Photo diode

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H01L2924/12043

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/12043Photo diode

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Optical sensor, and method for manufacturing optical sensor
- Patent number 12,230,618
- Issue date Feb 18, 2025
- Rohm Co., Ltd.
- Yuya Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring base, package for storing semiconductor element, and semicon...
- Patent number 12,199,194
- Issue date Jan 14, 2025
- Kyocera Corporation
- Makoto Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical bridge package with integrated off-bridge photonic chann...
- Patent number 12,191,257
- Issue date Jan 7, 2025
- Celestial AI Inc.
- Ankur Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED packaging structure
- Patent number 12,176,473
- Issue date Dec 24, 2024
- Peng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 12,100,701
- Issue date Sep 24, 2024
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for fabricating and assembling printable semico...
- Patent number 12,074,213
- Issue date Aug 27, 2024
- The Board of Trustees of the University of Illinois
- Ralph G. Nuzzo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Image sensor
- Patent number 12,009,379
- Issue date Jun 11, 2024
- VisEra Technologies Company Limited
- Wu-Cheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,990,438
- Issue date May 21, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated high voltage capacitor
- Patent number 11,967,610
- Issue date Apr 23, 2024
- Semtech Corporation
- Christopher David Ainsworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,279
- Issue date Mar 5, 2024
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for stacked device
- Patent number 11,915,977
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared sensor and imaging apparatus
- Patent number 11,901,389
- Issue date Feb 13, 2024
- NEC Corporation
- Tomo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,874,513
- Issue date Jan 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 11,862,525
- Issue date Jan 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,855,055
- Issue date Dec 26, 2023
- Samsung Display Co., Ltd.
- Seung Lyong Bok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
SiPM based sensor for low level fusion
- Patent number 11,782,140
- Issue date Oct 10, 2023
- Motional AD LLC
- Geng Fu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus for bond wave propagation control
- Patent number 11,742,321
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Xin-Hua Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices having integrated optical components
- Patent number 11,728,276
- Issue date Aug 15, 2023
- Micron Technology, Inc.
- John F. Kaeding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,710,719
- Issue date Jul 25, 2023
- Sumitomo Electric Device Innovations, Inc.
- Taketo Kawano
- G02 - OPTICS
Information Patent Grant
Photocoupler
- Patent number 11,688,823
- Issue date Jun 27, 2023
- Kabushiki Kaisha Toshiba
- Mami Fujihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 11,670,627
- Issue date Jun 6, 2023
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- G02 - OPTICS
Information Patent Grant
Image sensor using a boosting capacitor and a negative bias voltage
- Patent number 11,637,979
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Kyungho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,356
- Issue date Apr 11, 2023
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light conversion device
- Patent number 11,610,876
- Issue date Mar 21, 2023
- Epistar Corporation
- Meng-Chyi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,585,992
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,587,857
- Issue date Feb 21, 2023
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chiplets with connection posts
- Patent number 11,552,034
- Issue date Jan 10, 2023
- X Display Company Technology Limited
- Carl Prevatte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTOELECTRONIC SYSTEM
- Publication number 20240421266
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Min-Hsun HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALL-INORGANIC UP-CONVERSION DISPLAY
- Publication number 20240387494
- Publication date Nov 21, 2024
- National Tsing-Hua University
- Meng-Chyi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...
- Publication number 20240379591
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- TATSUYA MURAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240371845
- Publication date Nov 7, 2024
- InnoLux Corporation
- Yu-Jhou GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240363609
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES
- Publication number 20240312951
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20240266341
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Receiving Element and Light Receiving Circuit
- Publication number 20240222532
- Publication date Jul 4, 2024
- Nippon Telegraph and Telephone Corporation
- Atsushi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLETS WITH CONNECTION POSTS
- Publication number 20240170430
- Publication date May 23, 2024
- X Display Company Technology Limited
- Carl Prevatte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...
- Publication number 20240145393
- Publication date May 2, 2024
- Ankur AGGARWAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20240145319
- Publication date May 2, 2024
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRUCIFORM BONDING STRUCTURE FOR 3D-IC
- Publication number 20240128216
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240047443
- Publication date Feb 8, 2024
- Kabushiki Kaisha Toshiba
- Jia LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Underfill Dam for Chip-t...
- Publication number 20240021566
- Publication date Jan 18, 2024
- STATS ChipPAC Pte Ltd.
- WooSoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRAY DEVICE
- Publication number 20230290753
- Publication date Sep 14, 2023
- Kabushiki Kaisha Toshiba
- Hideto FURUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...
- Publication number 20230260978
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Feng-Wei Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20230168451
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...
- Publication number 20230162992
- Publication date May 25, 2023
- TOHOKU UNIVERSITY
- Takafumi FUKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIPM BASED SENSOR FOR LOW LEVEL FUSION
- Publication number 20230119438
- Publication date Apr 20, 2023
- MOTIONAL AD LLC
- Geng Fu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230098931
- Publication date Mar 30, 2023
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-RECEIVING ELEMENT AND LIGHT-EMITTING DEVICE
- Publication number 20230012665
- Publication date Jan 19, 2023
- NICHIA CORPORATION
- Soichiro MIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20230005979
- Publication date Jan 5, 2023
- SONY GROUP CORPORATION
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Receiving Circuit
- Publication number 20230005897
- Publication date Jan 5, 2023
- Nippon Telegraph and Telephone Corporation
- Atsushi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single-chip optical transceiver
- Publication number 20220404475
- Publication date Dec 22, 2022
- Apple Inc.
- Arnaud Laflaquière
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUTOR PACKAGE, WEARABLE DEVICE, AND TEMPERATURE DETECTION ME...
- Publication number 20220406762
- Publication date Dec 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF...
- Publication number 20220375981
- Publication date Nov 24, 2022
- Canon Kabushiki Kaisha
- Mineo Shimotsusa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE MANUFACTURING METHOD
- Publication number 20220375913
- Publication date Nov 24, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- François Templier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE MANUFACTURING METHOD
- Publication number 20220375914
- Publication date Nov 24, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Sébastien Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE INTERPOSERS WITH PHOTONIC & ELECTRICAL R...
- Publication number 20220373734
- Publication date Nov 24, 2022
- Intel Corporation
- Benjamin Duong
- G02 - OPTICS
Information Patent Application
PHOTORELAY
- Publication number 20220285333
- Publication date Sep 8, 2022
- Kabushiki Kaisha Toshiba
- Tatsuo Tonedachi
- H01 - BASIC ELECTRIC ELEMENTS

Photo diode

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical sensor, and method for manufacturing optical sensor

Wiring base, package for storing semiconductor element, and semicon...

Electrical bridge package with integrated off-bridge photonic chann...

LED packaging structure

Hybrid system including photonic and electronic integrated circuits...

Methods and devices for fabricating and assembling printable semico...

Image sensor

Hybrid bonding with uniform pattern density

Chiplets with connection posts

Integrated high voltage capacitor

Electronic device

Semiconductor device

Interconnect structure for stacked device

Infrared sensor and imaging apparatus

Package structure

Semiconductor device package and a method of manufacturing the same

Display device

SiPM based sensor for low level fusion

Apparatus for bond wave propagation control

Semiconductor devices having integrated optical components

Method for manufacturing electronic device

Photocoupler

Hybrid system including photonic and electronic integrated circuits...

Image sensor using a boosting capacitor and a negative bias voltage

Semiconductor device

Light conversion device

Package structure

Semiconductor device

Semiconductor device, fabrication method for a semiconductor device...

Chiplets with connection posts

Patents Applicationslast 30 patents

OPTOELECTRONIC SYSTEM

ALL-INORGANIC UP-CONVERSION DISPLAY

SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND IMAGE CAPTURING...

ELECTRONIC DEVICE

METHOD OF FABRICATING PACKAGE STRUCTURE

SYSTEM AND METHOD FOR BONDING TRANSPARENT CONDUCTOR SUBSTRATES

HYBRID BONDING WITH UNIFORM PATTERN DENSITY

Light-Receiving Element and Light Receiving Circuit

CHIPLETS WITH CONNECTION POSTS

ELECTRICAL BRIDGE PACKAGE WITH INTEGRATED OFF-BRIDGE PHOTONIC CHANN...

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

CRUCIFORM BONDING STRUCTURE FOR 3D-IC

SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Underfill Dam for Chip-t...

SEMICONDUCTOR MODULE ARRAY DEVICE

PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING T...

PACKAGE STRUCTURE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...

SIPM BASED SENSOR FOR LOW LEVEL FUSION

SEMICONDUCTOR DEVICE

LIGHT-RECEIVING ELEMENT AND LIGHT-EMITTING DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

Optical Receiving Circuit

Single-chip optical transceiver

SEMICONDUTOR PACKAGE, WEARABLE DEVICE, AND TEMPERATURE DETECTION ME...

PHOTOELECTRIC CONVERSION DEVICE, IMAGE PICKUP SYSTEM AND METHOD OF...

OPTOELECTRONIC DEVICE MANUFACTURING METHOD

OPTOELECTRONIC DEVICE MANUFACTURING METHOD

INTEGRATED CIRCUIT PACKAGE INTERPOSERS WITH PHOTONIC & ELECTRICAL R...

PHOTORELAY