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H05K3/064

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/064Photoresists

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 12,171,067
- Issue date Dec 17, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 12,004,304
- Issue date Jun 4, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Short or near short etch rework
- Patent number 12,004,307
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Colin Edward Masterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,991,836
- Issue date May 21, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Apparatus for manufacturing printed circuit boards
- Patent number 11,963,306
- Issue date Apr 16, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed circuit board and resist laminate f...
- Patent number 11,937,378
- Issue date Mar 19, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for manufacturing printed circuit boards
- Patent number 11,917,767
- Issue date Feb 27, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing ultrasound transducers and other components
- Patent number 11,845,108
- Issue date Dec 19, 2023
- FUJIFILM SonoSite, Inc.
- N. Christopher Chaggares
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Method of directly patterning stretchable substrate and stretchable...
- Patent number 11,839,033
- Issue date Dec 5, 2023
- Korea University Research and Business Foundation
- Soong Ju Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resist layer forming method, method for manufacturing wiring board,...
- Patent number 11,818,847
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yoshihisa Kanbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer coil circuit substrate
- Patent number 11,810,703
- Issue date Nov 7, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of metal structure
- Patent number 11,758,666
- Issue date Sep 12, 2023
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and method of manufacturing the same
- Patent number 11,744,004
- Issue date Aug 29, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Wei-Xiang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method of manufacturing wiring board
- Patent number 11,659,667
- Issue date May 23, 2023
- Shinko Electric Industries Co., Ltd.
- Naohiro Mashino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Touch panel and method of manufacturing the same
- Patent number 11,644,931
- Issue date May 9, 2023
- Samsung Display Co., Ltd.
- Ki Hyun Cho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for etching of metals
- Patent number 11,647,590
- Issue date May 9, 2023
- D-Wave Systems Inc.
- Jeffrey P. Burress
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for use in preparing a printed circuit board and photosen...
- Patent number 11,596,070
- Issue date Feb 28, 2023
- Orbotech Ltd.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electrical devices with electrodes on softening polymers and method...
- Patent number 11,596,072
- Issue date Feb 28, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 11,582,872
- Issue date Feb 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ke-Jian Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pattern formation method, laminate, and method of producing touch p...
- Patent number 11,567,410
- Issue date Jan 31, 2023
- FUJIFILM Corporation
- Shinichi Kanna
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Touch sensor with auxiliary conductive unit on transparent electrode
- Patent number 11,561,658
- Issue date Jan 24, 2023
- Young Fast Optoelectronics Co., Ltd.
- Chih-Chiang Pai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for photolithography to manufacture a two-sided touch sensor
- Patent number 11,550,433
- Issue date Jan 10, 2023
- FUTURETECH CAPITAL, INC.
- Robert Petcavich
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thin film circuit substrate and manufacturing method thereof
- Patent number 11,543,748
- Issue date Jan 3, 2023
- Amogreentech Co., Ltd.
- Sung-Baek Dan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board assembly sheet, producing method thereof, and...
- Patent number 11,528,803
- Issue date Dec 13, 2022
- Nitto Denko Corporation
- Takuya Taniuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making contact with a component embedded in a printed ci...
- Patent number 11,523,520
- Issue date Dec 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passive device packaging structure embedded in glass medium and met...
- Patent number 11,503,712
- Issue date Nov 15, 2022
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...
- Publication number 20240397636
- Publication date Nov 28, 2024
- NVIDIA Corporation
- Oren STEINBERG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSING DEVICE AND PREPARATION METHOD THEREFOR
- Publication number 20240365474
- Publication date Oct 31, 2024
- Beijing BOE Technology Development Co., Ltd.
- Fanli MENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING FLEXIBLE PRINTED WIRING BOARD
- Publication number 20240365469
- Publication date Oct 31, 2024
- FUJIKURA PRINTED CIRCUITS LTD.
- Daisuke Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD
- Publication number 20240349423
- Publication date Oct 17, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD.
- Meijuan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and manufacturing method thereof
- Publication number 20240274543
- Publication date Aug 15, 2024
- InnoLux Corporation
- Yan-Tang DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A BATTERY SENSOR
- Publication number 20240274895
- Publication date Aug 15, 2024
- Xin HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...
- Publication number 20240268018
- Publication date Aug 8, 2024
- Rohm Co., Ltd.
- Goro Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOLITHOGRAPHY ENHANCEMENT TECHNIQUES
- Publication number 20240242970
- Publication date Jul 18, 2024
- Applied Materials, Inc.
- Yifeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240206057
- Publication date Jun 20, 2024
- IBIDEN CO., LTD.
- Shunsuke SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20240188224
- Publication date Jun 6, 2024
- Board of Regents, The University of Texas System
- Romil Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...
- Publication number 20240164012
- Publication date May 16, 2024
- Nikon Corporation
- Shohei KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
- Publication number 20240155773
- Publication date May 9, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED W...
- Publication number 20240134277
- Publication date Apr 25, 2024
- Resonac Corporation
- Yuta DAIJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20240098873
- Publication date Mar 21, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230380071
- Publication date Nov 23, 2023
- InnoLux Corporation
- Hsueh-Hsuan CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
- Publication number 20230380062
- Publication date Nov 23, 2023
- Corning Incorporated
- DHANANJAY JOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20230337366
- Publication date Oct 19, 2023
- LG Innotek Co., Ltd.
- Ji Myoung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...
- Publication number 20230309240
- Publication date Sep 28, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPO...
- Publication number 20230244147
- Publication date Aug 3, 2023
- Shin-Etsu Chemical Co., Ltd.
- Daisuke KORI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for Making Contact with a Component Embedded in a Printed Ci...
- Publication number 20230189448
- Publication date Jun 15, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gerald Weidinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...
- Publication number 20230180396
- Publication date Jun 8, 2023
- Board of Regents, The University of Texas System
- Romil Modi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION, TRANSFER FILM, MANUFACTURING METHOD FOR LAMINATE, MANU...
- Publication number 20230125445
- Publication date Apr 27, 2023
- FUJIFILM CORPORATION
- Satoru YAMADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Component Carrier With Partially Metallized Hole Using Anti-Plating...
- Publication number 20230119480
- Publication date Apr 20, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND RESIST LAMINATE F...
- Publication number 20230092667
- Publication date Mar 23, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND RESIST LAMINATE F...
- Publication number 20230086970
- Publication date Mar 23, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chan Jin Park
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20230007783
- Publication date Jan 5, 2023
- Nitto Denko Corporation
- Masaki ITO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SHORT OR NEAR SHORT ETCH REWORK
- Publication number 20220400556
- Publication date Dec 15, 2022
- International Business Machines Corporation
- Colin Edward Masterson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DIRECTLY PATTERNING STRETCHABLE SUBSTRATE AND STRETCHABLE...
- Publication number 20220386477
- Publication date Dec 1, 2022
- Korea University Research and Business Foundation
- Soong Ju OH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20220369469
- Publication date Nov 17, 2022
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Photoresists

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing printed wiring board

Methods of forming flexible interconnect circuits

Method for manufacturing printed wiring board

Short or near short etch rework

Electrical devices with electrodes on softening polymers and method...

Methods of forming interconnect circuits

Apparatus for manufacturing printed circuit boards

Method of manufacturing printed circuit board and resist laminate f...

Apparatus for manufacturing printed circuit boards

Methods for manufacturing ultrasound transducers and other components

Method of directly patterning stretchable substrate and stretchable...

Resist layer forming method, method for manufacturing wiring board,...

Multilayer coil circuit substrate

Circuit board structure and method for manufacturing a circuit boar...

Manufacturing method of metal structure

Circuit board and method of manufacturing the same

Wiring board and method of manufacturing wiring board

Touch panel and method of manufacturing the same

Systems and methods for etching of metals

Process for fabrication of a printed circuit board using a semi-add...

Apparatus for use in preparing a printed circuit board and photosen...

Electrical devices with electrodes on softening polymers and method...

Circuit board

Pattern formation method, laminate, and method of producing touch p...

Touch sensor with auxiliary conductive unit on transparent electrode

Method for photolithography to manufacture a two-sided touch sensor

Thin film circuit substrate and manufacturing method thereof

Wiring circuit board assembly sheet, producing method thereof, and...

Method for making contact with a component embedded in a printed ci...

Passive device packaging structure embedded in glass medium and met...

Patents Applicationslast 30 patents

METHOD FOR INTEGRATING A COPPER-GRAPHENE LAMINATE (CGL) IN A MULTIL...

SENSING DEVICE AND PREPARATION METHOD THEREFOR

METHOD FOR PRODUCING FLEXIBLE PRINTED WIRING BOARD

METAL FOIL, CIRCUIT BOARD, AND METHOD FOR MANUFACTURING CIRCUIT BOARD

Electronic device and manufacturing method thereof

METHOD OF MAKING A BATTERY SENSOR

Interconnect Circuit Methods And Devices

INSULATING SUBSTRATE, ELECTRICAL WIRING SUBSTRATE, THERMAL PRINT HE...

PHOTOLITHOGRAPHY ENHANCEMENT TECHNIQUES

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

METAL WIRING MANUFACTURING METHOD, TRANSISTOR MANUFACTURING METHOD,...

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED W...

INTERCONNECT CIRCUIT METHODS AND DEVICES

ELECTRONIC DEVICE

BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CONDUCTIVE SUBSTRATE AND CARRIER PLATE WIRING STRUCTURE WITH FILTER...

COMPOSITION FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPO...

Method for Making Contact with a Component Embedded in a Printed Ci...

ELECTRICAL DEVICES WITH ELECTRODES ON SOFTENING POLYMERS AND METHOD...

COMPOSITION, TRANSFER FILM, MANUFACTURING METHOD FOR LAMINATE, MANU...

Component Carrier With Partially Metallized Hole Using Anti-Plating...

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND RESIST LAMINATE F...

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND RESIST LAMINATE F...

METHOD FOR PRODUCING WIRING CIRCUIT BOARD

SHORT OR NEAR SHORT ETCH REWORK

METHOD OF DIRECTLY PATTERNING STRETCHABLE SUBSTRATE AND STRETCHABLE...

METHOD OF MANUFACTURING PRINTED WIRING BOARD