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H01L2224/75803

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75803Pivoting mechanism

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding method
- Patent number 10,600,754
- Issue date Mar 24, 2020
- Kaijo Corporation
- Hideki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding machines for bonding semiconductor elements, methods of ope...
- Patent number 10,468,373
- Issue date Nov 5, 2019
- Kulicke and Sofia Industries, Inc.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding machines for bonding semiconductor elements, methods of ope...
- Patent number 9,929,121
- Issue date Mar 27, 2018
- Kulicke and Soffa Industries, Inc.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Member bonding apparatus and method
- Patent number 9,809,017
- Issue date Nov 7, 2017
- ORIGIN ELECTRIC COMPANY, LIMITED
- Takuto Yamashita
- G02 - OPTICS
Information Patent Grant
Bonding method, bonding apparatus, and method for manufacturing sub...
- Patent number 9,640,507
- Issue date May 2, 2017
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding tool cooling apparatus and method for cooling bonding tool
- Patent number 9,576,927
- Issue date Feb 21, 2017
- Shinkawa Ltd.
- Osamu Kakutani
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240128229
- Publication date Apr 18, 2024
- Samsung Electronics Co., LTD
- Byungkeun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD
- Publication number 20190164928
- Publication date May 30, 2019
- KAIJO CORPORATION
- Hideki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...
- Publication number 20180174997
- Publication date Jun 21, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPE...
- Publication number 20170062378
- Publication date Mar 2, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Thomas J. Colosimo
- H01 - BASIC ELECTRIC ELEMENTS