3346950

Information

• Patent Grant
• 3346950

• References
• Source

• Patent Number

  3,346,950

• Date Filed

  Not available

• Date Issued

  Tuesday, October 17, 1967
  57 years ago

• CPC

  • H01L21/4846 - Leads on or in insulating or insulated substrates
  • H01L23/5384 - Conductive vias through the substrate with or without pins
  • H05K3/4084 - by deforming at least one of the conductive layers
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • H05K1/0289 - having a matrix lay-out
  • H05K1/0393 - Flexible materials
  • H05K3/423 - characterised by electroplating method
  • H05K2201/0394 - Conductor crossing over a hole in the substrate
  • H05K2201/091 - Locally and permanently deformed areas including dielectric material
  • H05K2201/09509 - Blind vias
  • H05K2201/09827 - Tapered
  • H05K2203/0195 - Tool for a process not provided for in H05K3/00
  • H05K2203/0221 - Perforating
  • H05K2203/1189 - Pressing leads, bumps or a die through an insulating layer
  • Y10T29/49167 - with deforming of conductive path

• US Classifications

  • 029 - Metal working
  • 174 - Electricity: conductors and insulators
  • 439 - Electrical connectors