Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Industry

CPC
H05K2201/2036

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/2036Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 12,322,670
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer element for a printed circuit board assembly
- Patent number 12,267,977
- Issue date Apr 1, 2025
- BorgWarner Inc.
- Kai Homann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface card assembly and circuit board module using the same
- Patent number 12,237,618
- Issue date Feb 25, 2025
- ASUSTeK COMPUTER Inc.
- Po-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fastening member with fastening portions
- Patent number 12,228,168
- Issue date Feb 18, 2025
- FIVETECH TECHNOLOGY INC.
- Ting-Jui Wang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Electronic device including a conductive portion and contact member...
- Patent number 12,133,342
- Issue date Oct 29, 2024
- Samsung Electronics Co., Ltd.
- Geuna Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-OLED display module thermal management
- Patent number 12,127,430
- Issue date Oct 22, 2024
- Meta Platforms Technologies, LLC
- Giti Karimi Moghaddam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly for a vehicle display
- Patent number 12,041,732
- Issue date Jul 16, 2024
- Polaris Industries Inc.
- Mark A. Powell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink with a sandwich plate construction
- Patent number 11,963,335
- Issue date Apr 16, 2024
- Intel Corporation
- Juha Tapani Paavola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid state relay
- Patent number 11,949,407
- Issue date Apr 2, 2024
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Circuit board assembly and system for communication to an access po...
- Patent number 11,937,393
- Issue date Mar 19, 2024
- ARINC Incorporated
- Curtis Wicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics assembly
- Patent number RE49723
- Issue date Nov 7, 2023
- Turntide Technologies, Inc.
- Peter Barrass
Information Patent Grant
Cable assembly providing extended LED interface
- Patent number 11,758,680
- Issue date Sep 12, 2023
- MOTOROLA SOLUTIONS, INC.
- Eric R Uskali
- G08 - SIGNALLING
Information Patent Grant
Electromagnetic compatibility gasket and vent
- Patent number 11,716,836
- Issue date Aug 1, 2023
- Cisco Technology, Inc.
- Vic Hong Chia
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Camera module with imaging sensor and light emitter
- Patent number 11,665,413
- Issue date May 30, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Eiji Machii
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Inverter apparatus
- Patent number 11,522,443
- Issue date Dec 6, 2022
- Kabushiki Kaisha Yaskawa Denki
- Ryosuke Tsumagari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid state relay
- Patent number 11,522,534
- Issue date Dec 6, 2022
- Zonit Structured Solutions, LLC
- Steve Chapel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Blind mate connections with different sets of datums
- Patent number 11,509,079
- Issue date Nov 22, 2022
- Hewlett Packard Enterprise Development LP
- Pinche Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantable connector including at least one electrical component
- Patent number 11,450,977
- Issue date Sep 20, 2022
- Verily Life Sciences LLC
- Kedar Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural element fixing structure and fixing element thereof
- Patent number 11,439,000
- Issue date Sep 6, 2022
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Yung-Teng Fu
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Interactive core for electronic cards
- Patent number 11,392,189
- Issue date Jul 19, 2022
- INTERACTIVE CARDS, INC.
- Michael Scruggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Camera head
- Patent number 11,395,406
- Issue date Jul 19, 2022
- SCOUTCAM LTD.
- Amir Govrin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,380,978
- Issue date Jul 5, 2022
- Siliconware Precision Industries Co., Ltd.
- Shi-Min Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module with imaging sensor and light emitter
- Patent number 11,381,717
- Issue date Jul 5, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Eiji Machii
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit device and power conversion device
- Patent number 11,350,517
- Issue date May 31, 2022
- Mitsubishi Electric Corporation
- Hiroyuki Yahara
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System and method for enhanced cooling
- Patent number 11,291,106
- Issue date Mar 29, 2022
- Dell Products L.P.
- Isaac Q. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly for a vehicle display
- Patent number 11,284,522
- Issue date Mar 22, 2022
- Polaris Industries Inc.
- Mark A. Powell
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Universal carrier for OCP modules
- Patent number 11,212,933
- Issue date Dec 28, 2021
- Quanta Computer Inc.
- Yaw-Tzorng Tsorng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic compatibility gasket and vent
- Patent number 11,129,311
- Issue date Sep 21, 2021
- Cisco Technology, Inc.
- Vic Hong Chia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 11,114,357
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device assembly having a spacer layer surrounding the integ...
- Patent number 11,099,439
- Issue date Aug 24, 2021
- Apple Inc.
- Benjamin S. Bustle
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...
- Publication number 20250185169
- Publication date Jun 5, 2025
- Arista Networks, Inc.
- Robert Morris Wilcox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20250149404
- Publication date May 8, 2025
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151191
- Publication date May 8, 2025
- Dell Products L.P.
- Earl BOONE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FASTENING MEMBER WITH FASTENING PORTIONS
- Publication number 20250146517
- Publication date May 8, 2025
- FIVETECH TECHNOLOGY INC.
- TING-JUI WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...
- Publication number 20250151194
- Publication date May 8, 2025
- Dell Products L.P.
- Steven R. ETHRIDGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STANDOFF FOR CIRCUIT CARD ASSEMBLIES
- Publication number 20250120033
- Publication date Apr 10, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Sanjay Kumarapuram Anantharaman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20250089172
- Publication date Mar 13, 2025
- LG Innotek Co., Ltd.
- Eom Ji KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250071893
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEMS TO RETAIN A PRINTED CIRCUIT BOARD BETWEEN MOU...
- Publication number 20250024593
- Publication date Jan 16, 2025
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Arrangement for a Motor Vehicle Headlight
- Publication number 20240414838
- Publication date Dec 12, 2024
- ZKW GROUP GMBH
- Dietmar KIESLINGER
- F21 - LIGHTING
Information Patent Application
DISPLAY DEVICE
- Publication number 20240306320
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- SEON-KYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY MODULE AND METHOD OF ASSEMBLY
- Publication number 20240276649
- Publication date Aug 15, 2024
- Advanced Energy Industries, Inc.
- Antonios Tzimas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A...
- Publication number 20240244761
- Publication date Jul 18, 2024
- MICROCHIP TECHNOLOGY INCORPORATED
- Zhiyang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER BOARD AND METHOD FOR MANUFACTURING MULTILAYER BOARD
- Publication number 20240147613
- Publication date May 2, 2024
- FICT LIMITED
- Takashi Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING MODULE
- Publication number 20230422395
- Publication date Dec 28, 2023
- Nichia Corporation.
- Kensuke YAMAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER ELEMENT FOR A PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20230397358
- Publication date Dec 7, 2023
- BorgWarner Inc.
- Kai Homann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICRO-OLED DISPLAY MODULE THERMAL MANAGEMENT
- Publication number 20230247861
- Publication date Aug 3, 2023
- Facebook Technologies, LLC
- Giti Karimi Moghaddam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND APPARATUS
- Publication number 20230225054
- Publication date Jul 13, 2023
- Canon Kabushiki Kaisha
- Mitsutoshi Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTER FOR AIRCRAFT WIRELESS MODULE
- Publication number 20230156951
- Publication date May 18, 2023
- Curtis Wicks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFACE CARD ASSEMBLY AND CIRCUIT BOARD MODULE USING THE SAME
- Publication number 20230072319
- Publication date Mar 9, 2023
- ASUSTek COMPUTER INC.
- Po-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY FOR A VEHICLE DISPLAY
- Publication number 20230056939
- Publication date Feb 23, 2023
- Polaris Industries Inc.
- Mark A. POWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220369474
- Publication date Nov 17, 2022
- HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
- HOU-YUAN CHOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Apparatus for Package with Interposers
- Publication number 20210391230
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC COMPATIBILITY GASKET AND VENT
- Publication number 20210337707
- Publication date Oct 28, 2021
- Cisco Technology, Inc.
- Vic Hong Chia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BLIND MATE CONNECTIONS WITH DIFFERENT SETS OF DATUMS
- Publication number 20210313720
- Publication date Oct 7, 2021
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Pinche Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC COMPATIBILITY GASKET AND VENT
- Publication number 20210298211
- Publication date Sep 23, 2021
- Cisco Technology, Inc.
- Vic Hong Chia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURAL ELEMENT FIXING STRUCTURE AND FIXING ELEMENT THEREOF
- Publication number 20210289613
- Publication date Sep 16, 2021
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Yung-Teng FU
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
DEVICE MOUNTS
- Publication number 20210289652
- Publication date Sep 16, 2021
- Hewlett-Packard Development Company, L.P.
- Yao Wen Fan
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Electronic Assembly For A Vehicle Display
- Publication number 20210251089
- Publication date Aug 12, 2021
- Polaris Industries Inc.
- Mark A. POWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ENHANCED COOLING
- Publication number 20210235575
- Publication date Jul 29, 2021
- DELL PRODUCTS L.P.
- Isaac Q. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Permanent spacer or stand-off in a printed circuit or printed circuit assembly

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and apparatus for package with interposers

Spacer element for a printed circuit board assembly

Interface card assembly and circuit board module using the same

Fastening member with fastening portions

Electronic device including a conductive portion and contact member...

Micro-OLED display module thermal management

Electronic assembly for a vehicle display

Heatsink with a sandwich plate construction

Solid state relay

Circuit board assembly and system for communication to an access po...

Power electronics assembly

Cable assembly providing extended LED interface

Electromagnetic compatibility gasket and vent

Camera module with imaging sensor and light emitter

Inverter apparatus

Solid state relay

Blind mate connections with different sets of datums

Implantable connector including at least one electrical component

Structural element fixing structure and fixing element thereof

Interactive core for electronic cards

Camera head

Electronic package and method for fabricating the same

Camera module with imaging sensor and light emitter

Circuit device and power conversion device

System and method for enhanced cooling

Electronic assembly for a vehicle display

Universal carrier for OCP modules

Electromagnetic compatibility gasket and vent

Methods and apparatus for package with interposers

Display device assembly having a spacer layer surrounding the integ...

Patents Applicationslast 30 patents

DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

DIMPLE ON CIRCUIT BOARD FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

FASTENING MEMBER WITH FASTENING PORTIONS

PLATED STANDOFF FEATURE FOR PROVIDING STANDOFF BETWEEN CIRCUIT BOAR...

STANDOFF FOR CIRCUIT CARD ASSEMBLIES

CIRCUIT BOARD

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF

APPARATUS AND SYSTEMS TO RETAIN A PRINTED CIRCUIT BOARD BETWEEN MOU...

Printed Circuit Board Arrangement for a Motor Vehicle Headlight

DISPLAY DEVICE

POWER SUPPLY MODULE AND METHOD OF ASSEMBLY

PACKAGES WITH A SHORTEST DISTANCE BETWEEN PACKAGE CONNECTORS AND A...

MULTILAYER BOARD AND METHOD FOR MANUFACTURING MULTILAYER BOARD

LIGHT-EMITTING MODULE

SPACER ELEMENT FOR A PRINTED CIRCUIT BOARD ASSEMBLY

MICRO-OLED DISPLAY MODULE THERMAL MANAGEMENT

ELECTRONIC MODULE AND APPARATUS

ADAPTER FOR AIRCRAFT WIRELESS MODULE

INTERFACE CARD ASSEMBLY AND CIRCUIT BOARD MODULE USING THE SAME

ELECTRONIC ASSEMBLY FOR A VEHICLE DISPLAY

CIRCUIT BOARD STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Methods and Apparatus for Package with Interposers

ELECTROMAGNETIC COMPATIBILITY GASKET AND VENT

BLIND MATE CONNECTIONS WITH DIFFERENT SETS OF DATUMS

ELECTROMAGNETIC COMPATIBILITY GASKET AND VENT

STRUCTURAL ELEMENT FIXING STRUCTURE AND FIXING ELEMENT THEREOF

DEVICE MOUNTS

Electronic Assembly For A Vehicle Display

SYSTEM AND METHOD FOR ENHANCED COOLING