Physical vapour deposition [PVD]

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H01L2224/2745

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/2745Physical vapour deposition [PVD]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 12,205,870
- Issue date Jan 21, 2025
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition bonding layer for joining two semiconductor...
- Patent number 12,094,849
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuang-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced device assembly structures and methods
- Patent number 11,999,001
- Issue date Jun 4, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,908,829
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having silver-indium transient liquid phase...
- Patent number 11,894,284
- Issue date Feb 6, 2024
- LMDJ MANAGEMENT LLC
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,876,064
- Issue date Jan 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 11,837,568
- Issue date Dec 5, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,688,670
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip backside mechanical die grounding techniques
- Patent number 11,574,887
- Issue date Feb 7, 2023
- Texas Instruments Incorporated
- James Fred Salzman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 11,495,579
- Issue date Nov 8, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 11,488,922
- Issue date Nov 1, 2022
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silver nano-twinned thin film structure and method for forming the...
- Patent number 11,488,920
- Issue date Nov 1, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Hsing-Hua Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver-indium transient liquid phase method of bonding semiconducto...
- Patent number 11,373,925
- Issue date Jun 28, 2022
- LIGHT-MED (USA), INC.
- Yongjun Huo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit package, an electronic circuit package, and methods for enc...
- Patent number 11,189,537
- Issue date Nov 30, 2021
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 11,152,325
- Issue date Oct 19, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information handling system low form factor interface thermal manag...
- Patent number 10,985,086
- Issue date Apr 20, 2021
- Dell Products L.P.
- Travis C. North
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Back side metallization
- Patent number 10,957,669
- Issue date Mar 23, 2021
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered composite bonding materials and power electronics ass...
- Patent number 10,886,251
- Issue date Jan 5, 2021
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 10,811,388
- Issue date Oct 20, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 10,767,084
- Issue date Sep 8, 2020
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature bonding with spaced nanorods and eutectic alloys
- Patent number 10,646,964
- Issue date May 12, 2020
- Northeastern University
- Stephen Peter Stagon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,615,139
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046747
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Junyun KWEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
- Publication number 20250006687
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Zheng-Yong Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240413037
- Publication date Dec 12, 2024
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
- Publication number 20240363578
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES
- Publication number 20240321855
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...
- Publication number 20240266320
- Publication date Aug 8, 2024
- Yibu Semiconductor Co., Ltd.
- Yifan Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Die Attach with Adhesive Layer C...
- Publication number 20240194628
- Publication date Jun 13, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...
- Publication number 20240170434
- Publication date May 23, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Chien-Hsun CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240145430
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240113066
- Publication date Apr 4, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS
- Publication number 20240071927
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Shinjae Hwang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LIGHT-EMITTING DEVICE, BACKPLATE ASSEMBLY AND DISPLAY PANEL
- Publication number 20240047635
- Publication date Feb 8, 2024
- Xiamen Extremely PQ Display Technology Co., Ltd.
- Gang MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING BONDING BY HYDROPHILIC CONTRAST
- Publication number 20230420408
- Publication date Dec 28, 2023
- COMMISSARIA À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE
- Publication number 20230386959
- Publication date Nov 30, 2023
- HEFEI SMAT TECHNOLOGY CO.,LTD.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE METALLIZATION METHODS AND APPARATUS
- Publication number 20230326897
- Publication date Oct 12, 2023
- Wolfspeed, Inc.
- Daniel Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method for Fabricating a Semiconductor Pa...
- Publication number 20230290709
- Publication date Sep 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...
- Publication number 20230090030
- Publication date Mar 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20230040454
- Publication date Feb 9, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...
- Publication number 20230026052
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230005873
- Publication date Jan 5, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220344298
- Publication date Oct 27, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING STRUCTURES AND METHOD FOR FORMING THE SAME
- Publication number 20220336407
- Publication date Oct 20, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method of Forming Same
- Publication number 20220310556
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Te Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20220216178
- Publication date Jul 7, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xinsheng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure And Manufacturing Method Thereof
- Publication number 20220148990
- Publication date May 12, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE...
- Publication number 20220084903
- Publication date Mar 17, 2022
- LIGHT-MED (USA), INC.
- Yongjun HUO
- H01 - BASIC ELECTRIC ELEMENTS

Physical vapour deposition [PVD]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and method for fabricating a semiconductor pa...

Atomic layer deposition bonding layer for joining two semiconductor...

Contact and die attach metallization for silicon carbide based devi...

Advanced device assembly structures and methods

Integrated circuit package and method of forming same

Semiconductor structure having silver-indium transient liquid phase...

Semiconductor structure and manufacturing method thereof

Electronic device with multi-layer contact and system

Seal ring structures and methods of forming same

Bonding structures and methods for forming the same

Semiconductor package and method for fabricating a semiconductor pa...

Flip chip backside mechanical die grounding techniques

Capacitive coupling in a direct-bonded interface for microelectroni...

Back side metallization

Silver nano-twinned thin film structure and method for forming the...

Silver-indium transient liquid phase method of bonding semiconducto...

Seal ring structures and methods of forming same

Circuit package, an electronic circuit package, and methods for enc...

Enhanced adhesive materials and processes for 3D applications

Contact and die attach metallization for silicon carbide based devi...

Information handling system low form factor interface thermal manag...

Back side metallization

Multi-layered composite bonding materials and power electronics ass...

Dam for three-dimensional integrated circuit

Contact structures with porous networks for solder connections, and...

Capacitive coupling in a direct-bonded interface for microelectroni...

Enhanced adhesive materials and processes for 3D applications

Seal ring structures and methods of forming same

Low-temperature bonding with spaced nanorods and eutectic alloys

Semiconductor device including built-in crack-arresting film structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

Advanced Device Assembly Structures And Methods

HEAT DISSIPATION IN SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE

ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...

BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INT...

Semiconductor Device and Method of Die Attach with Adhesive Layer C...

BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ELECTRONIC DEVICE

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS

LIGHT-EMITTING DEVICE, BACKPLATE ASSEMBLY AND DISPLAY PANEL

SELF-ALIGNING BONDING BY HYDROPHILIC CONTRAST

CHIP HEAT DISSIPATING STRUCTURE, PROCESS AND SEMICONDUCTOR DEVICE

DIE BACKSIDE METALLIZATION METHODS AND APPARATUS

Semiconductor Package and Method for Fabricating a Semiconductor Pa...

NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

ATOMIC LAYER DEPOSITION BONDING LAYER FOR JOINING TWO SEMICONDUCTOR...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

BONDING STRUCTURES AND METHODS FOR FORMING THE SAME

DIE BONDING STRUCTURES AND METHOD FOR FORMING THE SAME

Integrated Circuit Package and Method of Forming Same

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

Semiconductor Structure And Manufacturing Method Thereof

Advanced Device Assembly Structures And Methods

SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE...