PCB for one component

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CPC
H05K2201/049

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/049PCB for one component

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display device and method for driving display device
- Patent number 12,159,563
- Issue date Dec 3, 2024
- Samsung Display Co., Ltd.
- Jae Hyun Koh
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Flexible and stretchable structures
- Patent number 12,096,563
- Issue date Sep 17, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 12,086,350
- Issue date Sep 10, 2024
- Samsung Display Co., Ltd.
- Hyun-Wook Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device and an inspection method of a display device
- Patent number 12,016,116
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Yong Jin Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density organic bridge device and method
- Patent number 12,002,762
- Issue date Jun 4, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporter for electronic component
- Patent number 11,974,400
- Issue date Apr 30, 2024
- Samsung Display Co., Ltd.
- Seyoung Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and display device including the same
- Patent number 11,968,775
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Yeon Sun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and circuit board module thereof
- Patent number 11,917,747
- Issue date Feb 27, 2024
- Chicony Electronics Co., Ltd.
- Chien-Yueh Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Display device
- Patent number 11,882,649
- Issue date Jan 23, 2024
- Samsung Display Co., Ltd.
- Hee-Kwon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,785,720
- Issue date Oct 10, 2023
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Card retention connector system
- Patent number 11,785,717
- Issue date Oct 10, 2023
- International Business Machines Corporation
- Tyler Jandt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip on film package and display device including the same
- Patent number 11,756,850
- Issue date Sep 12, 2023
- Samsung Electronics Co., Ltd.
- Seung-Tae Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon heat-dissipation package for compact electronic devices
- Patent number 11,742,255
- Issue date Aug 29, 2023
- Gerald Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and an inspection method of a display device
- Patent number 11,690,168
- Issue date Jun 27, 2023
- Samsung Display Co., Ltd.
- Yong Jin Shin
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Connection structure and display device
- Patent number 11,690,175
- Issue date Jun 27, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Chang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and wiring substrate
- Patent number 11,668,984
- Issue date Jun 6, 2023
- Japan Display Inc.
- Hideaki Abe
- G02 - OPTICS
Information Patent Grant
Composite part with integral electronic instrumentation circuit and...
- Patent number 11,639,916
- Issue date May 2, 2023
- SAFRAN
- Sabri Janfaoui
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 11,622,449
- Issue date Apr 4, 2023
- Murata Manufacturing Co., Ltd.
- Satoshi Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Twistable electronic device module
- Patent number 11,546,997
- Issue date Jan 3, 2023
- National Taipei University of Technology
- Syang-Peng Rwei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including overlapping connection circuit boards
- Patent number 11,483,932
- Issue date Oct 25, 2022
- Samsung Display Co., Ltd.
- Bongchun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular wireless sensing device
- Patent number 11,473,945
- Issue date Oct 18, 2022
- BRIGHTSENTINEL HOLDING LTD
- Robert Leslie Keith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 11,464,105
- Issue date Oct 4, 2022
- Samsung Display Co., Ltd.
- Hee-Kwon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, electronic device, and electronic module
- Patent number 11,388,819
- Issue date Jul 12, 2022
- Kyocera Corporation
- Takuo Kisaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,380,978
- Issue date Jul 5, 2022
- Siliconware Precision Industries Co., Ltd.
- Shi-Min Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and wiring substrate
- Patent number 11,327,373
- Issue date May 10, 2022
- Japan Display Inc.
- Hideaki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic printed circuit board assembly for high-power components
- Patent number 11,272,617
- Issue date Mar 8, 2022
- ZKW GROUP GMBH
- Dietmar Kieslinger
- F21 - LIGHTING
Information Patent Grant
Interposer and electronic component including the same
- Patent number 11,264,166
- Issue date Mar 1, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Su Rim Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,224,125
- Issue date Jan 11, 2022
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Composite electronic component and board having the same
- Patent number 11,206,737
- Issue date Dec 21, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Su Byun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTION COOKING HOB HAVING TWO BOARD ELEMENTS ELECTRICALLY AND ME...
- Publication number 20240260190
- Publication date Aug 1, 2024
- Electrolux Appliances Aktiebolag
- Alex VIROLI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS
- Publication number 20240196531
- Publication date Jun 13, 2024
- Dexcom, Inc.
- Sean Frick
- G01 - MEASURING TESTING
Information Patent Application
CONDUCTIVE INK INTERCONNECTED DEVICES
- Publication number 20240074045
- Publication date Feb 29, 2024
- NCR Corporation
- John Paul Bacalso Aliganga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND AN INSPECTION METHOD OF A DISPLAY DEVICE
- Publication number 20230328876
- Publication date Oct 12, 2023
- SAMSUNG DISPLAY CO., LTD.
- Yong Jin SHIN
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
ASSEMBLY AND HARNESS ASSEMBLY
- Publication number 20230187865
- Publication date Jun 15, 2023
- Japan Aviation Electronics Industry, Limited
- Kentaro TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230042192
- Publication date Feb 9, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hee-Kwon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOTHERBOARD
- Publication number 20220377894
- Publication date Nov 24, 2022
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Hui ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND TERMINAL
- Publication number 20220295634
- Publication date Sep 15, 2022
- Spreadtrum Communications (Shanghai) CO., Ltd.
- Yuanyuan CAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORTER FOR ELECTRONIC COMPONENT
- Publication number 20220225509
- Publication date Jul 14, 2022
- SAMSUNG DISPLAY CO., LTD.
- Seyoung OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARD RETENTION CONNECTOR SYSTEM
- Publication number 20220201859
- Publication date Jun 23, 2022
- International Business Machines Corporation
- TYLER JANDT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20220151058
- Publication date May 12, 2022
- SAMSUNG DISPLAY CO., LTD.
- Yeon Sun NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE AND STRETCHABLE STRUCTURES
- Publication number 20220071014
- Publication date Mar 3, 2022
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20210398870
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Seung-Tae Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND DISPLAY DEVICE
- Publication number 20210400814
- Publication date Dec 23, 2021
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Chang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Package with Interposers
- Publication number 20210391230
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210259097
- Publication date Aug 19, 2021
- SAMSUNG DISPLAY CO., LTD.
- Hee-Kwon Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE AND AN INSPECTION METHOD OF A DISPLAY DEVICE
- Publication number 20210153343
- Publication date May 20, 2021
- SAMSUNG DISPLAY CO., LTD.
- Yong Jin SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Printed Circuit Board Assembly for High-Power Components
- Publication number 20210092846
- Publication date Mar 25, 2021
- ZKW GROUP GMBH
- Dietmar KIESLINGER
- F21 - LIGHTING
Information Patent Application
DISPLAY DEVICE
- Publication number 20210036092
- Publication date Feb 4, 2021
- SHARP KABUSHIKI KAISHA
- ASAHI YAMATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTER SYSTEM WITH MODIFIED MODULE SOCKET
- Publication number 20200412045
- Publication date Dec 31, 2020
- International Business Machines Corporation
- Charles Leon Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20200352029
- Publication date Nov 5, 2020
- KYOCERA CORPORATION
- Takuo KISAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERPOSER AND ELECTRONIC COMPONENT INCLUDING THE SAME
- Publication number 20200343044
- Publication date Oct 29, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Su Rim BAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20200323080
- Publication date Oct 8, 2020
- HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
- HOU-YUAN CHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20200303276
- Publication date Sep 24, 2020
- Samsung Electronics Co., Ltd.
- Seung-Tae Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING OVERLAPPING CONNECTION CIRCUIT BOARDS
- Publication number 20200267842
- Publication date Aug 20, 2020
- SAMSUNG DISPLAY CO., LTD.
- BONGCHUN PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20200176543
- Publication date Jun 4, 2020
- SAMSUNG DISPLAY CO., LTD.
- Soon Sung PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...
- Publication number 20200170105
- Publication date May 28, 2020
- Possehl Electronics Deutschland GmbH
- Dietmar Kurzeja
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PCB STRAIN RELIEF
- Publication number 20200113044
- Publication date Apr 9, 2020
- TRW AUTOMOTIVE U.S. LLC
- Thomas E. Blake
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Publication number 20200092999
- Publication date Mar 19, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Man Su BYUN
- H01 - BASIC ELECTRIC ELEMENTS

PCB for one component

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method for driving display device

Flexible and stretchable structures

Display device

Display device and an inspection method of a display device

High density organic bridge device and method

Supporter for electronic component

Printed circuit board and display device including the same

Sensor interposer employing castellated through-vias

Electronic device and circuit board module thereof

Display device

Multilayer ceramic capacitor

Card retention connector system

Chip on film package and display device including the same

Silicon heat-dissipation package for compact electronic devices

Display device and an inspection method of a display device

Connection structure and display device

Display device and wiring substrate

Composite part with integral electronic instrumentation circuit and...

Multilayer ceramic capacitor

Twistable electronic device module

Display device including overlapping connection circuit boards

Modular wireless sensing device

Display device

Wiring board, electronic device, and electronic module

Electronic package and method for fabricating the same

Display device and wiring substrate

Electronic printed circuit board assembly for high-power components

Interposer and electronic component including the same

Sensor interposer employing castellated through-vias

Composite electronic component and board having the same

Patents Applicationslast 30 patents

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

INDUCTION COOKING HOB HAVING TWO BOARD ELEMENTS ELECTRICALLY AND ME...

SENSOR INTERPOSER EMPLOYING CASTELLATED THROUGH-VIAS

CONDUCTIVE INK INTERCONNECTED DEVICES

DISPLAY DEVICE AND AN INSPECTION METHOD OF A DISPLAY DEVICE

ASSEMBLY AND HARNESS ASSEMBLY

DISPLAY DEVICE

MOTHERBOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND TERMINAL

SUPPORTER FOR ELECTRONIC COMPONENT

CARD RETENTION CONNECTOR SYSTEM

PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUDING THE SAME

FLEXIBLE AND STRETCHABLE STRUCTURES

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

CONNECTION STRUCTURE AND DISPLAY DEVICE

Methods and Apparatus for Package with Interposers

DISPLAY DEVICE

DISPLAY DEVICE AND AN INSPECTION METHOD OF A DISPLAY DEVICE

Electronic Printed Circuit Board Assembly for High-Power Components

DISPLAY DEVICE

COMPUTER SYSTEM WITH MODIFIED MODULE SOCKET

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

INTERPOSER AND ELECTRONIC COMPONENT INCLUDING THE SAME

CIRCUIT BOARD

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

DISPLAY DEVICE INCLUDING OVERLAPPING CONNECTION CIRCUIT BOARDS

DISPLAY DEVICE

CONDUCTOR PATH STRUCTURE HAVING A COMPONENT RECEIVED IN A VIBRATION...

PCB STRAIN RELIEF

COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME