Perforating

Industry

CPC
H05K2203/0221

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0221Perforating

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed wiring board and resin sheet with...
- Patent number 12,120,827
- Issue date Oct 15, 2024
- Ajinomoto Co., Inc.
- Kazuhiko Tsurui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing flexible circuit board
- Patent number 11,516,926
- Issue date Nov 29, 2022
- Innolux Corporation
- Pai-Chi Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing an electrical through connection between opposi...
- Patent number 10,687,426
- Issue date Jun 16, 2020
- Saralon GmbH
- Moazzam Ali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a circuit board by punching
- Patent number 10,651,320
- Issue date May 12, 2020
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an intermediate product for an interposer a...
- Patent number 9,974,192
- Issue date May 15, 2018
- Ashai Glass Company, Limited
- Shintaro Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Current sensing system
- Patent number 9,696,349
- Issue date Jul 4, 2017
- General Electric Company
- Ruxi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an intermediate product for an interposer a...
- Patent number 9,674,956
- Issue date Jun 6, 2017
- Asahi Glass Company, Limited
- Shintaro Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a circuit board by punching
- Patent number 9,478,674
- Issue date Oct 25, 2016
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit board and method for making same
- Patent number 9,357,631
- Issue date May 31, 2016
- FuKui Precision Component (Shenzhen) Co., Ltd.
- Ming-Jaan Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for interconnecting tracks present on opposite sides of a su...
- Patent number 7,992,295
- Issue date Aug 9, 2011
- Meco Equipment Engineers B.V.
- Augustinus Cornelis Maria Van De Ven
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having external connection terminals and metho...
- Patent number 7,944,051
- Issue date May 17, 2011
- Renesas Electronics Corporation
- Fumiyoshi Kawashiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabric type semiconductor device package and methods of installing...
- Patent number 7,638,885
- Issue date Dec 29, 2009
- Korea Advanced Institute of Science and Technology
- Hoi-Jun Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming contact hole, method of manufacturing wiring boar...
- Patent number 7,589,018
- Issue date Sep 15, 2009
- Seiko Epson Corporation
- Soichi Moriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for producing a wiring board, including film-p...
- Patent number 7,481,901
- Issue date Jan 27, 2009
- NGK Spark Plug Co., Ltd.
- Yasushi Toyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming contact hole, for manufacturing circuit board a...
- Patent number 7,459,793
- Issue date Dec 2, 2008
- Seiko Epson Corporation
- Mitsuaki Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wiring substrate
- Patent number 7,350,297
- Issue date Apr 1, 2008
- Kabushiki Kaisha Toshiba
- Naoko Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming contact hole, for manufacturing circuit board a...
- Patent number 7,199,049
- Issue date Apr 3, 2007
- Seiko Epson Corporation
- Mitsuaki Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Throughplating of flexible printed boards
- Patent number 7,000,845
- Issue date Feb 21, 2006
- Giesecke & Devrient GmbH
- Ando Welling
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for preparing a double-sided flexible circuit board with ele...
- Patent number 5,131,141
- Issue date Jul 21, 1992
- Shin-Etsu Polymer Co., Ltd.
- Toshiyuki Kawaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing double-sided wiring substrate
- Patent number 5,049,244
- Issue date Sep 17, 1991
- Casio Computer Co., Ltd.
- Yoshio Yarita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of interconnecting conductors of different layers of a multi...
- Patent number 4,663,840
- Issue date May 12, 1987
- U.S. Philips Corporation
- Henricus D. U. Ubbens
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3882264
- Patent number 3,882,264
- Issue date May 6, 1975
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3501831
- Patent number 3,501,831
- Issue date Mar 24, 1970
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3354542
- Patent number 3,354,542
- Issue date Nov 28, 1967
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3346950
- Patent number 3,346,950
- Issue date Oct 17, 1967
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
2353061
- Patent number 2,353,061
- Issue date Jul 4, 1944
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND RESIN SHEET WITH...
- Publication number 20210014974
- Publication date Jan 14, 2021
- AJINOMOTO CO., INC.
- Kazuhiko TSURUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD
- Publication number 20200178402
- Publication date Jun 4, 2020
- InnoLux Corporation
- Pai-Chi TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PRODUCING AN ELECTRICAL THROUGH CONNECTION BETWEEN OPPOSI...
- Publication number 20200100366
- Publication date Mar 26, 2020
- Saralon GmbH
- Moazzam Ali
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING
- Publication number 20190288127
- Publication date Sep 19, 2019
- DSM IP Assets, B.V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE AND MANUFACTURING METHOD OF GLASS SUBSTRATE
- Publication number 20180312432
- Publication date Nov 1, 2018
- Asahi Glass Company, Limited
- Kohei HORIUCHI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150296618
- Publication date Oct 15, 2015
- Subtron Technology Co., Ltd.
- Yu-Chi Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING AN INTERMEDIATE PRODUCT FOR AN INTERPOSER A...
- Publication number 20150173191
- Publication date Jun 18, 2015
- ASAHI GLASS COMPANY, LIMITED
- Shintaro TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL PATTERN LAMINATE, METHOD FOR PUNCHING METAL FOIL, CIRCUI...
- Publication number 20130247977
- Publication date Sep 26, 2013
- Toppan Printing Co., Ltd.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING EXTERNAL CONNECTION TERMINALS AND METHO...
- Publication number 20090026615
- Publication date Jan 29, 2009
- NEC ELECTRONICS CORPORATION
- Fumiyoshi KAWASHIRO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Interconnecting Tracks Present on Opposite Sides of a Su...
- Publication number 20080301936
- Publication date Dec 11, 2008
- MECO EQUIPMENT ENGINEERS B.V. (A DUTCH CORP.)
- Augustinus Cornelis Maria Van De Ven
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FABRIC TYPE SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF INSTALLING...
- Publication number 20080258314
- Publication date Oct 23, 2008
- Hoi-Jun Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Producing A Three-Dimensional Circuit
- Publication number 20080199597
- Publication date Aug 21, 2008
- Arved Huebler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming contact hole, method of manufacturing wiring boar...
- Publication number 20080113466
- Publication date May 15, 2008
- SEIKO EPSON CORPORATION
- Soichi Moriya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR FORMING CONTACT HOLE, FOR MANUFACTURING CIRCUIT BOARD A...
- Publication number 20060263945
- Publication date Nov 23, 2006
- SEIKO EPSON CORPORATION
- Mitsuaki HARADA
- G02 - OPTICS
Information Patent Application
Wiring substrate and manufacturing method thereof
- Publication number 20060194031
- Publication date Aug 31, 2006
- Naoko Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for producing a wiring board, including film-p...
- Publication number 20060118228
- Publication date Jun 8, 2006
- NGK SPARK PLUG CO., LTD.
- Yasushi Toyoda
- B32 - LAYERED PRODUCTS
Information Patent Application
Film peeling apparatus and method of manufacturing wiring board
- Publication number 20060076104
- Publication date Apr 13, 2006
- NGK SPARK PLUG CO., LTD.
- Masashi Inaishi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Methods for forming contact hole, for manufacturing circuit board a...
- Publication number 20060024957
- Publication date Feb 2, 2006
- SEIKO EPSON CORPORATION
- Mitsuaki Harada
- G02 - OPTICS
Information Patent Application
Replaceable LED module
- Publication number 20050201068
- Publication date Sep 15, 2005
- Eric W. Kramer
- F21 - LIGHTING
Information Patent Application
throughplating of flexible printed boards
- Publication number 20040206829
- Publication date Oct 21, 2004
- Ando Welling
- G06 - COMPUTING CALCULATING COUNTING

Perforating

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing printed wiring board and resin sheet with...

Method for manufacturing flexible circuit board

Method of producing an electrical through connection between opposi...

Method of manufacturing a circuit board by punching

Method of manufacturing an intermediate product for an interposer a...

Current sensing system

Method of manufacturing an intermediate product for an interposer a...

Method of manufacturing a circuit board by punching

Flexible printed circuit board and method for making same

Method for interconnecting tracks present on opposite sides of a su...

Semiconductor device having external connection terminals and metho...

Fabric type semiconductor device package and methods of installing...

Method of forming contact hole, method of manufacturing wiring boar...

Method and apparatus for producing a wiring board, including film-p...

Methods for forming contact hole, for manufacturing circuit board a...

Method of manufacturing a wiring substrate

Methods for forming contact hole, for manufacturing circuit board a...

Throughplating of flexible printed boards

Method for preparing a double-sided flexible circuit board with ele...

Method of manufacturing double-sided wiring substrate

Method of interconnecting conductors of different layers of a multi...

3882264

3501831

3354542

3346950

2353061

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND RESIN SHEET WITH...

METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD

METHOD OF PRODUCING AN ELECTRICAL THROUGH CONNECTION BETWEEN OPPOSI...

METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING

GLASS SUBSTRATE AND MANUFACTURING METHOD OF GLASS SUBSTRATE

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING AN INTERMEDIATE PRODUCT FOR AN INTERPOSER A...

METAL FOIL PATTERN LAMINATE, METHOD FOR PUNCHING METAL FOIL, CIRCUI...

SEMICONDUCTOR DEVICE HAVING EXTERNAL CONNECTION TERMINALS AND METHO...

Method For Interconnecting Tracks Present on Opposite Sides of a Su...

FABRIC TYPE SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF INSTALLING...

Method For Producing A Three-Dimensional Circuit

Method of forming contact hole, method of manufacturing wiring boar...

METHODS FOR FORMING CONTACT HOLE, FOR MANUFACTURING CIRCUIT BOARD A...

Wiring substrate and manufacturing method thereof

Method and apparatus for producing a wiring board, including film-p...

Film peeling apparatus and method of manufacturing wiring board

Methods for forming contact hole, for manufacturing circuit board a...

Replaceable LED module

throughplating of flexible printed boards