Physical vapour deposition [PVD]

Industry

CPC
H01L2224/43826

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/43826Physical vapour deposition [PVD]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
- Patent number 12,087,724
- Issue date Sep 10, 2024
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,840,208
- Issue date Nov 17, 2020
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,121,758
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 9,887,172
- Issue date Feb 6, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Semiconductor device with a layer including niobium, and/or tantalu...
- Patent number 8,836,120
- Issue date Sep 16, 2014
- Infineon Technologies AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting wire and method for manufacturing same
- Patent number 8,450,611
- Issue date May 28, 2013
- Heraeus Materials Technology GmbH & Co. KG
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding structure and method for forming same
- Patent number 8,247,911
- Issue date Aug 21, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,903,440
- Issue date Jun 7, 2005
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component of a high frequency current suppression type a...
- Patent number 6,635,961
- Issue date Oct 21, 2003
- NEC Tokin Corp.
- Shigeyoshi Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical conductor
- Patent number 4,859,811
- Issue date Aug 22, 1989
- Sumitomo Electric Industries, Ltd.
- Kazuo Sawada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing an electrical conductor
- Patent number 4,815,309
- Issue date Mar 28, 1989
- Sumitomo Electric Industries, Ltd.
- Kazuo Sawada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240297142
- Publication date Sep 5, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240006354
- Publication date Jan 4, 2024
- RENESAS ELECTRONICS CORPORATION
- Shota OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20210280553
- Publication date Sep 9, 2021
- TANAKA DENSHI KOGYO K.K.
- Hiroyuki AMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180122765
- Publication date May 3, 2018
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170194280
- Publication date Jul 6, 2017
- Nippon Micrometal Corporation
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE FOR BONDING APPLICATIONS
- Publication number 20150360316
- Publication date Dec 17, 2015
- Heraeus Deutschland GmbH & Co. KG
- Eugen MILKE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CORE-JACKET BONDING WIRE
- Publication number 20130213689
- Publication date Aug 22, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Semiconductor Device and Bonding Wire
- Publication number 20120267784
- Publication date Oct 25, 2012
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME
- Publication number 20100213619
- Publication date Aug 26, 2010
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME
- Publication number 20100108359
- Publication date May 6, 2010
- Rainer Dohle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer bonding ribbon
- Publication number 20070290373
- Publication date Dec 20, 2007
- Manfred Reinold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS
- Publication number 20070284415
- Publication date Dec 13, 2007
- INFINEON TECHNOLOGIES AG
- Khalil Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structure of IC packaging and method forming the same
- Publication number 20070057351
- Publication date Mar 15, 2007
- SILICON INTEGRATED SYSTEMS CORP.
- Chih-Tai Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Arrangement for wire bonding and method for producing a bonding con...
- Publication number 20050150932
- Publication date Jul 14, 2005
- Khalil Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20040188833
- Publication date Sep 30, 2004
- Shigeyoshi Yoshida
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor package having oxidation-free copper wire
- Publication number 20030173659
- Publication date Sep 18, 2003
- Fairchild Korea Semiconductor Ltd.
- Sang-do Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component of a high frequency current suppression type a...
- Publication number 20010026016
- Publication date Oct 4, 2001
- Shigeyoshi Yoshida
- H01 - BASIC ELECTRIC ELEMENTS

Physical vapour deposition [PVD]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Palladium-coated copper bonding wire and method for manufacturing same

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding structure of bonding wire

Core-jacket bonding wire

Semiconductor device with a layer including niobium, and/or tantalu...

Connecting wire and method for manufacturing same

Wire bonding structure and method for forming same

Electronic component of a high frequency current suppression type a...

Electronic component of a high frequency current suppression type a...

Electrical conductor

Method of producing an electrical conductor

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COATED WIRE FOR BONDING APPLICATIONS

CORE-JACKET BONDING WIRE

Semiconductor Device and Bonding Wire

BONDING STRUCTURE OF BONDING WIRE

BONDING STRUCTURE OF BONDING WIRE AND METHOD FOR FORMING SAME

CONNECTING WIRE AND METHOD FOR MANUFACTURING SAME

Multilayer bonding ribbon

SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS

Structure of IC packaging and method forming the same

Arrangement for wire bonding and method for producing a bonding con...

Electronic component of a high frequency current suppression type a...

Semiconductor package having oxidation-free copper wire

Electronic component of a high frequency current suppression type a...