Photo transistor

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H01L2924/13056

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/13056Photo transistor

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Patents Grantslast 30 patents

Information Patent Grant
Electronic packaging structure
- Patent number 11,114,387
- Issue date Sep 7, 2021
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect apparatus and method for a stacked semiconductor device
- Patent number 10,763,292
- Issue date Sep 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect apparatus and method
- Patent number 10,163,956
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Underfill Dam for Chip-t...
- Publication number 20240021566
- Publication date Jan 18, 2024
- STATS ChipPAC Pte Ltd.
- WooSoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRAY DEVICE
- Publication number 20230290753
- Publication date Sep 14, 2023
- Kabushiki Kaisha Toshiba
- Hideto FURUYAMA
- H01 - BASIC ELECTRIC ELEMENTS