Plasma being used non-continuously during the ALD reactions

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CPC
C23C16/45542

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CCHEMISTRY METALLURGY C23Surface treatment C23CCOATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating

Current Industry

C23C16/45542Plasma being used non-continuously during the ALD reactions

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Patents Grantslast 30 patents

Information Patent Grant
Method of depositing silicon oxide films
- Patent number 12,188,121
- Issue date Jan 7, 2025
- ASM Genitech Korea Ltd.
- Tae Ho Yoon
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Thermal atomic layer deposition of silicon-containing films
- Patent number 12,157,945
- Issue date Dec 3, 2024
- Lam Research Corporation
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
PEALD nitride films
- Patent number 12,119,221
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Hanhong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Variable cycle and time RF activation method for film thickness mat...
- Patent number 12,077,859
- Issue date Sep 3, 2024
- Lam Research Corporation
- Ishtak Karim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma atomic layer deposition
- Patent number 12,077,864
- Issue date Sep 3, 2024
- ASM IP Holding B.V.
- Harm C. M. Knoops
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma resistant process chamber lid
- Patent number 12,049,696
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Xiaowei Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin oxide thin film spacers in semiconductor device manufacturing
- Patent number 12,051,589
- Issue date Jul 30, 2024
- Lam Research Corporation
- David Charles Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,037,677
- Issue date Jul 16, 2024
- Kokusai Electric Corporation
- Ryuji Yamamoto
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Method of manufacturing semiconductor device, substrate processing...
- Patent number 12,040,179
- Issue date Jul 16, 2024
- Kokusai Electric Corporation
- Takaaki Noda
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Information Patent Grant
Method for etching an etch layer
- Patent number 12,020,944
- Issue date Jun 25, 2024
- Lam Research Corporation
- Nikhil Dole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film-forming method, manufacturing method of electronic device, and...
- Patent number 12,009,183
- Issue date Jun 11, 2024
- The Japan Steel Works, Ltd.
- Keisuke Washio
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon precursors for silicon nitride deposition
- Patent number 11,996,286
- Issue date May 28, 2024
- ASM IP Holding B.V.
- Charles Dezelah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a gap-fill layer by plasma-assisted deposition
- Patent number 11,972,944
- Issue date Apr 30, 2024
- ASM IP Holding B.V.
- Timothee Julien Vincent Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,959,167
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Deposition method
- Patent number 11,952,661
- Issue date Apr 9, 2024
- Tokyo Electron Limited
- Hitoshi Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature deposition of iridium containing films
- Patent number 11,946,135
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Feng Q. Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microwave plasma source, microwave plasma processing apparatus and...
- Patent number 11,942,308
- Issue date Mar 26, 2024
- Tokyo Electron Limited
- Yasuaki Taniike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage, low pressure plasma enhanced atomic layer deposition
- Patent number 11,935,759
- Issue date Mar 19, 2024
- Lotus Applied Technology, LLC
- Eric R. Dickey
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Method for depositing silicon-free carbon-containing film as gap-fi...
- Patent number 11,923,190
- Issue date Mar 5, 2024
- ASM IP Holding B.V.
- Timothee Julien Vincent Blanquart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Film forming method and film forming apparatus
- Patent number 11,915,914
- Issue date Feb 27, 2024
- Tokyo Electron Limited
- Sena Fujita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Si-containing film forming precursors and methods of using the same
- Patent number 11,820,654
- Issue date Nov 21, 2023
- L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GE...
- Jean-Marc Girard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Processing apparatus and processing method
- Patent number 11,781,219
- Issue date Oct 10, 2023
- Tokyo Electron Limited
- Kazuo Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin oxide thin film spacers in semiconductor device manufacturing
- Patent number 11,784,047
- Issue date Oct 10, 2023
- Lam Research Corporation
- David Charles Smith
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma enhanced deposition processes for controlled formation of ox...
- Patent number 11,776,807
- Issue date Oct 3, 2023
- ASM IP Holding, B.V.
- Lingyun Jia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer encapsulation stacks by atomic layer deposition
- Patent number 11,732,356
- Issue date Aug 22, 2023
- Applied Materials, Inc.
- Cong Trinh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for depositing a conformal metal or metalloid silicon nitri...
- Patent number 11,732,351
- Issue date Aug 22, 2023
- VERSUM MATERIALS US, LLC
- Xinjian Lei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming metal silicon oxide and metal silicon oxynitride...
- Patent number 11,725,280
- Issue date Aug 15, 2023
- ASM IP Holding B.V.
- Takashi Yoshida
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Selective PEALD of oxide on dielectric
- Patent number 11,728,164
- Issue date Aug 15, 2023
- ASM IP Holding B.V.
- Eva Tois
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Low-k films
- Patent number 11,713,507
- Issue date Aug 1, 2023
- Applied Materials, Inc.
- Shuaidi Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trisilylamine derivatives as precursors for high growth rate silico...
- Patent number 11,702,743
- Issue date Jul 18, 2023
- VERSUM MATERIALS US, LLC
- Xinjian Lei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN
- Publication number 20240379347
- Publication date Nov 14, 2024
- ASM IP HOLDING B.V.
- Mikko Ruoho
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FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20240371631
- Publication date Nov 7, 2024
- TOKYO ELECTRON LIMITED
- Munehito KAGAYA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS
- Publication number 20240363337
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Muthukumar Kaliappan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD FOR AN AMORPHOUS BORON NITRIDE LAYER AND ASSOCIATED AMORPHOU...
- Publication number 20240327982
- Publication date Oct 3, 2024
- ASM IP HOLDING B.V.
- Gaurav Pathak
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR REDUCING INCUBATION PERIOD OF SILICON NITRIDE LAYER DEPO...
- Publication number 20240318311
- Publication date Sep 26, 2024
- ASM IP HOLDING B.V.
- Agung Setiadi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR ETCHING AN ETCH LAYER
- Publication number 20240297050
- Publication date Sep 5, 2024
- LAM RESEARCH CORPORATION
- Nikhil Dole
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICON PRECURSORS FOR SILICON NITRIDE DEPOSITION
- Publication number 20240297039
- Publication date Sep 5, 2024
- ASM IP HOLDING B.V.
- Charles Dezelah
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240287671
- Publication date Aug 29, 2024
- Kokusai Electric Corporation
- Ryuji YAMAMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20240274433
- Publication date Aug 15, 2024
- TOKYO ELECTRON LIMITED
- Tsuyoshi TSUNATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING DIELECTRIC MATERIAL LAYER USING PLASMA
- Publication number 20240271280
- Publication date Aug 15, 2024
- ASM IP HOLDING B.V.
- Yoshio Susa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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ELECTRON-ENHANCED ATOMIC LAYER DEPOSITION (EE-ALD) METHODS AND DEVI...
- Publication number 20240240317
- Publication date Jul 18, 2024
- The Regents of the University of Colorado, a Body Corporate
- Steven George
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND SYSTEM FOR DEPOSITING BORON CARBON NITRIDE
- Publication number 20240222115
- Publication date Jul 4, 2024
- ASM IP HOLDING B.V.
- Antti Niskanen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE COBALT DEPOSITION ON COPPER SURFACES
- Publication number 20240218503
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Sang-Ho YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING AND UTILIZING ANTIMONY CONTAINING FILMS, AND RE...
- Publication number 20240218510
- Publication date Jul 4, 2024
- ASM IP HOLDING B.V.
- Paul Chatelain
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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LOW TEMPERATURE DEPOSITION OF IRIDIUM CONTAINING FILMS
- Publication number 20240200188
- Publication date Jun 20, 2024
- Applied Materials, Inc.
- Feng Q. Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20240030031
- Publication date Jan 25, 2024
- LAM RESEARCH CORPORATION
- David Charles Smith
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DEVICE INCLUDING TRANSPARENT POLYMER WITH HYDROPHILIC COATING, AND...
- Publication number 20230399744
- Publication date Dec 14, 2023
- Agilent Technologies, Inc.
- Elizabeth CARR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD AND SYSTEM FOR FORMING METAL SILICON OXIDE AND METAL SILICON...
- Publication number 20230349043
- Publication date Nov 2, 2023
- ASM IP HOLDING B.V.
- Takashi Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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ULTRATHIN ATOMIC LAYER DEPOSITION FILM ACCURACY THICKNESS CONTROL
- Publication number 20230298884
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Jun Qian
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW TEMPERATURE DEPOSITION OF IRIDIUM CONTAINING FILMS
- Publication number 20230227968
- Publication date Jul 20, 2023
- Applied Materials, Inc.
- Feng Q. Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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PEALD Nitride Films
- Publication number 20230230830
- Publication date Jul 20, 2023
- Applied Materials, Inc.
- Hanhong Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHODS FOR DEPOSITING GAP-FILLING FLUIDS AND RELATED SYSTEMS AND D...
- Publication number 20230212744
- Publication date Jul 6, 2023
- ASM IP HOLDING, B.V.
- René Henricus Jozef Vervuurt
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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METHOD AND APPARATUS FOR FILLING A GAP
- Publication number 20230207309
- Publication date Jun 29, 2023
- ASM IP HOLDING B.V.
- Viljami PORE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Semiconductor Device and Method of Manufacture
- Publication number 20230197524
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yi Lee
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SEAM MITIGATION AND INTEGRATED LINER FOR GAP FILL
- Publication number 20230175117
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Dustin Zachary AUSTIN
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LOSS PREVENTION DURING ATOMIC LAYER DEPOSITION
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- Publication date May 18, 2023
- LAM RESEARCH CORPORATION
- Jason Alexander VARNELL
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Methods For Atomic Layer Deposition Of SiCO(N) Using Halogenated Si...
- Publication number 20230090196
- Publication date Mar 23, 2023
- Applied Materials, Inc.
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METHOD FOR DEPOSITING A GAP-FILL LAYER BY PLASMA-ASSISTED DEPOSITION
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Plasma Resistant YxHfyOz Homogeneous Films and Methods of Film Prod...
- Publication number 20230044068
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IN-SITU PECVD CAP LAYER
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- Publication date Jan 5, 2023
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- Jeremy David FIELDS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Plasma being used non-continuously during the ALD reactions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of depositing silicon oxide films

Thermal atomic layer deposition of silicon-containing films

PEALD nitride films

Variable cycle and time RF activation method for film thickness mat...

Plasma atomic layer deposition

Plasma resistant process chamber lid

Tin oxide thin film spacers in semiconductor device manufacturing

Method of manufacturing semiconductor device, substrate processing...

Method of manufacturing semiconductor device, substrate processing...

Method for etching an etch layer

Film-forming method, manufacturing method of electronic device, and...

Silicon precursors for silicon nitride deposition

Method for depositing a gap-fill layer by plasma-assisted deposition

Selective cobalt deposition on copper surfaces

Deposition method

Low temperature deposition of iridium containing films

Microwave plasma source, microwave plasma processing apparatus and...

High voltage, low pressure plasma enhanced atomic layer deposition

Method for depositing silicon-free carbon-containing film as gap-fi...

Film forming method and film forming apparatus

Si-containing film forming precursors and methods of using the same

Processing apparatus and processing method

Tin oxide thin film spacers in semiconductor device manufacturing

Plasma enhanced deposition processes for controlled formation of ox...

Multilayer encapsulation stacks by atomic layer deposition

Methods for depositing a conformal metal or metalloid silicon nitri...

Method for forming metal silicon oxide and metal silicon oxynitride...

Selective PEALD of oxide on dielectric

Low-k films

Trisilylamine derivatives as precursors for high growth rate silico...

Patents Applicationslast 30 patents

SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN

FILM FORMING METHOD AND FILM FORMING APPARATUS

METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS

METHOD FOR AN AMORPHOUS BORON NITRIDE LAYER AND ASSOCIATED AMORPHOU...

METHOD FOR REDUCING INCUBATION PERIOD OF SILICON NITRIDE LAYER DEPO...

METHOD FOR ETCHING AN ETCH LAYER

SILICON PRECURSORS FOR SILICON NITRIDE DEPOSITION

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD OF FORMING DIELECTRIC MATERIAL LAYER USING PLASMA

ELECTRON-ENHANCED ATOMIC LAYER DEPOSITION (EE-ALD) METHODS AND DEVI...

METHOD AND SYSTEM FOR DEPOSITING BORON CARBON NITRIDE

SELECTIVE COBALT DEPOSITION ON COPPER SURFACES

METHODS FOR FORMING AND UTILIZING ANTIMONY CONTAINING FILMS, AND RE...

LOW TEMPERATURE DEPOSITION OF IRIDIUM CONTAINING FILMS

TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING

DEVICE INCLUDING TRANSPARENT POLYMER WITH HYDROPHILIC COATING, AND...

METHOD AND SYSTEM FOR FORMING METAL SILICON OXIDE AND METAL SILICON...

ULTRATHIN ATOMIC LAYER DEPOSITION FILM ACCURACY THICKNESS CONTROL

LOW TEMPERATURE DEPOSITION OF IRIDIUM CONTAINING FILMS

PEALD Nitride Films

METHODS FOR DEPOSITING GAP-FILLING FLUIDS AND RELATED SYSTEMS AND D...

METHOD AND APPARATUS FOR FILLING A GAP

Semiconductor Device and Method of Manufacture

SEAM MITIGATION AND INTEGRATED LINER FOR GAP FILL

LOSS PREVENTION DURING ATOMIC LAYER DEPOSITION

Methods For Atomic Layer Deposition Of SiCO(N) Using Halogenated Si...

METHOD FOR DEPOSITING A GAP-FILL LAYER BY PLASMA-ASSISTED DEPOSITION

Plasma Resistant YxHfyOz Homogeneous Films and Methods of Film Prod...

IN-SITU PECVD CAP LAYER