PBRAM

Industry

CPC
H01L2924/1444

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1444PBRAM

Industries

Patents Grantslast 30 patents

Information Patent Grant
Memory devices having vertical transistors and methods for forming...
- Patent number 12,127,393
- Issue date Oct 22, 2024
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing self-aligned isolation s...
- Patent number 12,127,406
- Issue date Oct 22, 2024
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,749,635
- Issue date Sep 5, 2023
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory
- Patent number 11,296,066
- Issue date Apr 5, 2022
- Samsung Electronics Co., Ltd.
- Kyung-Hwa Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for stacking a memory chip above an integrated...
- Patent number 8,716,876
- Issue date May 6, 2014
- Altera Corporation
- Richard G. Smolen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING BACKSIDE SEMICONDUCTOR SO...
- Publication number 20250008736
- Publication date Jan 2, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Kartik SONDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT
- Publication number 20240162192
- Publication date May 16, 2024
- International Business Machines Corporation
- Arvind Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH MOLDED SEMICONDUCTOR DIES AND ASS...
- Publication number 20230268327
- Publication date Aug 24, 2023
- Micron Technology, Inc.
- See Hiong Leow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SELF-ALIGNED ISOLATION S...
- Publication number 20230232624
- Publication date Jul 20, 2023
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME
- Publication number 20230215826
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Jihong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...
- Publication number 20230133595
- Publication date May 4, 2023
- Yangtze Memory Technologies Co., Ltd.
- Tao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package
- Publication number 20230056755
- Publication date Feb 23, 2023
- Tienchien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20230049283
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Kyounglim SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20220130791
- Publication date Apr 28, 2022
- SK HYNIX INC.
- Nam Jae LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-VOLATILE MEMORY
- Publication number 20200365574
- Publication date Nov 19, 2020
- Samsung Electronics Co., Ltd.
- KYUNG-HWA YUN
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Memory devices having vertical transistors and methods for forming...

Three-dimensional memory device containing self-aligned isolation s...

Semiconductor device and manufacturing method of semiconductor device

Non-volatile memory

Systems and methods for stacking a memory chip above an integrated...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING BACKSIDE SEMICONDUCTOR SO...

STACKED 3D CACHE CONFIGURATION WITH ON-CHIP POWER SUPPORT

SEMICONDUCTOR DIE ASSEMBLIES WITH MOLDED SEMICONDUCTOR DIES AND ASS...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SELF-ALIGNED ISOLATION S...

SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME

MEMORY DEVICES HAVING VERTICAL TRANSISTORS AND METHODS FOR FORMING...

Semiconductor package

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

NON-VOLATILE MEMORY