Physical or chemical etching of the layers

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H01L21/3213

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3213Physical or chemical etching of the layers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming a staircase structure
- Patent number 12,232,314
- Issue date Feb 18, 2025
- Lodestar Licensing Group LLC
- Rohit Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices using directional pro...
- Patent number 12,230,507
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Wen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structuring method
- Patent number 12,230,508
- Issue date Feb 18, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with doped semiconductor bridge str...
- Patent number 12,225,720
- Issue date Feb 11, 2025
- SanDisk Technologies LLC
- Ryousuke Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of metal grid, thin film sensor and manufactur...
- Patent number 12,224,234
- Issue date Feb 11, 2025
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Hu Meng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,224,325
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a via and a metal wiring for a semiconducto...
- Patent number 12,224,237
- Issue date Feb 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with multiple silicid...
- Patent number 12,218,012
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yip Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of etching film and plasma processing apparatus
- Patent number 12,217,973
- Issue date Feb 4, 2025
- Tokyo Electron Limited
- Kosuke Ogasawara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching features using a targeted deposition for selecti...
- Patent number 12,217,955
- Issue date Feb 4, 2025
- Lam Research Corporation
- Wenchi Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Memory arrays comprising strings of memory cells and methods used i...
- Patent number 12,219,762
- Issue date Feb 4, 2025
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure cutting process and structures formed thereby
- Patent number 12,218,130
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Profile shaping for control gate recesses
- Patent number 12,211,908
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Akhil Singhal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming FinFET device
- Patent number 12,211,750
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing fusible structures
- Patent number 12,205,891
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Ting Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preparing semiconductor structure having low dielectric c...
- Patent number 12,205,825
- Issue date Jan 21, 2025
- NANYA TECHNOLOGY CORPORATION
- Yu-Kai Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing device and etching liquid
- Patent number 12,203,021
- Issue date Jan 21, 2025
- Tokyo Electron Limited
- Koukichi Hiroshiro
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Contact via formation
- Patent number 12,205,896
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Lin-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a gate electrode with a top peripheral...
- Patent number 12,204,232
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Shu Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 12,207,470
- Issue date Jan 21, 2025
- Kioxia Corporation
- Shinya Arai
- G11 - INFORMATION STORAGE
Information Patent Grant
Treatment liquid for semiconductor wafers
- Patent number 12,195,658
- Issue date Jan 14, 2025
- Tokuyama Corporation
- Yuki Kikkawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method for opening a source line in flash memory
- Patent number 12,193,227
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yong-Sheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 12,189,284
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,183,805
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Zhi-Qiang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming and patterning a layer and/or substrate
- Patent number 12,183,578
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- Takehito Koshizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nested and non-nested SEI messages in video bitstreams
- Patent number 12,184,899
- Issue date Dec 31, 2024
- BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
- Ye-Kui Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wet etching method
- Patent number 12,183,588
- Issue date Dec 31, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Tianyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote source pulsing with advanced pulse control
- Patent number 12,183,583
- Issue date Dec 31, 2024
- Tokyo Electron Limited
- Peter Lowell George Ventzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure including complemen...
- Patent number 12,183,585
- Issue date Dec 31, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Kui Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TREATMENTS FOR THIN FILMS USED IN PHOTOLITHOGRAPHY
- Publication number 20250062123
- Publication date Feb 20, 2025
- Applied Materials, Inc.
- SHASHANK SHARMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURING METHOD
- Publication number 20250062135
- Publication date Feb 20, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20250062126
- Publication date Feb 20, 2025
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERNS ON A SUBSTRATE
- Publication number 20250062134
- Publication date Feb 20, 2025
- Commissariat a I'Energie Atomique et aux Energies Alternatives
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE
- Publication number 20250063744
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Li Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM FOR FILTERING ETCHING BYPRODUCT DURING SEMICONDUCTOR FABR...
- Publication number 20250062105
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-YING PEI
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20250062234
- Publication date Feb 20, 2025
- CXMT CORPORATION
- Xiang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS
- Publication number 20250053080
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Jeffrey Marks
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN...
- Publication number 20250054758
- Publication date Feb 13, 2025
- Samsung SDI Co., Ltd.
- Dong Wan RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250054782
- Publication date Feb 13, 2025
- TOKYO ELECTRON LIMITED
- Takumi HONDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PATTERNING A TARGET LAYER, APPARATUS FOR PATTERNING A TAR...
- Publication number 20250046577
- Publication date Feb 6, 2025
- ASML NETHERLANDS B.V.
- Syam Parayil VENUGOPALAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20250046615
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Takahiro YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD
- Publication number 20250046620
- Publication date Feb 6, 2025
- Hitachi High-Tech Corporation
- Kenta NAKAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
- Publication number 20250046619
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Guifu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH HEATED FILTER AND OPERATION METHOD OF THE SAME
- Publication number 20250046584
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Lun LU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INTEGRATED EPITAXY AND PRECLEAN SYSTEM
- Publication number 20250046596
- Publication date Feb 6, 2025
- Applied Materials, Inc.
- Lara HAWRYLCHAK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...
- Publication number 20250034427
- Publication date Jan 30, 2025
- NISSAN CHEMICAL CORPORATION
- Shun KUBODERA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CHIP AND PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE
- Publication number 20250038075
- Publication date Jan 30, 2025
- Huawei Technologies Co., Ltd
- Weichuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING PROCESSES
- Publication number 20250037970
- Publication date Jan 30, 2025
- ASM IP HOLDING B.V.
- Tom E. Blomberg
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ACCESS LINE FORMATION FOR A MEMORY ARRAY
- Publication number 20250031383
- Publication date Jan 23, 2025
- Micron Technology, Inc.
- Andrea Redaelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...
- Publication number 20250022717
- Publication date Jan 16, 2025
- Shanghai Huali Integrated Circuit Corporation
- Liyuan Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20250022719
- Publication date Jan 16, 2025
- Hitachi High-Tech Corporation
- Thi-Thuy-Nga NGUYEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...
- Publication number 20250022797
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Jaemyung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CI...
- Publication number 20250020998
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Kyungoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PREVENTING PATTERN COLLAPSE
- Publication number 20250013153
- Publication date Jan 9, 2025
- TOKYO ELECTRON LIMITED
- Lior HULI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE
- Publication number 20250015011
- Publication date Jan 9, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- LIANG-SHIUAN PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composition For Forming Organic Film, Method For Forming Organic Fi...
- Publication number 20250011623
- Publication date Jan 9, 2025
- Shin-Etsu Chemical Co., Ltd.
- Daisuke KORI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE...
- Publication number 20250011650
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Cheol HAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES
- Publication number 20250006506
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Julien LADROUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250006801
- Publication date Jan 2, 2025
- SK HYNIX INC.
- Young Gwang YOON
- H01 - BASIC ELECTRIC ELEMENTS

Physical or chemical etching of the layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming a staircase structure

Method of manufacturing semiconductor devices using directional pro...

Substrate structuring method

Three-dimensional memory device with doped semiconductor bridge str...

Method of manufacturing semiconductor device

Manufacturing method of metal grid, thin film sensor and manufactur...

Semiconductor device and manufacturing method thereof

Method of manufacturing a via and a metal wiring for a semiconducto...

Method of manufacturing semiconductor devices with multiple silicid...

Method of etching film and plasma processing apparatus

Method for etching features using a targeted deposition for selecti...

Memory arrays comprising strings of memory cells and methods used i...

Semiconductor structure cutting process and structures formed thereby

Profile shaping for control gate recesses

Mechanisms for forming FinFET device

Methods of manufacturing fusible structures

Method of preparing semiconductor structure having low dielectric c...

Substrate processing device and etching liquid

Contact via formation

Semiconductor device having a gate electrode with a top peripheral...

Semiconductor device and method for manufacturing same

Treatment liquid for semiconductor wafers

Etch method for opening a source line in flash memory

Method for forming semiconductor device

Semiconductor device and manufacturing method thereof

Method for forming and patterning a layer and/or substrate

Nested and non-nested SEI messages in video bitstreams

Wet etching method

Remote source pulsing with advanced pulse control

Manufacturing method of semiconductor structure including complemen...

Patents Applicationslast 30 patents

TREATMENTS FOR THIN FILMS USED IN PHOTOLITHOGRAPHY

SUBSTRATE STRUCTURING METHOD

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

METHOD FOR FORMING PATTERNS ON A SUBSTRATE

TRENCH CAPACITOR PROFILE TO DECREASE SUBSTRATE WARPAGE

MECHANISM FOR FILTERING ETCHING BYPRODUCT DURING SEMICONDUCTOR FABR...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

VACUUM-INTEGRATED HARDMASK PROCESSES AND APPARATUS

SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERN...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

METHOD OF PATTERNING A TARGET LAYER, APPARATUS FOR PATTERNING A TAR...

ETCHING METHOD

PLASMA PROCESSING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS

APPARATUS WITH HEATED FILTER AND OPERATION METHOD OF THE SAME

INTEGRATED EPITAXY AND PRECLEAN SYSTEM

CHEMICAL-RESISTANT PROTECTIVE FILM-FORMING COMPOSITION HAVING CATEC...

CHIP AND PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE

ATOMIC LAYER ETCHING PROCESSES

ACCESS LINE FORMATION FOR A MEMORY ARRAY

METHOD FOR ADJUSTING LINEWIDTH DUE TO PATTERN LOAD EFFECT IN SADP M...

ETCHING METHOD

INTERCONNECT STRUCTURE INCLUDING METAL LINE AND TOP VIA FORMED THRO...

PHOTORESIST COMPOSITIONS AND METHODS OF MANUFACTURING INTEGRATED CI...

METHOD OF PREVENTING PATTERN COLLAPSE

METHOD OF FORMING MARK ON SEMICONDUCTOR DEVICE

Composition For Forming Organic Film, Method For Forming Organic Fi...

ETCHING COMPOSITION, METAL-CONTAINING FILM ETCHING METHOD USING THE...

SINGLE-MASK STACK ETCHING METHODS FOR FORMING STAIRCASE STRUCTURES

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE