Permanent masks, i.e. masks left in the finished device

Industry

CPC
H01L2224/0348

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0348Permanent masks, i.e. masks left in the finished device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 11,894,299
- Issue date Feb 6, 2024
- TAIWAN SEMICONDUCTOR LTD
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 11,335,659
- Issue date May 17, 2022
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,183,399
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,101,140
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and fabricating method thereof
- Patent number 10,985,121
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive traces in semiconductor devices and methods of forming same
- Patent number 10,937,734
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collars for under-bump metal structures and associated systems and...
- Patent number 10,886,244
- Issue date Jan 5, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 10,818,583
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for interconnects in 3D integrated device
- Patent number 10,354,975
- Issue date Jul 16, 2019
- Raytheon Company
- Edward R. Soares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip part and manufacturing method thereof
- Patent number 10,342,138
- Issue date Jul 2, 2019
- Rohm Co., Ltd.
- Yasuhiro Kondo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and fabricating method thereof
- Patent number 10,163,828
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 10,090,231
- Issue date Oct 2, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated device package comprising photo sensitive fill between a...
- Patent number 10,037,941
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Vladimir Noveski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a contact
- Patent number 10,032,887
- Issue date Jul 24, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding mechanisms for semiconductor wafers
- Patent number 9,960,129
- Issue date May 1, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices, methods of manufacture thereof, and semicond...
- Patent number 9,773,724
- Issue date Sep 26, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and an electronic device
- Patent number 9,711,630
- Issue date Jul 18, 2017
- Renesas Electronics Corporation
- Yasuyuki Yoshinaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing of thick metal pads
- Patent number 9,673,157
- Issue date Jun 6, 2017
- Infineon Technologies AG
- Paul Ganitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure and fabrication process thereof
- Patent number 9,653,355
- Issue date May 16, 2017
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming openings and trenches i...
- Patent number 9,607,958
- Issue date Mar 28, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common drain semiconductor device structure and method
- Patent number 9,607,984
- Issue date Mar 28, 2017
- Semiconductor Components Industries, LLC
- Kazumasa Takenaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor constructions having through-substrate interconnects
- Patent number 9,583,419
- Issue date Feb 28, 2017
- Micron Technology, Inc.
- Alan G. Wood
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with patterned underbump metallization and polym...
- Patent number 9,576,923
- Issue date Feb 21, 2017
- ATI Technologies ULC
- Roden R. Topacio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages with an intermetallic lay...
- Patent number 9,564,409
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for wafer-level processing of QFN packages
- Patent number 9,472,451
- Issue date Oct 18, 2016
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bowl-shaped solder structure
- Patent number 9,455,237
- Issue date Sep 27, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED DEVICE COMPRISING ELONGATED PADS
- Publication number 20240297129
- Publication date Sep 5, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
- Publication number 20230378106
- Publication date Nov 23, 2023
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...
- Publication number 20210151400
- Publication date May 20, 2021
- Micron Technology, Inc.
- Giorgio Mariottini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20200027750
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR INTERCONNECTS IN 3D INTEGRATED DEVICE
- Publication number 20190267353
- Publication date Aug 29, 2019
- Raytheon Company
- Edward R. Soares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20190148166
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20190115312
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHANG-PIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...
- Publication number 20180019191
- Publication date Jan 18, 2018
- Invensas Corporation
- Cyprian Emeka UZOH
- B32 - LAYERED PRODUCTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20180012830
- Publication date Jan 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Contact
- Publication number 20170365691
- Publication date Dec 21, 2017
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER RESIST REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140273431
- Publication date Sep 18, 2014
- Motohiko Sasagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING BUMP STRUCTURE
- Publication number 20140242791
- Publication date Aug 28, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...
- Publication number 20140210074
- Publication date Jul 31, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- I-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK WITH ELECTRICALLY INSULATING WALLS
- Publication number 20140206143
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STACK WITH ELECTRICALLY INSULATING WALLS
- Publication number 20140203428
- Publication date Jul 24, 2014
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MAKING A STRUCTURE FOR RESUMING CONTACT
- Publication number 20140183778
- Publication date Jul 3, 2014
- STMicroelectronics (Crolles 2) SAS
- Jean-Philippe COLONNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF
- Publication number 20140167256
- Publication date Jun 19, 2014
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY
- Publication number 20140144690
- Publication date May 29, 2014
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Gabriel Pares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140145343
- Publication date May 29, 2014
- SK HYNIX INC.
- Jong Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING MECHANISMS FOR SEMICONDUCTOR WAFERS
- Publication number 20140117546
- Publication date May 1, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDABLE TOP METAL CONTACTS FOR GALLIUM NITRIDE POWER DEVICES
- Publication number 20140070226
- Publication date Mar 13, 2014
- AVOGY, INC.
- Brian Joel Alvarez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer System and Method
- Publication number 20140042643
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING A SEMICONDUCTOR STRUCTURE AND RELATED STRUCTURES
- Publication number 20140042618
- Publication date Feb 13, 2014
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CONNECTION STRUCTURE AND METHOD OF FORMING
- Publication number 20130299989
- Publication date Nov 14, 2013
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED SOLDER-ON-DIE INTEGRATIONS ON PACKAGES AND METHODS OF AS...
- Publication number 20130277837
- Publication date Oct 24, 2013
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming Openings and Trenches i...
- Publication number 20130249080
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Compliant Conductive Int...
- Publication number 20130241071
- Publication date Sep 19, 2013
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip and Methods for Producing the Same
- Publication number 20130187254
- Publication date Jul 25, 2013
- Founder Microelectronics International Co., Ltd.
- Wanli MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES
- Publication number 20130161817
- Publication date Jun 27, 2013
- Maxim Integrated Products, Inc.
- Viren Khandekar
- H01 - BASIC ELECTRIC ELEMENTS

Permanent masks, i.e. masks left in the finished device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Patterned and planarized under-bump metallization

Conductive traces in semiconductor devices and methods of forming same

Conductive bump of a semiconductor device and fabricating method th...

Semiconductor chip with patterned underbump metallization and polym...

Semiconductor device and method of manufacture

Semiconductor device and method of manufacture

Semiconductor packages with an intermetallic layer

Bump structure and fabricating method thereof

Conductive traces in semiconductor devices and methods of forming same

Collars for under-bump metal structures and associated systems and...

Semiconductor devices, methods of manufacture thereof, and semicond...

Barrier layer for interconnects in 3D integrated device

Chip part and manufacturing method thereof

Semiconductor device and fabricating method thereof

Conductive connections, structures with such connections, and metho...

Integrated device package comprising photo sensitive fill between a...

Method of forming a contact

Hybrid bonding mechanisms for semiconductor wafers

Conductive connections, structures with such connections, and metho...

Semiconductor devices, methods of manufacture thereof, and semicond...

Semiconductor device and an electronic device

Processing of thick metal pads

Flip chip package structure and fabrication process thereof

Semiconductor device and method for forming openings and trenches i...

Common drain semiconductor device structure and method

Semiconductor constructions having through-substrate interconnects

Semiconductor chip with patterned underbump metallization and polym...

Methods of forming semiconductor packages with an intermetallic lay...

Technique for wafer-level processing of QFN packages

Bowl-shaped solder structure

Patents Applicationslast 30 patents

INTEGRATED DEVICE COMPRISING ELONGATED PADS

PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION

COLLARS FOR UNDER-BUMP METAL STRUCTURES AND ASSOCIATED SYSTEMS AND...

Semiconductor Device and Method of Manufacture

BARRIER LAYER FOR INTERCONNECTS IN 3D INTEGRATED DEVICE

Semiconductor Device and Method of Manufacture

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

CONDUCTIVE CONNECTIONS, STRUCTURES WITH SUCH CONNECTIONS, AND METHO...

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

Method of Forming a Contact

LASER RESIST REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

METHOD OF FORMING BUMP STRUCTURE

Semiconductor Devices, Methods of Manufacture Thereof, and Semicond...

CHIP STACK WITH ELECTRICALLY INSULATING WALLS

CHIP STACK WITH ELECTRICALLY INSULATING WALLS

METHOD FOR MAKING A STRUCTURE FOR RESUMING CONTACT

FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

METHOD FOR PRODUCING A STRUCTURE FOR MICROELECTRONIC DEVICE ASSEMBLY

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

HYBRID BONDING MECHANISMS FOR SEMICONDUCTOR WAFERS

BONDABLE TOP METAL CONTACTS FOR GALLIUM NITRIDE POWER DEVICES

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

Interposer System and Method

METHODS FOR FORMING A SEMICONDUCTOR STRUCTURE AND RELATED STRUCTURES

CHIP CONNECTION STRUCTURE AND METHOD OF FORMING

CONTROLLED SOLDER-ON-DIE INTEGRATIONS ON PACKAGES AND METHODS OF AS...

Semiconductor Device and Method for Forming Openings and Trenches i...

Semiconductor Device and Method of Forming Compliant Conductive Int...

Semiconductor Chip and Methods for Producing the Same

TECHNIQUES FOR WAFER-LEVEL PROCESSING OF QFN PACKAGES