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Piezoelectric transducers

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  • CPC
  • H01L2224/78347
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78347Piezoelectric transducers
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    TRANSFER PRINTING USING ULTRASOUND
    • Publication number 20180358246
    • Publication date Dec 13, 2018
    • Innovasonic, Inc.
    • Boris Kobrin
    • B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
  • Information Patent Application

    Capillary and ultrasonic transducer for ultrasonic bonding
    • Publication number 20120037687
    • Publication date Feb 16, 2012
    • FUJITSU LIMITED
    • Takayoshi Matsumura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Flange-mounted transducer
    • Publication number 20050284912
    • Publication date Dec 29, 2005
    • ASM Technology Singapore Pte Ltd
    • Bao Nian Zhai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonding method and apparatus
    • Publication number 20050184131
    • Publication date Aug 25, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Yutaka Kondo
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Novel ultrasonic vibration mode for wire bonding
    • Publication number 20020096554
    • Publication date Jul 25, 2002
    • Micron Technology, Inc.
    • Tongbi Jiang
    • H01 - BASIC ELECTRIC ELEMENTS