PCB or component having an integral separable or breakable part

Industry

CPC
H05K2201/09127

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09127PCB or component having an integral separable or breakable part

Industries

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of processed resin substrate and laser process...
- Patent number 11,338,393
- Issue date May 24, 2022
- LASER SYSTEMS INC.
- Kock Khuen Seet
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanically robust component carrier with rigid and flexible portions
- Patent number 11,324,126
- Issue date May 3, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Bund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separable modules PCB modules
- Patent number 11,277,906
- Issue date Mar 15, 2022
- SIGNIFY HOLDING B.V.
- Remco Christianus Wilhelmus Leermakers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monitoring circuitry
- Patent number 11,240,913
- Issue date Feb 1, 2022
- HP INDIGO B.V.
- Gideon Amir
- G01 - MEASURING TESTING
Information Patent Grant
Protective film of conductive adhesive, circuit board, and method f...
- Patent number 10,993,316
- Issue date Apr 27, 2021
- BOE (Hebei) Mobile Display Technology Co., Ltd.
- Lei Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with alternatingly vertically stacked layer struc...
- Patent number 10,834,831
- Issue date Nov 10, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing rigid-flexible circuit board
- Patent number 10,765,013
- Issue date Sep 1, 2020
- Avary Holding (Shenzhen) Co., Limited.
- Biao Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Monitoring circuitry
- Patent number 10,701,803
- Issue date Jun 30, 2020
- HP INDIGO B.V.
- Gideon Amir
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Versatile and reliable intelligent package
- Patent number 10,607,950
- Issue date Mar 31, 2020
- Stora Enso Oyj
- Juha Maijala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio-frequency antenna, radio-frequency substrate with radio-frequ...
- Patent number 10,602,606
- Issue date Mar 24, 2020
- Schweizer Electronic AG
- Thomas Gottwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor-structure element having an internal layer substrate lami...
- Patent number 10,555,419
- Issue date Feb 4, 2020
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light board
- Patent number 10,465,889
- Issue date Nov 5, 2019
- Hubbell Incorporated
- Derek B. Baker
- F21 - LIGHTING
Information Patent Grant
Method for manufacturing circuit board, and circuit board
- Patent number 10,433,423
- Issue date Oct 1, 2019
- SUMITOMO WIRING SYSTEMS, LTD.
- Tsuyoshi Sakita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit and a method of fabricating a flexible pri...
- Patent number 10,420,215
- Issue date Sep 17, 2019
- 3M Innovative Properties Company
- Siang Sin Foo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
LED lighting system incorporating folded light sheets
- Patent number 10,393,330
- Issue date Aug 27, 2019
- COOLEDGE LIGHTING INC.
- Michael A. Tischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated connector for electronic device
- Patent number 10,355,384
- Issue date Jul 16, 2019
- Intel Corporation
- Kit Chew Chee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit board, and production method therefor
- Patent number 10,286,702
- Issue date May 14, 2019
- KOMURA-TECH CO., LTD.
- Tadashi Kawamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Mother ceramic substrate, ceramic substrate, mother module componen...
- Patent number 10,257,927
- Issue date Apr 9, 2019
- Murata Manufacturing Co., Ltd.
- Yukio Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for synchronizing a plurality of RFID interroga...
- Patent number 10,235,545
- Issue date Mar 19, 2019
- SMARTRAC TECHNOLOGY FLETCHER, INC.
- James Robert Kruest
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Board mounted LED array
- Patent number 10,222,010
- Issue date Mar 5, 2019
- Philips Lighting Holding B.V.
- Michel Cornelis Josephus Marie Vissenberg
- F21 - LIGHTING
Information Patent Grant
Flexible circuit substrate with temporary supports and equalized la...
- Patent number 10,199,323
- Issue date Feb 5, 2019
- Apple Inc.
- Yung-Yu Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Biocompatible bonding method and electronics package suitable for i...
- Patent number 10,159,845
- Issue date Dec 25, 2018
- Second Sight Medical Products, Inc.
- Robert J. Greenberg
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Systems and methods for stirring electromagnetic fields and interro...
- Patent number 10,133,894
- Issue date Nov 20, 2018
- SMARTAC TECHNOLOGY FLETCHER, INC.
- James Robert Kruest
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light board
- Patent number 10,054,300
- Issue date Aug 21, 2018
- Hubbell Incorporated
- Derek B. Baker
- F21 - LIGHTING
Information Patent Grant
Circuit board enclosure with security features preventing disassemb...
- Patent number 10,049,845
- Issue date Aug 14, 2018
- Gilbert Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the production of a circuit board involving the removal...
- Patent number 10,051,747
- Issue date Aug 14, 2018
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combined wiring board and method for manufacturing the same
- Patent number 10,004,145
- Issue date Jun 19, 2018
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 10,004,143
- Issue date Jun 19, 2018
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 9,999,141
- Issue date Jun 12, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong-Ho Baek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-bend printed circuit board fabrication
- Patent number 9,992,880
- Issue date Jun 5, 2018
- Multek Technologies Limited
- Pui Yin Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Electronic Prototyping
- Publication number 20240008174
- Publication date Jan 4, 2024
- Microsoft Technology Licensing, LLC
- Stephen Edward HODGES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...
- Publication number 20230328900
- Publication date Oct 12, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEPARABLE MODULES PCB MODULES
- Publication number 20210385945
- Publication date Dec 9, 2021
- SIGNIFY HOLDING B.V.
- REMCO CHRISTIANUS WILHELMUS LEERMAKERS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mechanically Robust Component Carrier With Rigid and Flexible Portions
- Publication number 20200367370
- Publication date Nov 19, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Bund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MONITORING CIRCUITRY
- Publication number 20200267836
- Publication date Aug 20, 2020
- HP INDIGO B.V.
- Gideon AMIR
- G01 - MEASURING TESTING
Information Patent Application
Mechanically Robust Component Carrier With Rigid and Flexible Portions
- Publication number 20200053887
- Publication date Feb 13, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Bund
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MONITORING CIRCUITRY
- Publication number 20190150280
- Publication date May 16, 2019
- HP INDIGO B.V.
- Gideon AMIR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING RIGID-FLEXIBLE CIRCUIT BOARD
- Publication number 20190069418
- Publication date Feb 28, 2019
- Avary Holding (Shenzhen) Co., Limited.
- BIAO LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT BOARD
- Publication number 20180340680
- Publication date Nov 29, 2018
- HUBBELL INCORPORATED
- Derek B. Baker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
USE OF NONSTICK MATERIAL FOR THE PRODUCTION OF CAVITIES IN A PRINTE...
- Publication number 20180257364
- Publication date Sep 13, 2018
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Gerald Weidinger
- B32 - LAYERED PRODUCTS
Information Patent Application
Radio-frequency antenna, radio-frequency substrate with radio-frequ...
- Publication number 20180220526
- Publication date Aug 2, 2018
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT BOARD, AND PRODUCTION METHOD THEREFOR
- Publication number 20180001683
- Publication date Jan 4, 2018
- KOMURA-TECH CO., LTD.
- Tadashi Kawamoto
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CIRCUIT BOARD ENCLOSURE WITH SECURITY FEATURES PREVENTING DISASSEMB...
- Publication number 20170352513
- Publication date Dec 7, 2017
- Gilbert Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERSATILE AND RELIABLE INTELLIGENT PACKAGE
- Publication number 20170330845
- Publication date Nov 16, 2017
- STORA ENSO OYJ
- Juha MAIJALA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MOTHER CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, MOTHER MODULE COMPONEN...
- Publication number 20170079137
- Publication date Mar 16, 2017
- MURATA MANUFACTURING CO., LTD.
- Yukio MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR BREAKAWAY RFID TAGS
- Publication number 20170068882
- Publication date Mar 9, 2017
- NEOLOGY, INC.
- Paul Elizondo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE PRINTED CIRCUIT AND A METHOD OF FABRICATING A FLEXIBLE PRI...
- Publication number 20150144381
- Publication date May 28, 2015
- Siang Sin Foo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the Production of a Circuit Board Involving the Removal...
- Publication number 20140373350
- Publication date Dec 25, 2014
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF FORMING THE...
- Publication number 20140367155
- Publication date Dec 18, 2014
- Tang-Chieh HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD UNIT, MANUFACTURING METHOD THEREOF, AND MANUFACTURING...
- Publication number 20140353024
- Publication date Dec 4, 2014
- NGK Spark Plug Co., Ltd.
- Kensuke MATSUHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140353014
- Publication date Dec 4, 2014
- MUTUAL-TEK INDUSTRIES CO., LTD.
- Wen-Chin Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the Production of a Circuit Board involving the Removal...
- Publication number 20140331494
- Publication date Nov 13, 2014
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND PROCESS FOR ATTACHING DEVICES TO A CIRCUIT BOARD
- Publication number 20140317917
- Publication date Oct 30, 2014
- Signalcraft Technologies
- Bernard Gobeil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF A RIGID-FLEXIBLE CIRCUIT BOARD AND RIGID-FLEX...
- Publication number 20140318832
- Publication date Oct 30, 2014
- Yong Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPACT RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFAC...
- Publication number 20140305683
- Publication date Oct 16, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- BIAO LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A RIGID-FLEX PRINTED CIRCUIT BOARD OR A SUB...
- Publication number 20140216792
- Publication date Aug 7, 2014
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Simon Sebanz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND THE PROCESS MANUFACTURING THE SAME
- Publication number 20140216802
- Publication date Aug 7, 2014
- Yu-Ru Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION P...
- Publication number 20140216795
- Publication date Aug 7, 2014
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Günther Weichslberger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER DEVICE FOR WAVE SOLDERING
- Publication number 20140182909
- Publication date Jul 3, 2014
- International Business Machines Corporation
- Stephen M. Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140182899
- Publication date Jul 3, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- BIAO LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

PCB or component having an integral separable or breakable part

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method of processed resin substrate and laser process...

Mechanically robust component carrier with rigid and flexible portions

Separable modules PCB modules

Monitoring circuitry

Protective film of conductive adhesive, circuit board, and method f...

Component carrier with alternatingly vertically stacked layer struc...

Method for manufacturing rigid-flexible circuit board

Monitoring circuitry

Versatile and reliable intelligent package

Radio-frequency antenna, radio-frequency substrate with radio-frequ...

Conductor-structure element having an internal layer substrate lami...

Light board

Method for manufacturing circuit board, and circuit board

Flexible printed circuit and a method of fabricating a flexible pri...

LED lighting system incorporating folded light sheets

Integrated connector for electronic device

Electronic circuit board, and production method therefor

Mother ceramic substrate, ceramic substrate, mother module componen...

Systems and methods for synchronizing a plurality of RFID interroga...

Board mounted LED array

Flexible circuit substrate with temporary supports and equalized la...

Biocompatible bonding method and electronics package suitable for i...

Systems and methods for stirring electromagnetic fields and interro...

Light board

Circuit board enclosure with security features preventing disassemb...

Method for the production of a circuit board involving the removal...

Combined wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing printed wiring board

Printed circuit board and method for manufacturing the same

Rigid-bend printed circuit board fabrication

Patents Applicationslast 30 patents

Electronic Prototyping

CIRCUIT BOARD AND CIRCUIT BOARD MODULE WITH DOCKING STRUCTURE AND M...

SEPARABLE MODULES PCB MODULES

Mechanically Robust Component Carrier With Rigid and Flexible Portions

MONITORING CIRCUITRY

Mechanically Robust Component Carrier With Rigid and Flexible Portions

MONITORING CIRCUITRY

METHOD FOR MANUFACTURING RIGID-FLEXIBLE CIRCUIT BOARD

LIGHT BOARD

USE OF NONSTICK MATERIAL FOR THE PRODUCTION OF CAVITIES IN A PRINTE...

Radio-frequency antenna, radio-frequency substrate with radio-frequ...

ELECTRONIC CIRCUIT BOARD, AND PRODUCTION METHOD THEREFOR

CIRCUIT BOARD ENCLOSURE WITH SECURITY FEATURES PREVENTING DISASSEMB...

VERSATILE AND RELIABLE INTELLIGENT PACKAGE

MOTHER CERAMIC SUBSTRATE, CERAMIC SUBSTRATE, MOTHER MODULE COMPONEN...

SYSTEMS AND METHODS FOR BREAKAWAY RFID TAGS

FLEXIBLE PRINTED CIRCUIT AND A METHOD OF FABRICATING A FLEXIBLE PRI...

Method for the Production of a Circuit Board Involving the Removal...

COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF FORMING THE...

WIRING BOARD UNIT, MANUFACTURING METHOD THEREOF, AND MANUFACTURING...

COMBINED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Method for the Production of a Circuit Board involving the Removal...

APPARATUS AND PROCESS FOR ATTACHING DEVICES TO A CIRCUIT BOARD

FABRICATION METHOD OF A RIGID-FLEXIBLE CIRCUIT BOARD AND RIGID-FLEX...

COMPACT RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFAC...

METHOD OF MANUFACTURING A RIGID-FLEX PRINTED CIRCUIT BOARD OR A SUB...

SUBSTRATE STRUCTURE AND THE PROCESS MANUFACTURING THE SAME

METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION P...

HEAT TRANSFER DEVICE FOR WAVE SOLDERING

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME