197,435
- Issue date Mar 6, 2001
- Denki Kagaku Kogyo Kabushiki Kaisha
- Yoshihiko Tsujimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing fatigue life of ball grid arrays
- Patent number 6,158,644
- Issue date Dec 12, 2000
- International Business Machines Corporation
- Peter J. Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin coatings incorporating selected elemental additions to reduce d...
- Patent number 6,136,460
- Issue date Oct 24, 2000
- Olin Corporation
- Szuchain Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for assembling high temperature electronics
- Patent number 6,095,404
- Issue date Aug 1, 2000
- Innova Electronics, Inc.
- Charlie McAndrew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
- Publication number 20220308705
- Publication date Sep 29, 2022
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
- Publication number 20210208738
- Publication date Jul 8, 2021
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
- Publication number 20180175075
- Publication date Jun 21, 2018
- Shuwei Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COATED ARTICLE AND METHOD OF MAKING THE SAME
- Publication number 20120064363
- Publication date Mar 15, 2012
- HON HAI Precision Industry CO., LTD.
- HSIN-PEI CHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATED STEEL SHEET FOR CANS AND PRODUCTION METHOD THEREOF
- Publication number 20100119867
- Publication date May 13, 2010
- Hiromitsu Date
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CHLORINE, FLUORINE AND LITHIUM CO-DOPED TRANSPARENT CONDUCTIVE FILM...
- Publication number 20090162697
- Publication date Jun 25, 2009
- Industrial Technology Research Institute
- Syh-Yuh Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multilayer solder article
- Publication number 20070231594
- Publication date Oct 4, 2007
- John Pereira
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sintered sliding material, sliding member, connection device and de...
- Publication number 20070009757
- Publication date Jan 11, 2007
- Takemori Takayama
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Terminal having surface layer formed of Sn-Ag-Cu ternary alloy form...
- Publication number 20050123784
- Publication date Jun 9, 2005
- FCM CO., LTD.
- Shigeki Miura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cooper preservative treatment
- Publication number 20040020566
- Publication date Feb 5, 2004
- International Business Machines Corporation
- Pietro Luigi Cavallotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead-based perovskite buffer for forming indium phosphide on silicon
- Publication number 20030168000
- Publication date Sep 11, 2003
- Jun Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...
- Publication number 20030059644
- Publication date Mar 27, 2003
- Intel Corporation
- Madhav Datta
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method of bonding a conductive adhesive and an electrode, and a bon...
- Publication number 20020050320
- Publication date May 2, 2002
- Murata Manufacturing Co., Ltd.
- Haruhiko Ikeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Copper preservative treatment
- Publication number 20010030223
- Publication date Oct 18, 2001
- Pletro Luigi Cavallotti
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Solder ball with chemically and mechanically enhanced surface prope...
- Publication number 20010012570
- Publication date Aug 9, 2001
- Frank D. Egitto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Tin-clad substrates for use as current collectors, batteries compri...
- Publication number 20010001692
- Publication date May 24, 2001
- Leland M. Gillman
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Tin-clad substrates for use as current collectors, batteries compri...
- Publication number 20010001054
- Publication date May 10, 2001
- Leland M. Gillman
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Pb- and Sn-base components: alternative to or next to each other

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Copper-alloy capping layers for metallization in touch-panel displays

Copper-alloy capping layers for metallization in touch-panel displays

Thin-film transistor and method of forming an electrode of a thin-f...

Metal foil for electromagnetic shielding, electromagnetic shielding...

Copper-alloy capping layers for metallization in touch-panel displays

Plated steel sheet for cans and production method thereof

Coated article and method of making the same

Chlorine, fluorine and lithium co-doped transparent conductive film...

Lead-based perovskite buffer for forming indium phosphide on silicon

Copper preservative treatment

Method of bonding a conductive adhesive and an electrode, and a bon...

Coated metal articles and method of making

Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...

Coated metal articles

Copper preservative treatment

Solder ball with chemically and mechanically enhanced surface prope...

Tin-clad substrates for use as current collectors, batteries compri...

Tin-clad substrates for use as current collectors, batteries compri...

Swash plate of swash plate type compressor

Sliding bearing and its production method

Method for enhancing fatigue life of ball grid arrays

Electrode modification using an unzippable polymer paste

Bonding material and bump

Electrode modification using an unzippable polymer paste

Enhanced solder surface and process for chemically and mechanically...

Gold plated solder material and method of fluxless soldering using...

Substrate

Method for enhancing fatigue life of ball grid arrays

Tin coatings incorporating selected elemental additions to reduce d...

Method for assembling high temperature electronics

Patents Applicationslast 30 patents

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS

COATED ARTICLE AND METHOD OF MAKING THE SAME

PLATED STEEL SHEET FOR CANS AND PRODUCTION METHOD THEREOF

CHLORINE, FLUORINE AND LITHIUM CO-DOPED TRANSPARENT CONDUCTIVE FILM...

Multilayer solder article

Sintered sliding material, sliding member, connection device and de...

Terminal having surface layer formed of Sn-Ag-Cu ternary alloy form...

Cooper preservative treatment

Lead-based perovskite buffer for forming indium phosphide on silicon

Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...

Method of bonding a conductive adhesive and an electrode, and a bon...

Copper preservative treatment

Solder ball with chemically and mechanically enhanced surface prope...

Tin-clad substrates for use as current collectors, batteries compri...

Tin-clad substrates for use as current collectors, batteries compri...