Pivoting mechanism

Industry

CPC
H01L2224/75823

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75823Pivoting mechanism

Industries

Patents Grantslast 30 patents

Information Patent Grant
Die bonder incorporating rotatable adhesive dispenser head
- Patent number 11,289,445
- Issue date Mar 29, 2022
- ASM Technology Singapore Pte. Ltd.
- Wan Yin Yau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component handling device for removing components from a structured...
- Patent number 11,232,961
- Issue date Jan 25, 2022
- Muehlbauer GmbH & Co. KG
- Henri Junker
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Component handling system
- Patent number 10,804,123
- Issue date Oct 13, 2020
- Muehlbauer GmbH & Co. KG
- Henri Junker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for correcting a parallelism between a bonding head and a...
- Patent number 10,692,833
- Issue date Jun 23, 2020
- Samsung Electronics Co., Ltd.
- Jae-Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiving system for components
- Patent number 10,529,601
- Issue date Jan 7, 2020
- Muehlbauer GmbH & Co. KG
- Konstantin Koch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component bonding device and electronic component mounter
- Patent number 10,462,950
- Issue date Oct 29, 2019
- FUJI CORPORATION
- Masaki Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for self-adjustment of a component-handling devic...
- Patent number 10,347,514
- Issue date Jul 9, 2019
- Muehlbauer GmbH & Co. KG
- Konstantin Koch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for automatic bond arm alignment
- Patent number 10,050,008
- Issue date Aug 14, 2018
- ASM Technology Singapore Pte. Ltd.
- Shui Cheung Woo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mass transfer tool manipulator assembly
- Patent number 10,022,859
- Issue date Jul 17, 2018
- Apple Inc.
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding apparatus, and method for manufacturing sub...
- Patent number 9,640,507
- Issue date May 2, 2017
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer tool manipulator assembly
- Patent number 9,308,649
- Issue date Apr 12, 2016
- LuxVue Techonology Corporation
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Pressure transmitting device for bonding chips onto a substrate
- Patent number 9,305,813
- Issue date Apr 5, 2016
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjustable pick-up head and method for manufacturing a device
- Patent number 9,196,521
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Abdul Rahman Mohamed
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for parallel alignment of a chip to substrate
- Patent number 6,146,912
- Issue date Nov 14, 2000
- TRW Inc.
- Thomas S. Tighe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment device
- Patent number 4,875,614
- Issue date Oct 24, 1989
- International Business Machines Corporation
- Thomas M. Cipolla
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Actuator for a Bonding Head
- Publication number 20210272925
- Publication date Sep 2, 2021
- BESI Switzerland AG
- Markus Aebischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDER INCORPORATING ROTATABLE ADHESIVE DISPENSER HEAD
- Publication number 20200203305
- Publication date Jun 25, 2020
- ASM Technology Singapore Pte Ltd
- Wan Yin YAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT HANDLING DEVICE FOR REMOVING COMPONENTS FROM A STRUCTURED...
- Publication number 20200035521
- Publication date Jan 30, 2020
- Muehlbauer GmbH & Co. KG
- Henri Junker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT HANDLING SYSTEM
- Publication number 20180308727
- Publication date Oct 25, 2018
- Henri Junker
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
APPARATUS FOR CORRECTING A PARALLELISM BETWEEN A BONDING HEAD AND A...
- Publication number 20180102340
- Publication date Apr 12, 2018
- Samsung Electronics Co., Ltd.
- Jae-Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Apparatus For Mounting Electronic Or Optical Components...
- Publication number 20140311652
- Publication date Oct 23, 2014
- Besi Switzerland AG
- Hannes Kostner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mass Transfer Tool Manipulator Assembly
- Publication number 20140241843
- Publication date Aug 28, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Adjustable Pick-up Head and Method for Manufacturing a Device
- Publication number 20140123454
- Publication date May 8, 2014
- INFINEON TECHNOLOGIES AG
- Abdul Rahman Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSE...
- Publication number 20130149817
- Publication date Jun 13, 2013
- Samsung Electronics Co., Ltd.
- Chang-Seong JEON
- H01 - BASIC ELECTRIC ELEMENTS

Pivoting mechanism

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die bonder incorporating rotatable adhesive dispenser head

Component handling device for removing components from a structured...

Component handling system

Apparatus for correcting a parallelism between a bonding head and a...

Receiving system for components

Electronic component bonding device and electronic component mounter

Device and method for self-adjustment of a component-handling devic...

Method and system for automatic bond arm alignment

Mass transfer tool manipulator assembly

Bonding method, storage medium, bonding apparatus and bonding system

Bonding method, bonding apparatus, and method for manufacturing sub...

Mass transfer tool manipulator assembly

Pressure transmitting device for bonding chips onto a substrate

Adjustable pick-up head and method for manufacturing a device

Method for parallel alignment of a chip to substrate

Alignment device

Patents Applicationslast 30 patents

Actuator for a Bonding Head

DIE BONDER INCORPORATING ROTATABLE ADHESIVE DISPENSER HEAD

COMPONENT HANDLING DEVICE FOR REMOVING COMPONENTS FROM A STRUCTURED...

COMPONENT HANDLING SYSTEM

APPARATUS FOR CORRECTING A PARALLELISM BETWEEN A BONDING HEAD AND A...

Method And Apparatus For Mounting Electronic Or Optical Components...

Mass Transfer Tool Manipulator Assembly

Adjustable Pick-up Head and Method for Manufacturing a Device

FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSE...