Physical or chemical etching of the layers

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H01L21/3213

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3213Physical or chemical etching of the layers

Industries

Patents Grantslast 30 patents

Information Patent Grant
Composition, its use and a process for selectively etching silicon-...
- Patent number 11,970,647
- Issue date Apr 30, 2024
- BASF SE
- Francisco Javier Lopez Villanueva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an upper conductive structure having multilayer...
- Patent number 11,973,050
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,972,953
- Issue date Apr 30, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhen Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,972,958
- Issue date Apr 30, 2024
- Tokyo Electron Limited
- Takumi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 11,973,055
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method used in forming a memory array comprising strings of memory...
- Patent number 11,974,429
- Issue date Apr 30, 2024
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etching method, method for manufacturing semiconductor element,...
- Patent number 11,972,955
- Issue date Apr 30, 2024
- Resonac Corporation
- Kazuma Matsui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and manufacturing method of a semiconductor de...
- Patent number 11,974,435
- Issue date Apr 30, 2024
- SK hynix Inc.
- In Su Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned subtractive processes and electronic devices therefrom
- Patent number 11,967,527
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D NAND gate stack reinforcement
- Patent number 11,967,524
- Issue date Apr 23, 2024
- Applied Materials, Inc.
- Praket Prakash Jha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing thereof
- Patent number 11,967,533
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Uei Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,967,628
- Issue date Apr 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnect structures in semiconductor fabrica...
- Patent number 11,967,552
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method of array substrate, array substrate, and display...
- Patent number 11,961,852
- Issue date Apr 16, 2024
- HKC CORPORATION LIMITED
- En-Tsung Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 11,961,738
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Ta Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation to reduce nanosheet gate length variation
- Patent number 11,955,533
- Issue date Apr 9, 2024
- Applied Materials, Inc.
- Sipeng Gu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching solution and method for selectively removing silicon nitrid...
- Patent number 11,955,341
- Issue date Apr 9, 2024
- VERSUM MATERIALS US, LLC
- Jhih Kuei Ge
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Conductive element for semiconductor devices
- Patent number 11,955,380
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Chiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,955,336
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing Hong Huang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor devices
- Patent number 11,955,430
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hsuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-bitstream extraction
- Patent number 11,949,900
- Issue date Apr 2, 2024
- BEIJING BYTEDANCE NETWORK TECHNOLOY CO., LTD.
- Ye-Kui Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Combined RF generator and RF solid-state matching network
- Patent number 11,948,775
- Issue date Apr 2, 2024
- ASM AMERICA, INC.
- Imran Ahmed Bhutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hafnium oxide corrosion inhibitor
- Patent number 11,946,148
- Issue date Apr 2, 2024
- VERSUM MATERIALS US, LLC
- Wen Dar Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Forming nitrogen-containing low-K gate spacer
- Patent number 11,948,841
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage polysilicon gate in high-K metal gate device
- Patent number 11,950,413
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,948,798
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon nitride film etching composition and etching method using t...
- Patent number 11,939,505
- Issue date Mar 26, 2024
- ENF TECHNOLOGY CO., LTD.
- Dong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device with helmet structure betwe...
- Patent number 11,942,476
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal patterning die singulation systems and related methods
- Patent number 11,942,366
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory with improved fill-in window
- Patent number 11,943,921
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT
- Publication number 20240145376
- Publication date May 2, 2024
- International Business Machines Corporation
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
- Publication number 20240145384
- Publication date May 2, 2024
- Micron Technology, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...
- Publication number 20240145597
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240145366
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND METHOD
- Publication number 20240138152
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Feng-Cheng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...
- Publication number 20240136200
- Publication date Apr 25, 2024
- Kokusai Electric Corporation
- Motomu DEGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED ZERO TRACK SKIP
- Publication number 20240136281
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Reinaldo Vega
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF
- Publication number 20240136153
- Publication date Apr 25, 2024
- LAM RESEARCH CORPORATION
- Matthew Scott Weimer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-STRESS PASSIVATION LAYER
- Publication number 20240136291
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH
- Publication number 20240136197
- Publication date Apr 25, 2024
- Applied Materials, Inc.
- Tassie Andersen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240128092
- Publication date Apr 18, 2024
- TOKYO ELECTRON LIMITED
- Yuta NAKANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive Device Dies With Measurement Structures
- Publication number 20240128261
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fu-Chiang KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A CAPACITOR
- Publication number 20240128311
- Publication date Apr 18, 2024
- STMicroelectronics (Tours) SAS
- Mohamed Boufnichel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE STRUCTURE PROFILE
- Publication number 20240120388
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Wei Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE
- Publication number 20240120209
- Publication date Apr 11, 2024
- LAM RESEARCH CORPORATION
- Nikhil Dole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOTROPIC SILICON NITRIDE REMOVAL
- Publication number 20240120210
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Mikhail Korolik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES
- Publication number 20240112914
- Publication date Apr 4, 2024
- University of Electronic Science and Technology of China
- Bo ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20240113157
- Publication date Apr 4, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20240112922
- Publication date Apr 4, 2024
- TOKYO ELECTRON LIMITED
- Ryo MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240113113
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chang Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure Cutting Process and Structures Formed Thereby
- Publication number 20240113112
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ryan Chia-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SINGULATION OF DIES FROM A WAFER
- Publication number 20240105514
- Publication date Mar 28, 2024
- NEXPERIA B.V.
- Randolph Estal Flauta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERN OF METAL OXIDE AND METHOD FOR PRODUCING...
- Publication number 20240105466
- Publication date Mar 28, 2024
- Resonac Corporation
- Kazuma MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hard Mask Removal Method
- Publication number 20240105460
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Che-Hao Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20240096623
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Hsin HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVIC...
- Publication number 20240096644
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Koki UEHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Footing Removal in Cut-Metal Process
- Publication number 20240096707
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING
- Publication number 20240096595
- Publication date Mar 21, 2024
- TOKYO ELECTRON LIMITED
- Kazuhide HASEBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...
- Publication number 20240096627
- Publication date Mar 21, 2024
- TESSERA LLC
- Sean D. Burns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ME...
- Publication number 20240096659
- Publication date Mar 21, 2024
- KIOXIA Corporation
- Fuyuma ITO
- H01 - BASIC ELECTRIC ELEMENTS

Physical or chemical etching of the layers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Composition, its use and a process for selectively etching silicon-...

Method for forming an upper conductive structure having multilayer...

Semiconductor structure and manufacturing method thereof

Substrate processing apparatus and substrate processing method

Wafer bonding method

Method used in forming a memory array comprising strings of memory...

Dry etching method, method for manufacturing semiconductor element,...

Semiconductor device and manufacturing method of a semiconductor de...

Fully aligned subtractive processes and electronic devices therefrom

3D NAND gate stack reinforcement

Semiconductor devices and methods of manufacturing thereof

Manufacturing method of semiconductor structure

Methods of forming interconnect structures in semiconductor fabrica...

Manufacture method of array substrate, array substrate, and display...

Method of manufacturing semiconductor devices

Ion implantation to reduce nanosheet gate length variation

Etching solution and method for selectively removing silicon nitrid...

Conductive element for semiconductor devices

Method of manufacturing a semiconductor device

Method of manufacturing semiconductor device and semiconductor devices

Sub-bitstream extraction

Combined RF generator and RF solid-state matching network

Hafnium oxide corrosion inhibitor

Forming nitrogen-containing low-K gate spacer

High voltage polysilicon gate in high-K metal gate device

Semiconductor device and method

Silicon nitride film etching composition and etching method using t...

Method for forming semiconductor device with helmet structure betwe...

Backside metal patterning die singulation systems and related methods

Embedded memory with improved fill-in window

Patents Applicationslast 30 patents

DECOUPLING CAPACITANCE IN BACKSIDE INTERCONNECT

SEMICONDUCTOR DEVICE HAVING CONTACT PLUG

Fin Field-Effect Transistor Device Having Contact Plugs with Re-Ent...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

THREE-DIMENSIONAL MEMORY DEVICE AND METHOD

PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PR...

SELF-ALIGNED ZERO TRACK SKIP

DEPOSITING A CARBON HARDMASK BY HIGH POWER PULSED LOW FREQUENCY RF

LOW-STRESS PASSIVATION LAYER

MODIFYING PATTERNED FEATURES USING A DIRECTIONAL ETCH

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

Passive Device Dies With Measurement Structures

METHOD OF FABRICATING A CAPACITOR

TUNABLE STRUCTURE PROFILE

SYSTEMS AND METHODS FOR ETCHING A HIGH ASPECT RATIO STRUCTURE

ISOTROPIC SILICON NITRIDE REMOVAL

VARIABLE SELECTIVE ETCHING TECHNOLOGY FOR THICK SOI DEVICES

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

ETCHING METHOD AND PLASMA PROCESSING SYSTEM

Semiconductor Structure Cutting Process and Structures Formed Thereby

Semiconductor Structure Cutting Process and Structures Formed Thereby

METHOD OF SINGULATION OF DIES FROM A WAFER

METHOD FOR FORMING PATTERN OF METAL OXIDE AND METHOD FOR PRODUCING...

Hard Mask Removal Method

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

PATTERN FORMING METHOD, MANUFACTURING METHOD OF SEMICONDUCTOR DEVIC...

Footing Removal in Cut-Metal Process

FILM DEPOSITION APPARATUS FOR FINE PATTERN FORMING

SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH...

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ME...