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H01L2224/78803

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/78803Pivoting mechanism

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Patents Grantslast 30 patents

Information Patent Grant
Bonding process with rotating bonding stage
- Patent number 11,273,515
- Issue date Mar 15, 2022
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus with rotating bonding stage
- Patent number 11,173,567
- Issue date Nov 16, 2021
- KAIJO CORPORATION
- Yuji Komagino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Y-theta table for semiconductor equipment
- Patent number 11,121,115
- Issue date Sep 14, 2021
- ASM Technology Singapore Pte. Ltd.
- Jan Van Eijk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method
- Patent number 10,600,754
- Issue date Mar 24, 2020
- Kaijo Corporation
- Hideki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method, semiconductor device, an...
- Patent number 9,887,174
- Issue date Feb 6, 2018
- Shinkawa Ltd.
- Naoki Sekine
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS, BONDING METHOD AND BONDING CONTROL PROGRAM
- Publication number 20200238433
- Publication date Jul 30, 2020
- KAIJO CORPORATION
- Yuji KOMAGINO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Y-THETA TABLE FOR SEMICONDUCTOR EQUIPMENT
- Publication number 20200098722
- Publication date Mar 26, 2020
- ASM Technology Singapore Pte Ltd
- Jan VAN EIJK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20190164928
- Publication date May 30, 2019
- KAIJO CORPORATION
- Hideki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AN...
- Publication number 20160358880
- Publication date Dec 8, 2016
- SHINKAWA LTD.
- Naoki SEKINE
- H01 - BASIC ELECTRIC ELEMENTS