Plasma being used non-continuously during the ALD reactions

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CPC
C23C16/45542

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CCHEMISTRY METALLURGY C23Surface treatment C23CCOATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating

Current Industry

C23C16/45542Plasma being used non-continuously during the ALD reactions

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for forming a silicon oxycarbide layer and struct...
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Methods and apparatus for low temperature silicon nitride films
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ALD PULSE SEQUENCE ENGINEERING FOR IMPROVED CONFORMALITY FOR LOW TE...
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CONFORMAL DEPOSITION OF SILICON NITRIDE
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SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN
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SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
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METHOD OF FORMING DIELECTRIC MATERIAL LAYER USING PLASMA
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Plasma being used non-continuously during the ALD reactions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and system for forming a silicon oxycarbide layer and struct...

Methods and apparatus for low temperature silicon nitride films

Ultrathin atomic layer deposition film accuracy thickness control

Remote plasma ultraviolet enhanced deposition

Thin film deposition process

Substrate processing method and substrate processing device

Method for forming metal silicon oxide and metal silicon oxynitride...

Methods of forming phosphosilicate glass layers, structures formed...

Plasma-enhanced atomic layer deposition with radio-frequency power...

In-situ PECVD cap layer

Zone-controlled rare-earth oxide ALD and CVD coatings

Method of depositing silicon oxide films

Thermal atomic layer deposition of silicon-containing films

PEALD nitride films

Variable cycle and time RF activation method for film thickness mat...

Plasma atomic layer deposition

Plasma resistant process chamber lid

Tin oxide thin film spacers in semiconductor device manufacturing

Method of manufacturing semiconductor device, substrate processing...

Method of manufacturing semiconductor device, substrate processing...

Method for etching an etch layer

Film-forming method, manufacturing method of electronic device, and...

Silicon precursors for silicon nitride deposition

Method for depositing a gap-fill layer by plasma-assisted deposition

Selective cobalt deposition on copper surfaces

Deposition method

Low temperature deposition of iridium containing films

Microwave plasma source, microwave plasma processing apparatus and...

High voltage, low pressure plasma enhanced atomic layer deposition

Method for depositing silicon-free carbon-containing film as gap-fi...

Patents Applicationslast 30 patents

PLASMA-ENHANCED ATOMIC LAYER DEPOSITION WITH RADIO-FREQUENCY POWER...

HALIDE-FUNCTIONALIZED CYCLOTRISILAZANES AS PRECURSORS FOR DEPOSITIO...

FILM-FORMING METHOD AND FILM-FORMING APPARATUS

ALD PULSE SEQUENCE ENGINEERING FOR IMPROVED CONFORMALITY FOR LOW TE...

CONFORMAL DEPOSITION OF SILICON NITRIDE

SELECTIVE DEPOSITION OF A MATERIAL COMPRISING SILICON AND NITROGEN

FILM FORMING METHOD AND FILM FORMING APPARATUS

METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS

METHOD FOR AN AMORPHOUS BORON NITRIDE LAYER AND ASSOCIATED AMORPHOU...

METHOD FOR REDUCING INCUBATION PERIOD OF SILICON NITRIDE LAYER DEPO...

METHOD FOR ETCHING AN ETCH LAYER

SILICON PRECURSORS FOR SILICON NITRIDE DEPOSITION

METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCT...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD OF FORMING DIELECTRIC MATERIAL LAYER USING PLASMA

ELECTRON-ENHANCED ATOMIC LAYER DEPOSITION (EE-ALD) METHODS AND DEVI...

METHOD AND SYSTEM FOR DEPOSITING BORON CARBON NITRIDE

SELECTIVE COBALT DEPOSITION ON COPPER SURFACES

METHODS FOR FORMING AND UTILIZING ANTIMONY CONTAINING FILMS, AND RE...

LOW TEMPERATURE DEPOSITION OF IRIDIUM CONTAINING FILMS

TIN OXIDE THIN FILM SPACERS IN SEMICONDUCTOR DEVICE MANUFACTURING

DEVICE INCLUDING TRANSPARENT POLYMER WITH HYDROPHILIC COATING, AND...

METHOD AND SYSTEM FOR FORMING METAL SILICON OXIDE AND METAL SILICON...

ULTRATHIN ATOMIC LAYER DEPOSITION FILM ACCURACY THICKNESS CONTROL

LOW TEMPERATURE DEPOSITION OF IRIDIUM CONTAINING FILMS

PEALD Nitride Films

METHODS FOR DEPOSITING GAP-FILLING FLUIDS AND RELATED SYSTEMS AND D...

METHOD AND APPARATUS FOR FILLING A GAP

Semiconductor Device and Method of Manufacture

SEAM MITIGATION AND INTEGRATED LINER FOR GAP FILL